摘要:
Disclosed herein are an apparatus and method for providing communication services. The apparatus includes a location information acquisition unit, a radio station information acquisition unit, and an offloading unit. The location information acquisition unit acquires information about the current location of the user terminal by sending a location information request message to the user terminal. The radio station information acquisition unit requests information about a white space radio station from which the user terminal can receive the communication services by sending the information about the current location of the user terminal to a white space server, and acquires, from the white space server, information about an available white space radio station. The offloading unit sends the information about the available white space radio station to the user terminal, and also sends information about the user terminal to the available white space radio station.
摘要:
A method and an apparatus for digital up-down conversion using an Infinite Impulse Response (IIR) filter are provided. The method for digital up-down conversion for frequency conversion in a mobile communication system using plural frequency converts, includes IIR-filtering, by a magnitude response IIR filter having the same magnitude response as in Finite Impulse Response (FIR) filtering, an input signal and a stable filter coefficient calculated according to a Levinson polynomial; and receiving, by the magnitude response IIR filter, the IIR filtered signal, and performing IIR filtering by a phase compensation IIR filter having a filter coefficient compensating for a non-linear phase to a linear phase.
摘要:
A system for designing a semiconductor package using a computing system, comprising: a virtual stacking module configured to receive a layout parameter for a first chip, a layout parameter for a second chip, and a layout parameter for a package substrate, and in response to the layout parameters of the first chip, the second chip, and the package substrate, generate a plurality of virtual layouts in which the first and second chips are stacked, on the package substrate; a modeling module configured to model operating parameters for the first and second chips and the package substrate in response to the virtual layouts; and a characteristic analyzing module configured to analyze operating characteristics of the virtual layouts in response to the modeled operating parameters.