Electronic array and methods for fabricating same
    4.
    发明授权
    Electronic array and methods for fabricating same 失效
    电子阵列及其制造方法

    公开(公告)号:US07564125B2

    公开(公告)日:2009-07-21

    申请号:US10313078

    申请日:2002-12-06

    IPC分类号: H01L23/02

    摘要: A sensor array includes a substrate including a front side and a back side, a plurality of transducers fabricated on the front side of the substrate, a plurality of input/output connections positioned on the back side of the substrate, the input/output connections electrically coupled to the transducers, at least one electronic device, and an interposer positioned between the substrate and the electronic device, the interposer including a multilayer interconnect system configured to electrically connect the input/output connections to the electronic device.

    摘要翻译: 传感器阵列包括:基板,包括前侧和后侧;多个换能器,其制造在所述基板的前侧;多个输入/输出连接,位于所述基板的背面,所述输入/输出连接电气 耦合到所述换能器,至少一个电子设备和位于所述基板和所述电子设备之间的插入器,所述插入器包括被配置为将所述输入/输出连接电连接到所述电子设备的多层互连系统。