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公开(公告)号：US4243969A
公开(公告)日：1981-01-06
申请号：US30801
申请日：1979-04-17
CPC分类号： H01C10/04
摘要： A layer resistor element for use in a variable resistor has two resistance layers disposed upon each other on an insulating substrate, the lower resistance layer being provided with two comb-like sets of separating slots extending from opposite sides to form a meander-like resistance path, the widths and lengths of the meander turns varying in accordance with a given non-linear resistance characteristic. The upper resistance layer which is of a material of higher resistivity than the lower resistance layer covers the lower layer partly or totally and extends beyond the lower layer at one side thereof where it provides a path for a slider of the variable resistor.
摘要翻译： 用于可变电阻器的层电阻器元件具有在绝缘基板上彼此相对设置的两个电阻层，下电阻层设置有两个梳状组的分离槽，其从相对侧延伸以形成曲折状电阻路径 曲折的宽度和长度根据给定的非线性电阻特性而变化。 具有比下电阻层更高电阻率的材料的上电阻层部分地或全部地覆盖下层，并且在其一侧延伸超出下层，在其上提供可变电阻器的滑块的路径。
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2.发明授权
公开(公告)号：US4391742A
公开(公告)日：1983-07-05
申请号：US189365
申请日：1980-09-22
IPC分类号： H05K3/12 , B23K35/00 , C23C18/16 , C23C18/18 , C23C18/20 , C23C18/30 , C23C18/31 , C23C18/40 , C23C18/44 , H05K1/09 , H05K3/18 , H05K3/24 , H01B1/02
CPC分类号： H05K3/246 , B23K35/001 , H05K1/095 , H05K2201/0347 , Y10T428/12049 , Y10T428/12076 , Y10T428/12111 , Y10T428/24413 , Y10T428/256
摘要： Paste composition for producing an electrically conductive and solderable structure along with the resulting article are disclosed. Metal particles, metal salts and an organic polymer binder are formed into a paste which is applied to a non-conductive substrate by printing or the like. The paste is heated to permit metal salts to migrate to the surface of the binder where they become concentrated. During metallizing the salts are removed by the bath and metal is deposited in pores formed in the binder by the dissolved salts. The metal layer is adherent to the binder and provides good solderable points.
摘要翻译： 公开了用于产生导电和可焊接结构以及所得制品的糊剂组合物。 将金属颗粒，金属盐和有机聚合物粘合剂形成为通过印刷等施加到非导电性基材上的糊状物。 加热糊状物以允许金属盐迁移到粘合剂的表面，在那里它们变得浓缩。 在金属化期间，通过浴除去盐，并且金属通过溶解的盐沉积在形成在粘合剂中的孔中。 金属层粘合到粘合剂上并提供良好的可焊点。
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公开(公告)号：US4271045A
公开(公告)日：1981-06-02
申请号：US904307
申请日：1978-06-13
IPC分类号： H01B1/20 , H01B1/24 , H01C17/065 , H01B1/06
CPC分类号： H01B1/20 , H01B1/24 , H01C17/0652 , Y10T428/31993
摘要： An electrically conductive composition and method for making same is disclosed. The composition includes a uniform mixture of electrically conductive particles comprising pyrolytic carbon doped or coated with a component taken from Group III-VIII elements of the Periodic Table and a curable, non-conducting polymer binder.
摘要翻译： 公开了导电组合物及其制造方法。 该组合物包括导电颗粒的均匀混合物，其包含掺杂或涂覆有从元素周期表III-VIII族元素的组分的热解碳和可固化的非导电聚合物粘合剂。
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公开(公告)号：US4310824A
公开(公告)日：1982-01-12
申请号：US38826
申请日：1979-05-14
CPC分类号： H01C10/32
摘要： The invention concerns a variable resistor of modular design comprising a using, a resistance element retained in the housing by means of a detent fastener and having a resistance guide way mounted on a carrier, and with terminal contact surfaces on extensions of the carrier, terminal pieces in electrical contact with the terminal contact surfaces, and a rotor rotatably mounted in the housing and a contact element connected for rotation with the rotor and in sliding contact with a collector element and the resistance element.
摘要翻译： 本发明涉及一种模块化设计的可变电阻器，包括壳体，通过止动紧固件保持在壳体中的电阻元件，并且具有安装在载体上的电阻引导方式，以及在载体的延伸部上的端子接触表面，端子片 与端子接触表面电接触;以及可旋转地安装在壳体中的转子和与转子连接并与集电器元件和电阻元件滑动接触的接触元件。
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5.发明授权
公开(公告)号：US4248921A
公开(公告)日：1981-02-03
申请号：US918378
申请日：1978-06-23
IPC分类号： H05K3/12 , B23K35/00 , C23C18/16 , C23C18/18 , C23C18/20 , C23C18/30 , C23C18/31 , C23C18/40 , C23C18/44 , H05K1/09 , H05K3/18 , H05K3/24 , B05D5/12 , B32B5/16
CPC分类号： H05K3/246 , B23K35/001 , H05K1/095 , H05K2201/0347 , Y10T428/12049 , Y10T428/12076 , Y10T428/12111 , Y10T428/24413 , Y10T428/256
摘要： Method for producing an electrically conductive and solderable structure along with the resulting article are disclosed. The method comprises admixing metal particles, metal salts and an organic polymer binder as a paste which is applied to a non-conductive substrate by printing or the like. The paste is heated to permit metal salts to migrate to the surface of the binder where they become concentrated. During metallizing the salts are removed by the bath and metal is deposited in pores formed in the binder by the dissolved salts. The metal layer is adherent to the binder and provides good solderable points.
摘要翻译： 公开了用于制造导电和可焊接结构以及所得制品的方法。 该方法包括将金属颗粒，金属盐和有机聚合物粘合剂作为糊料混合，通过印刷等施加到非导电基材上。 加热糊状物以允许金属盐迁移到粘合剂的表面，在那里它们变得浓缩。 在金属化期间，通过浴除去盐，并且金属通过溶解的盐沉积在形成在粘合剂中的孔中。 金属层粘合到粘合剂上并提供良好的可焊点。
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