摘要:
A fluid ejector includes a fluid channel having a resistive heater and terminating in a nozzle, a common bus formed transverse to the fluid channel and between the resistive heater and the nozzle, a connection line laterally adjacent to the fluid channel, and a connection structure for electrically connecting the common bus with the resistive heater and the connection line, the connection structure including a first set of one or more layers for electrical connection and a second set of one or more layers for covering the common bus and connection line. The first set of one or more layers includes a doped polysilicon layer on or overlaid by an optional tantalum-silicide layer. The second set of one or more layers includes a nitride layer on or overlaid by a tantalum layer.
摘要:
An electrostatic discharge protection device for a connector associated with an integrated circuit chip, particularly one associated with a thermal ink-jet printhead. A MOS field effect device extends along at least one edge of the connector on the chip. A bipolar transistor, parasitic to the field effect device, conducts current from the connector to ground in response to a voltage between the connector and ground in excess of a predetermined threshold. A zone of a predetermined electrical resistance is operatively disposed between the bipolar transistor and ground. The zone may substantially encircle the bonding pad of the connector to evenly distribute local incidences of high voltage. The invention enables integrated circuits to pass ESD requirements of office products, which is 15 kV by Human Body Model testing.
摘要:
The new heater element design has a pit layer which protects the overglaze passivation layer, PSG step region, portions of the Ta layer and dielectric isolation layer and junctions or regions susceptible to the cavitational pressures. Further, the inner walls of the pit layer define the effective heater area and the dopant lines define the actual heater area. In alternative embodiments, the dopant lines define the actual and effective heater areas, and an inner wall and a dopant line define the actual and effective heater areas. Further, when the new heater element designs are incorporated into printheads having full pit channel geometry and open pit channel geometry, the operating lifetime of the printhead is extended because the added protection of the pit layer prevents: 1) passivation damage and cavitational damages of the heater elements; and 2) degradation of heater robustness, hot spot formations and heater failures well into the 109 pulse range. The printhead incorporating the new heater element design can be incorporated into drop-on-demand printing systems of a carriage type or a full width type.
摘要:
A thermal ink jet printhead includes a switched power supply for the intermediate voltage predriver sections. The power supply is switched by a MOSFET connected between an intermediate point of a voltage divider and ground. By switching the power supply, the predriver sections are turned off, unnecessary power consumption and overheating the printhead are avoided.
摘要:
A system controls an ink jet printing apparatus for propelling ink jet droplets on demand from a printhead having a plurality of drop ejectors. In the printhead, each ejector includes a heating element actuable in response to electrical input signals, each input signal having an amplitude and a time duration, selectably applied to the heating element to produce a temporary vapor bubble and cause a quantity of ink to be emitted for the creation of a mark on a copy sheet. The temperature of ink in the printhead is sensed, and a combination of power level and time duration of the electrical input signal for the heating element to result in a desired size of the mark of the copy sheet is selected, by entering the sensed temperature of the ink into a predetermined function relating the energy of the electrical input signal to the corresponding resulting size of the mark on the copy sheet.
摘要:
The systems and methods of this invention allows for an electrical contact structure of the drop ejecting transducer in an inkjet printhead to be designed in such a way that the relatively thick electrical contact lines are not in the ink drop ejection path between the drop ejector transducer and the corresponding nozzle. Such a design thereby minimizes any visible defects due to misdirected satellite drops.
摘要:
An electrostatic discharge protection device for a connector associated with an integrated circuit chip, particularly one associated with a thermal ink-jet printhead. AMOS field effect device extends along at least one edge of the connector on the chip. A bipolar transistor, parasitic to the field effect device, conducts current from the connector to ground in response to a voltage between the connector and ground in excess of a predetermined threshold. A zone of a predetermined electrical resistance is operatively disposed between the bipolar transistor and ground. The zone may substantially encircle the bonding pad of the connector to evenly distribute local incidences of high voltage. The invention enables integrated circuits to pass ESD requirements of office products, which is 15 kV by Human Body Model testing.
摘要:
A wide semiconductor transducer device comprises a linear array of semiconductor chips. Each of the semiconductor chips has a plurality of transducer elements arranged on it along a front edge at a constant spacing, the constant spacing being maintained across the semiconductor chip boundaries. Each of the semiconductor chips also includes associated transducer circuits which are each connected one of the plurality of transducer elements formed on the semiconductor chip. While the requirement that the transducer elements maintain the constant spacing requires them to be located within a damage zone created during the dicing and/or thermally induced compression of the semiconductor chip, the associated transducer circuits can be located within an interior portion of the semiconductor chip. The interior portion of the semiconductor chip is located a sufficient distance from the edges of the semiconductor chip such that it does not encroach on the damage zone.
摘要:
At least one through opening of predetermined location and dimensions is fabricated in a (100) silicon wafer by orientation dependent etching method after completion of integrated circuits on the wafer, the opening extending through the wafer between a circuit surface of the wafer and an opposite parallel base surface of the wafer and having a predetermined location relative to the integrated circuit on the circuit surface of the wafer. The method includes the steps of fabricating the integrated circuit on the circuit surface of the wafer; applying an etch resistant layer of plasma solicon nitride on the circuit and base surfaces of the wafer; patterning the etch resistant plasma silicon nitride layer on the circuit surface to define an upper etch opening having a location and dimensions which define the predetermined location and dimensions of the through opening; and patterning the plasma silicon nitride layer on the base surface to produce a lower etch opening aligned with the upper etch opening within a predetermined tolerance. The wafer is then anisotropically etched to produce a first recess corresponding to the upper etch opening in the circuit surface and a second recess corresponding to the lower etch opening in the base surface, each of the first and second recesses being bounded by (111) plane side walls. The anisotropic etching of the second recess intersects the first recess to form the through opening bounded by (111) plane side walls and has its predetermined dimensions and location defined by the patterning of the upper etch opening.
摘要:
A printhead uses large and small drop ejectors to achieve efficient gray scale printing. The printhead is arranged with a close packed configuration of alternating large and small nozzles positioned to maximize coverage while minimizing the volume of ejected ink. The printhead may be operated in a single pass mode or dual pass mode. In the single pass mode, complete coverage is effected by rippling through the odd numbered jets first and then rippling through the even numbered jets. The position of the small spots from the even numbered jets can be adjusted to maximize coverage and counteract offset between nozzle centers. Printheads with different size nozzles can also be operated by a staggered firing method using dual passes to offset spots in the scan direction by shifting the printhead between passes or alternating between groups of large and small nozzles. Further improvements to image quality can be realized by shifting the spots in the direction perpendicular to the scanning direction by tilting the printhead or offsetting the nozzles with respect to the ink channels on the printhead.