公开(公告)号：US06480391B1

公开(公告)日：2002-11-12

申请号：US09481521

申请日：2000-01-12

申请人： William Michael Monson ,  John Lee Colbert ,  Steven Dale Greseth ,  Mark G. Clark

发明人： William Michael Monson ,  John Lee Colbert ,  Steven Dale Greseth ,  Mark G. Clark

IPC分类号： H05K500

CPC分类号： H05K7/1425

摘要： A cage for an electronic component includes two spaced apart cast walls, and a roof member and a floor member connected to the two spaced apart cast walls. The walls are substantially identical, and the roof member and the floor member are each formed of a damped metallic laminate panel.

摘要翻译： 用于电子部件的保持架包括两个间隔开的铸造壁，以及连接到两个间隔开的铸造壁的屋顶构件和地板构件。 墙壁基本相同，屋顶构件和地板构件均由阻尼金属层压板形成。

公开(公告)号：US06561554B2

公开(公告)日：2003-05-13

申请号：US09897547

申请日：2001-07-02

申请人： John Lee Colbert ,  Steven Dale Greseth ,  William Michael Monson

发明人： John Lee Colbert ,  Steven Dale Greseth ,  William Michael Monson

IPC分类号： E05C1910

CPC分类号： E05C3/14 ,  Y10T292/0902 ,  Y10T292/0934 ,  Y10T292/1061

摘要： A latch assembly for a computer or other electronic device includes a lever which is adapted to receive a spring arm integrally molded with a latch. The latch also includes integrally molded pivot pins which are guided by ramps into pivot holes in the lever to mate the latch and lever together. Once assembled, the latch is movable to and between engaged and disengaged positions for closure with a catch on the computer, electronic or other workpiece device. The latch assembly incorporates specific changes to existing parts while reducing the number of parts and the cost of and complexity for assembly. The design is much more easily accommodated in automated assembly equipment to further reduce assembly costs and increase productivity throughput.

摘要翻译： 用于计算机或其他电子设备的闩锁组件包括杆，其适于接纳与闩锁一体模制的弹簧臂。 闩锁还包括一体模制的枢轴销，其由斜面引导到杠杆中的枢转孔中，以将闩锁和杠杆配合在一起。 一旦组装，闩锁可移动到接合位置和脱离位置之间，以便用计算机，电子设备或其它工件装置上的卡扣封闭。 闩锁组件结合了现有部件的特定变化，同时减少了部件的数量以及组装的成本和复杂性。 该设计更容易适应于自动组装设备，以进一步降低装配成本并提高生产率。

公开(公告)号：US07293994B2

公开(公告)日：2007-11-13

申请号：US11297307

申请日：2005-12-08

申请人： William Louis Brodsky ,  John Lee Colbert ,  Roger Duane Hamilton ,  Amanda Elisa Ennis Mikhail ,  Mark David Plucinski

发明人： William Louis Brodsky ,  John Lee Colbert ,  Roger Duane Hamilton ,  Amanda Elisa Ennis Mikhail ,  Mark David Plucinski

IPC分类号： H01R12/00

CPC分类号： H01R13/2407 ,  H01R12/52 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208

摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

摘要翻译： 一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。 插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。 弹性线束设置在每个孔中。 非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。 每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。 一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。 在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

公开(公告)号：US07944698B2

公开(公告)日：2011-05-17

申请号：US12164367

申请日：2008-06-30

申请人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

公开(公告)号：US07517230B2

公开(公告)日：2009-04-14

申请号：US12131176

申请日：2008-06-02

申请人： John Lee Colbert ,  Mark Kenneth Hoffmeyer

发明人： John Lee Colbert ,  Mark Kenneth Hoffmeyer

IPC分类号： H01R12/00

CPC分类号： H01L23/4006 ,  H01L25/0655 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0058 ,  H05K3/325 ,  H05K7/1061 ,  H05K2201/09036 ,  H05K2201/10409 ,  H05K2201/10719 ,  H05K2201/2009 ,  H01L2924/00

摘要： An electrical contact assembly includes a first module (21a, 21b, 22) having a first set of electrical contacts, a second module (10) having a second set of electrical contacts, a shape generating module (32, 34, 36), and a clamping arrangement (24, 25, 26, 27, 28, 29) for clamping the first, second and shape generating modules together. The shape generating module (32, 34, 36) imparts a desired shape to the second module (10) for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer (34), a second insulating layer (32) and a shape producing layer (36) disposed between the first and second insulating layers. The shape producing layer (36) includes an adhesive that flows and cures upon application of a heat treatment to produce the desired shape.

摘要翻译： 电触头组件包括具有第一组电触点的第一模块（21a，21b，22），具有第二组电触点的第二模块（10），形状产生模块（32,34,36），以及 用于将第一，第二和形状发生模块夹紧在一起的夹紧装置（24,25,26,27,28,29）。 形状产生模块（32,34,36）向第二模块（10）施加期望的形状，用于将第二组电触头推向第一组电触头，使得将模块夹在一起导致正接触力 在第一组和第二组电触点之间，在电接触组之间基本均匀。 形状产生模块包括设置在第一和第二绝缘层之间的第一绝缘层（34），第二绝缘层（32）和形状产生层（36）。 形状产生层（36）包括在施加热处理以产生所需形状时流动和固化的粘合剂。

公开(公告)号：US20080282539A1

公开(公告)日：2008-11-20

申请号：US12183288

申请日：2008-07-31

申请人： William Louis Brodsky ,  John Lee Colbert ,  Roger Duane Hamilton ,  Amanda Elisa Ennis Mikhail ,  Mark David Plucinski

发明人： William Louis Brodsky ,  John Lee Colbert ,  Roger Duane Hamilton ,  Amanda Elisa Ennis Mikhail ,  Mark David Plucinski

IPC分类号： H01R43/00

CPC分类号： H01R13/2407 ,  H01R12/52 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49204 ,  Y10T29/49208

摘要： A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

摘要翻译： 一种使用通过保持膜捕获在插入件的孔中的弹性线束来电连接两个基板的方法和装置。 插入器包括具有从表面到表面延伸的两个表面和孔的非导电载体。 弹性线束设置在每个孔中。 非导电保持膜与载体的一个或两个表面相关联并且具有覆盖每个孔的孔口。 每个孔的宽度小于下面的孔的宽度，从而增强弹性线束在孔内的保持力。 一个或两个基板的引脚触点通过延伸穿过保持膜的孔并部分地穿过孔而与弹性线束电接触。 在一个实施例中，插入器是连接电子模块和印刷电路板（PCB）的平面栅格阵列（LGA）连接器。

公开(公告)号：US20080259572A1

公开(公告)日：2008-10-23

申请号：US12164339

申请日：2008-06-30

申请人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  Eric Alan Eckberg ,  Roger Duane Hamilton ,  Mark Kenneth Hoffmeyer ,  Amanda Elisa Ennis Mikhail ,  Arvind Kumar Sinha

IPC分类号： H05K7/20 ,  H05K3/30

CPC分类号： H01L23/4006 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4913 ,  Y10T29/49826 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

摘要翻译： 传热装置包括具有负载弹簧的负载框架和暴露电子部件的开放区域。 负载框架安装在其上安装电子部件的印刷电路板上。 散热器组件设置在负载框架上，并且具有通过导热材料与电子部件热接触的主体。 散热器组件具有用于接合负载弹簧的负载臂。 负载板在负载臂之间延伸并且具有致动元件，该致动元件可操作地相对于负载板移动主体，从而使负载弹簧弹性变形，并产生负载力，该负载力压缩导热材料以实现期望的热界面间隙 主体和电子部件。 不影响的紧固件将散热器固定到负载框架上并保持所需的热接口间隙。

公开(公告)号：US06988533B2

公开(公告)日：2006-01-24

申请号：US10607361

申请日：2003-06-26

申请人： John Lee Colbert ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

发明人： John Lee Colbert ,  Roger Duane Hamilton ,  Arvind Kumar Sinha

IPC分类号： F28F7/00

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat transfer apparatus comprises a thermally conductive member including a base having one or more surfaces adapted to absorb heat from an electronic component, and a mounting assembly including at least one mounting member directly coupled to the base and for direct attachment to the electronic component so that loading forces for mounting on it the electronic component are not directly applied to the base. The thermally conductive member is a graphite-based material. A compliant force applying mechanism is mounted generally on the base for controlling forces applied on the base.

摘要翻译： 传热装置包括导热构件，其包括具有适于吸收来自电子部件的热量的一个或多个表面的底座和安装组件，该安装组件包括至少一个安装构件，该至少一个安装构件直接连接到基座并用于直接附接到电子部件，因此 用于安装在其上的电子部件的负载力不直接施加到基座。 导热构件是石墨基材料。 柔性力施加机构通常安装在基座上以控制施加在基座上的力。

公开(公告)号：US08680670B2

公开(公告)日：2014-03-25

申请号：US12909980

申请日：2010-10-22

申请人： Jon Alfred Casey ,  John Lee Colbert ,  Paul Marian Harvey ,  Mark Kenneth Hoffmeyer ,  Charles L Reynolds

发明人： Jon Alfred Casey ,  John Lee Colbert ,  Paul Marian Harvey ,  Mark Kenneth Hoffmeyer ,  Charles L Reynolds

IPC分类号： H01L23/10

CPC分类号： H01L23/49833 ,  H01L22/14 ,  H01L23/32 ,  H01L23/4006 ,  H01L23/467 ,  H01L2924/16251 ,  H01L2924/16747

摘要： A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board.

摘要翻译： 多芯片模块（MCM）包括作为独立可测试实体制造的芯片子模块。 芯片子模块插入MCM框架中的相应插槽。 在插入MCM之前，可以对每个芯片子模块进行测试。 芯片子模块可以包括安装到向模块提供互连的子模块有机衬底的诸如处理器的IC芯片。 每个芯片子模块插入的框架位于将芯片子模块互连在一起的微型卡有机基板上。 MCM可以包括微卡有机基板和系统板之间的下停，以限制或防止微卡有机基板和系统板之间的焊料连接的焊料蠕变。

公开(公告)号：US07399185B2

公开(公告)日：2008-07-15

申请号：US11456111

申请日：2006-07-07

申请人： John Lee Colbert ,  Mark Kenneth Hoffmeyer

发明人： John Lee Colbert ,  Mark Kenneth Hoffmeyer

IPC分类号： H01R12/00

CPC分类号： H01L23/4006 ,  H01L25/0655 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0058 ,  H05K3/325 ,  H05K7/1061 ,  H05K2201/09036 ,  H05K2201/10409 ,  H05K2201/10719 ,  H05K2201/2009 ,  H01L2924/00

摘要： An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape generating module, and a clamping arrangement for clamping the first, second and shape generating modules together. The shape generating module imparts a desired shape to the second module for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer, a second insulating layer and a shape producing layer disposed between the first and second insulating layers. The shape producing layer includes an adhesive that flows and cures upon application of a heat treatment to produce the desired shape.

摘要翻译： 电触头组件包括具有第一组电触点的第一模块，具有第二组电触点的第二模块，形状产生模块以及用于将第一，第二和形状发生模块夹紧在一起的夹紧装置。 形状产生模块向第二模块施加期望的形状，用于将第二组电触点推向第一组电触点，使得将模块夹在一起导致第一和第二组电触点之间的正接触力， 在电接触组之间基本均匀。 形状发生模块包括第一绝缘层，第二绝缘层和设置在第一和第二绝缘层之间的形状产生层。 形状产生层包括在施加热处理以产生所需形状时流动和固化的粘合剂。