公开(公告)号：US06777642B2

公开(公告)日：2004-08-17

申请号：US10338975

申请日：2003-01-09

申请人： Wendong Song ,  Minghui Hong ,  Boris Lukiyanchuk

发明人： Wendong Song ,  Minghui Hong ,  Boris Lukiyanchuk

IPC分类号： B23K2600

CPC分类号： H01L21/67051 ,  B08B7/0042 ,  G11B23/505

摘要： This invention relates to a method and apparatus for cleaning solid surfaces like Si substrate, disk or magnetic head slider where contaminants, including organic contaminants, especially particles in the micron or sub-micron scale are effectively remove from the solid surfaces. The invention achieves this by generating a strong laser-induced liquid jet and shock wave near the solid surfaces immersed in liquid. The liquid is a solution of water and other solvents to help reduce adhesion force and enhance cleaning efficiency.

摘要翻译： 本发明涉及一种用于清洁固体表面的方法和设备，如Si衬底，盘或磁头滑块，其中污染物（包括有机污染物，特别是微米或亚微米级的颗粒）有效地从固体表面除去。 本发明通过在浸在液体中的固体表面附近产生强烈的激光诱导液体射流和冲击波来实现。 液体是水和其他溶剂的溶液，有助于降低粘附力并提高清洁效率。

公开(公告)号：US06835319B2

公开(公告)日：2004-12-28

申请号：US10078382

申请日：2002-02-21

申请人： Wen Dong Song ,  Minghui Hong ,  Yong Feng Lu

发明人： Wen Dong Song ,  Minghui Hong ,  Yong Feng Lu

IPC分类号： H01L21302

CPC分类号： C03C17/23 ,  B23K26/1224 ,  B23K26/146 ,  B23K2101/40 ,  C03C2217/211 ,  C03C2217/215 ,  C03C2217/231 ,  C03C2218/33 ,  H01L21/30604 ,  H01L21/31111

摘要： A method of patterning a substrate includes forming a liquid film on the substrate surface and directing laser energy from a laser through the film to etch the substrate surface. Etched material is carried away from the substrate surface via evaporation of the film during the etching. The liquid film may be formed on the substrate surface by jetting a liquid vapor onto the substrate.

摘要翻译： 图案化衬底的方法包括在衬底表面上形成液膜并将来自激光器的激光能量引导通过膜以蚀刻衬底表面。 在蚀刻期间通过膜的蒸发将蚀刻的材料从衬底表面带走。 液体膜可以通过将液体蒸气喷射到基板上而形成在基板表面上。

公开(公告)号：US06753500B2

公开(公告)日：2004-06-22

申请号：US10078720

申请日：2002-02-19

申请人： Kaidong Ye ,  Chengwu An ,  Minghui Hong ,  Yongfeng Lu

发明人： Kaidong Ye ,  Chengwu An ,  Minghui Hong ,  Yongfeng Lu

IPC分类号： B23K2600

CPC分类号： H01L21/78 ,  B23K26/0853 ,  B23K26/38 ,  B23K2101/40

摘要： The invention relates to a method and apparatus for cutting a substrate using laser irradiation. A laser beam is scanned over a substrate. The beam ablates a first layer of the substrate. The beam is then refocused onto the newly revealed second layer and a further pass is performed. The process is repeated until complete separation occurs. The method and apparatus are particularly suitable for singulation of IC packages.

摘要翻译： 本发明涉及一种使用激光照射切割基板的方法和装置。 在衬底上扫描激光束。 光束消融基片的第一层。 然后将光束重新聚焦到新露出的第二层上，并进行另一遍。 重复该过程直到发生完全分离。 该方法和装置特别适用于IC封装的分离。

公开(公告)号：US20050082266A1

公开(公告)日：2005-04-21

申请号：US10902897

申请日：2004-07-29

申请人： Wen Song ,  Minghui Hong ,  Chengwu An ,  Yong Lu

发明人： Wen Song ,  Minghui Hong ,  Chengwu An ,  Yong Lu

IPC分类号： B08B7/00 ,  B23K26/00 ,  B23K26/06 ,  H01L21/00

CPC分类号： B08B7/0042 ,  B23K26/0624 ,  B23K26/351 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/67144

摘要： This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.

摘要翻译： 本发明涉及一种通过激光照射对集成电路（IC）封装进行消融的方法和装置。 该方法和装置包括两个激光扫描闪光区域，用于进行去抖动操作。 CO 2激光器用于去除闪光的顶层，并且使用YAG激光器去除CO 2激光束缚后残留的薄层。 CO 2激光束缚和随后的YAG激光束缚可以有效地去除闪光，并避免散热片以及IC封装中的引线和棒的损坏。

公开(公告)号：US07170029B2

公开(公告)日：2007-01-30

申请号：US10902897

申请日：2004-07-29

申请人： Wen Dong Song ,  Minghui Hong ,  Chengwu An ,  Yong Feng Lu

发明人： Wen Dong Song ,  Minghui Hong ,  Chengwu An ,  Yong Feng Lu

IPC分类号： B23K26/00 ,  B23K26/14 ,  B23K26/16 ,  B23K26/18

CPC分类号： B08B7/0042 ,  B23K26/0624 ,  B23K26/351 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/67144

摘要： This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.

摘要翻译： 本发明涉及一种通过激光照射对集成电路（IC）封装进行消融的方法和装置。 该方法和装置包括两个激光扫描闪光区域，用于进行去抖动操作。 CO 2激光器用于去除闪光的顶层，并且使用YAG激光器去除CO 2激光束缚后残留的薄层。 CO 2激光束缚和随后的YAG激光束缚可以有效地去除闪光，并避免散热片以及IC封装中的引线和棒的损坏。

公开(公告)号：US06838637B2

公开(公告)日：2005-01-04

申请号：US10059940

申请日：2002-01-29

申请人： Wen Dong Song ,  Minghui Hong ,  Chengwu An ,  Yong Feng Lu

发明人： Wen Dong Song ,  Minghui Hong ,  Chengwu An ,  Yong Feng Lu

IPC分类号： B08B7/00 ,  B23K26/00 ,  B23K26/06 ,  H01L21/00

CPC分类号： B08B7/0042 ,  B23K26/0624 ,  B23K26/351 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/67144

摘要： This invention relates to a method and apparatus for deflashing integrated circuit (IC) packages by laser irradiation. The method and apparatus include two lasers scanning flash area for performing deflashing operation. CO2 laser is used to remove top layer of flash and YAG laser is used to remove the thin layer of flash remained after CO2 laser deflashing. CO2 laser deflashing and following YAG laser deflashing can effectively remove flash and avoid damage of heat sinks as well as leads and bars in the IC packages.

摘要翻译： 本发明涉及一种通过激光照射对集成电路（IC）封装进行消融的方法和装置。 该方法和装置包括两个激光扫描闪光区域，用于进行去抖动操作。 CO2激光器用于去除顶层闪光灯，YAG激光器用于去除二氧化碳激光束缚后残留的薄层闪光。 二氧化碳激光束缚和随后的YAG激光束缚可以有效去除闪光灯，避免散热片以及IC封装中引线和棒的损坏。

公开(公告)号：US06828524B2

公开(公告)日：2004-12-07

申请号：US10083832

申请日：2002-02-27

申请人： Minghui Hong ,  Wen Dong Song ,  Yongfeng Lu

发明人： Minghui Hong ,  Wen Dong Song ,  Yongfeng Lu

IPC分类号： B23K2600

CPC分类号： B41J2/16517 ,  H05K3/26

摘要： This invention relates to a method and apparatus for removing surface contamination on a flexible circuit 34 for an inkjet printer cartridge by pulsed laser irradiation in air. The contamination 3 around and inside the tiny inkjet nozzles 4 can be completely removed without any damage on the flexible circuit 34 by the laser irradiation. The cleaning mechanisms are laser-induced ablation of the contamination and fast momentum transferring from the laser beam to the contamination materials. Compared with chemical solution cleaning and plasma etching, this technique has high throughput and does not cause flexible circuit damage, due to the fact that there are no water and chemical solutions involved in the process. Meanwhile, the laser irradiation is only limited in a small area around the tiny inkjet nozzles 4. There is no laser interaction with the thin conductive circuit 34.

摘要翻译： 本发明涉及通过脉冲激光照射在空气中去除用于喷墨打印机墨盒的柔性电路34上的表面污染物的方法和装置。 可以通过激光照射在微型喷墨嘴4周围和内部的污染物3完全去除而不会对柔性电路34造成任何损坏。 清洁机制是激光诱导的污染消融和从激光束传递到污染物质的快速动量。 与化学溶液清洗和等离子体蚀刻相比，该技术具有高通量，并且由于在该过程中没有涉及水和化学溶液的事实，不会导致柔性电路损坏。 同时，激光照射仅在微小喷墨喷嘴4周围的小区域中受到限制。与薄导电电路34没有激光相互作用。

公开(公告)号：US06822189B2

公开(公告)日：2004-11-23

申请号：US10090409

申请日：2002-03-04

申请人： Minghui Hong ,  Yongfeng Lu

发明人： Minghui Hong ,  Yongfeng Lu

IPC分类号： B23K2636

CPC分类号： B41M5/24 ,  B23K26/08 ,  B23K26/082 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B41M5/26 ,  B41M5/38221 ,  C03C17/002 ,  C03C17/09 ,  C03C23/0025 ,  C03C2218/32 ,  C23C14/048 ,  C23C14/28

摘要： A method of laser marking, suitable for the marking of hard transparent materials without causing microcracking, includes arranging a sample of target material and a sample of markable material such that they are spaced apart; directing irradiation having an energy fluence above the ablation threshold of the target material onto the target material so that some of it is ablated and thrown onto a surface of the markable material; and subjecting the surface of the markable material to irradiation having an energy fluence below the ablation threshold of the markable material to induce an interaction between the ablated material and the surface which marks the surface of the ablated material. Different colours of mark can be obtained by using different target materials, and the tone of the mark can be controlled as desired. Apparatus for implementing the method permits control of the method in real time.

摘要翻译： 一种适用于标记硬质透明材料而不引起显微裂纹的激光标记方法包括：将目标材料样品和可标记材料样品排列成间距; 将具有高于目标材料的消融阈值的能量注量的照射引导到目标材料上，使得其中的一些被烧蚀并投掷到可标记材料的表面上; 并且将可标记材料的表面经受低于可标记材料的消融阈值的能量注入的照射，以引起消融材料和标记烧蚀材料表面的表面之间的相互作用。 可以通过使用不同的目标材料获得不同颜色的标记，并且可以根据需要控制标记的色调。 用于实现该方法的装置允许实时地控制该方法。