公开(公告)号：US20130337335A1

公开(公告)日：2013-12-19

申请号：US14001436

申请日：2011-12-15

申请人： Won-Bae Kim ,  Jong-Guk Kim

发明人： Won-Bae Kim ,  Jong-Guk Kim

IPC分类号： H01M4/36 ,  H01M4/04 ,  H01M4/583

CPC分类号： H01M4/366 ,  B82Y30/00 ,  C01B32/23 ,  C01G19/02 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2004/16 ,  C04B35/457 ,  C04B35/536 ,  C04B35/62805 ,  C04B35/62886 ,  C04B35/62889 ,  C04B2235/3293 ,  C04B2235/5284 ,  H01M4/0471 ,  H01M4/483 ,  H01M4/583

摘要： The present invention relates to a negative electrode material for a secondary battery and to a method for manufacturing same. The negative electrode material includes a graphite matrix and a plurality of tin-oxide nanorods disposed on the graphite matrix. Thus, when the negative electrode material is used as the negative electrode for a secondary battery, the negative electrode material may provide high initial capacity (1010 mAhg−1) and coulombic efficiency, superior rate capability, and improved electrochemical properties. Further, the method for manufacturing the negative electrode material for a secondary battery includes: a step of activating a surface of graphite; coating tin-oxide nanoparticles onto the activated surface of the graphite so as to form tin-oxide seed-type graphite; and heating the tin-oxide seed-type graphite using heated water in order to grow a plurality of tin-oxide nanorods.

摘要翻译： 二次电池用负极材料及其制造方法技术领域本发明涉及二次电池用负极材料及其制造方法。 负极材料包括石墨基质和设置在石墨基质上的多个氧化锡纳米棒。 因此，当负极材料用作二次电池的负极时，负极材料可以提供高的初始容量（1010mAhg-1）和库仑效率，优异的速率能力和改善的电化学性能。 此外，二次电池用负极材料的制造方法包括：活化石墨表面的工序; 将氧化锡纳米颗粒涂覆到石墨的活化表面上，形成锡氧化物种子型石墨; 并使用加热的水加热氧化锡籽型石墨，以生长多个氧化锡纳米棒。

公开(公告)号：US07473099B2

公开(公告)日：2009-01-06

申请号：US11645710

申请日：2006-12-27

申请人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  Il-Kyoon Jeon ,  Eung-Suek Lee

发明人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  Il-Kyoon Jeon ,  Eung-Suek Lee

IPC分类号： H01R12/00

CPC分类号： H05K3/4641 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

摘要翻译： 公开了一种印刷电路板及其制造方法。 一种印刷电路板，由绝缘基板构成，绝缘基板包括绝缘层，形成在绝缘层的一侧上的电路图形，以及与该绝缘层相连接且与电路图案电连接的层间通道， 层叠在绝缘层的另一侧的层叠层可以通过由放热形成的内层或接地层提供高的散热效果和高的抗弯强度 层。

公开(公告)号：US20080009146A1

公开(公告)日：2008-01-10

申请号：US11645710

申请日：2006-12-27

申请人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  Il-Kyoon Jeon ,  Eung-Suek Lee

发明人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  Il-Kyoon Jeon ,  Eung-Suek Lee

IPC分类号： H01R12/00

CPC分类号： H05K3/4641 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

摘要翻译： 公开了一种印刷电路板及其制造方法。 一种印刷电路板，由绝缘基板构成，绝缘基板包括绝缘层，形成在绝缘层的一侧上的电路图形，以及与该绝缘层相连接且与电路图案电连接的层间通道， 层叠在绝缘层的另一侧的层叠层可以通过由放热形成的内层或接地层提供高的散热效果和高的抗弯强度 层。

公开(公告)号：US20080052902A1

公开(公告)日：2008-03-06

申请号：US11976617

申请日：2007-10-25

申请人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  Il-Kyoon Jeon ,  Eung-Suek Lee

发明人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  Il-Kyoon Jeon ,  Eung-Suek Lee

IPC分类号： H05K3/00

CPC分类号： H05K3/4641 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

摘要翻译： 印刷电路板及其制造方法。 印刷电路板具有绝缘基板，该绝缘基板包括绝缘层，形成在绝缘层的一侧的电路图案，以及与该绝缘层接合并被构造为与电路图形电连接的层间通道， 层叠在绝缘层的另一方的层叠在绝缘基板上的剥离层能够通过由散热层形成的内层或接地层提供高散热效果和高弯曲强度 。

公开(公告)号：US07810232B2

公开(公告)日：2010-10-12

申请号：US11976617

申请日：2007-10-25

申请人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  II-Kyoon Jeon ,  Eung-Suek Lee

发明人： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  II-Kyoon Jeon ,  Eung-Suek Lee

IPC分类号： H05K3/36

CPC分类号： H05K3/4641 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

摘要翻译： 印刷电路板及其制造方法。 印刷电路板具有绝缘基板，该绝缘基板包括绝缘层，形成在绝缘层的一侧的电路图案，以及与该绝缘层接合并被构造为与电路图形电连接的层间通道， 层叠在绝缘层的另一方的层叠在绝缘基板上的剥离层能够通过由散热层形成的内层或接地层提供高散热效果和高弯曲强度 。

公开(公告)号：US20070155166A1

公开(公告)日：2007-07-05

申请号：US11559630

申请日：2006-11-14

申请人： Jong-Guk Kim

发明人： Jong-Guk Kim

IPC分类号： H01L21/4763

CPC分类号： H01L21/76814 ,  H01L21/02063

摘要： A method of depositing copper wiring that includes at least one of the following. Transporting a semiconductor substrate with a damascene pattern into a first chamber. Substantially concurrently performing a degassing process and a process of removing a Copper Oxide film on a semiconductor substrate located in a first chamber.

摘要翻译： 一种沉积铜线的方法，其包括以下中的至少一个。 将具有镶嵌图案的半导体衬底传送到第一室中。 基本上同时进行脱气处理和在位于第一室中的半导体衬底上去除氧化铜膜的工艺。