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19 条记录 (耗时 0.052 秒)

    Printed circuit board and method for manufacturing thereof
    6.
    发明申请
    Printed circuit board and method for manufacturing thereof 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20080121414A1

    公开(公告)日：2008-05-29

    申请号：US11812661

    申请日：2007-06-20

    申请人： Eung-Suek Lee ,  Dek-Gin Yang ,  Keun-Ho Kim

    发明人： Eung-Suek Lee ,  Dek-Gin Yang ,  Keun-Ho Kim

    IPC分类号： H05K1/05 ,  H05K3/10

    CPC分类号： H05K1/0207 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0323 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49155

    摘要： A printed circuit board and a method of manufacturing thereof are disclosed. With a printed circuit board comprising an insulating layer; a circuit pattern formed on one side of the insulating layer; an inter-layer conductive part joining with the insulating layer by passing through the insulating layer, and electrically connected to the circuit pattern; a heat dissipating layer laminated on the other side of the insulating layer; and a heat dissipating coating layer interposed between the insulating layer and the heat dissipating layer, and connected with the inter-layer conductive part, the heat contained in the insulating layer may be delivered to the heat dissipating layer effectively and the efficiency of heat dissipation may be improved.

    摘要翻译： 公开了印刷电路板及其制造方法。 具有包含绝缘层的印刷电路板; 形成在所述绝缘层一侧的电路图案; 通过穿过绝缘层与绝缘层接合并电连接到电路图案的层间导电部分; 层叠在绝缘层的另一侧的散热层; 以及插入在绝缘层和散热层之间并与层间导电部分连接的散热涂层，可以有效地将绝缘层中包含的热量输送到散热层，并且散热效率 要改进

    Printed circuit board using paste bump and manufacturing method thereof
    8.
    发明申请
    Printed circuit board using paste bump and manufacturing method thereof 有权
    使用糊状凸块的印刷电路板及其制造方法

    公开(公告)号：US20080283288A1

    公开(公告)日：2008-11-20

    申请号：US12219381

    申请日：2008-07-21

    申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Youn-Soo Seo ,  Hee-Bum Shin ,  Yoong Oh ,  Byung-Bae Seo ,  Tae-Kyoung Kim ,  Dong-Jin Park

    IPC分类号： H05K1/11

    CPC分类号： H05K3/462 ,  H01R12/523 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0353 ,  Y10T29/49155

    摘要： A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.

    摘要翻译： 公开了一种使用糊状凸块的印刷电路板及其制造方法。 使用糊状凸块制造印刷电路板的方法包括：（a）穿孔芯板以形成至少一个通孔，（b）通过填充电镀填充至少一个通孔并在其上形成电路图案 芯板的至少一个表面，（c）在芯板的至少一个表面上堆叠焊料凸块，以及（d）在焊料凸块的表面上形成外层电路，结构稳定的全层 由于镀层芯板的BVH的强度增加，可以实现IVH结构，由于并行处理和集体堆叠，制造时间可以减少，由于糊状凸块的铜箔堆叠而实现微电路变得容易 在最外层，可以减少制造成本，因为可以省略某些电镀和钻孔工艺，在电路图案之间增加层间连接面积以提高连接可靠性，并且可以获得凹坑覆盖 d。