公开(公告)号：US20080203393A1

公开(公告)日：2008-08-28

申请号：US12099718

申请日：2008-04-08

申请人： Sang-Gab KIM ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

发明人： Sang-Gab KIM ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

IPC分类号： H01L27/088

CPC分类号： H01L27/124 ,  G02F2001/13629 ,  H01L29/458

摘要： The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

摘要翻译： 本发明提供一种薄膜晶体管阵列面板的制造方法，其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层，半导体层和欧姆接触; 形成包括Mo的第一导电膜，包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜，欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

公开(公告)号：US08173493B2

公开(公告)日：2012-05-08

申请号：US12765698

申请日：2010-04-22

申请人： Sang-Gab Kim ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

发明人： Sang-Gab Kim ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

IPC分类号： H01L21/00 ,  H01L21/84

CPC分类号： H01L27/124 ,  G02F2001/13629 ,  H01L29/458

摘要： The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

摘要翻译： 本发明提供一种薄膜晶体管阵列面板的制造方法，其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层，半导体层和欧姆接触; 形成包括Mo的第一导电膜，包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜，欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

公开(公告)号：US20100203715A1

公开(公告)日：2010-08-12

申请号：US12765698

申请日：2010-04-22

申请人： Sang-Gab KIM ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

发明人： Sang-Gab KIM ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

IPC分类号： H01L21/28

CPC分类号： H01L27/124 ,  G02F2001/13629 ,  H01L29/458

摘要： The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

摘要翻译： 本发明提供一种薄膜晶体管阵列面板的制造方法，其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层，半导体层和欧姆接触; 形成包括Mo的第一导电膜，包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜，欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

公开(公告)号：US07888675B2

公开(公告)日：2011-02-15

申请号：US12099718

申请日：2008-04-08

申请人： Sang-Gab Kim ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

发明人： Sang-Gab Kim ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

IPC分类号： H01L21/00

CPC分类号： H01L27/124 ,  G02F2001/13629 ,  H01L29/458

摘要： The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

摘要翻译： 本发明提供一种薄膜晶体管阵列面板的制造方法，其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层，半导体层和欧姆接触; 形成包括Mo的第一导电膜，包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜，欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

公开(公告)号：US07371621B2

公开(公告)日：2008-05-13

申请号：US11486330

申请日：2006-07-12

申请人： Sang-Gab Kim ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

发明人： Sang-Gab Kim ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

IPC分类号： H01L21/00

CPC分类号： H01L27/124 ,  G02F2001/13629 ,  H01L29/458

摘要： The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

摘要翻译： 本发明提供一种薄膜晶体管阵列面板的制造方法，其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层，半导体层和欧姆接触; 形成包括Mo的第一导电膜，包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜，欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

公开(公告)号：US20070096100A1

公开(公告)日：2007-05-03

申请号：US11584113

申请日：2006-10-20

申请人： Woo-Geun Lee ,  Jin-Ho Ju

发明人： Woo-Geun Lee ,  Jin-Ho Ju

IPC分类号： H01L29/04 ,  H01L21/84

CPC分类号： H01L29/78618 ,  H01L27/12 ,  H01L27/124 ,  H01L27/1288 ,  H01L29/04 ,  H01L29/458 ,  H01L29/66765 ,  H01L29/78696

摘要： A thin film transistor according to an embodiment of the present invention includes: a substrate; a control electrode disposed on the substrate; a gate insulating layer disposed on the control electrode; a semiconductor member disposed on the gate insulating layer, overlapping the control electrode, and including a first portion of amorphous silicon and a second portion of polycrystalline silicon; an input electrode contacting the semiconductor member; and an output electrode contacting the semiconductor member.

摘要翻译： 根据本发明实施例的薄膜晶体管包括：衬底; 设置在所述基板上的控制电极; 设置在所述控制电极上的栅极绝缘层; 设置在所述栅极绝缘层上的半导体部件，与所述控制电极重叠，并且包括第一部分非晶硅和第二部分多晶硅; 接触半导体部件的输入电极; 以及与半导体部件接触的输出电极。

公开(公告)号：US20070012967A1

公开(公告)日：2007-01-18

申请号：US11486330

申请日：2006-07-12

申请人： Sang-Gab Kim ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

发明人： Sang-Gab Kim ,  Woo-Geun Lee ,  Shi-Yul Kim ,  Jin-Ho Ju ,  Jang-Soo Kim ,  Sang-Woo Whangbo ,  Min-Seok Oh ,  Hye-Young Ryu ,  Hong-Kee Chin

IPC分类号： H01L31/113

CPC分类号： H01L27/124 ,  G02F2001/13629 ,  H01L29/458

摘要： The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

摘要翻译： 本发明提供一种薄膜晶体管阵列面板的制造方法，其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层，半导体层和欧姆接触; 形成包括Mo的第一导电膜，包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜，欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一，第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

公开(公告)号：US08796675B2

公开(公告)日：2014-08-05

申请号：US13613566

申请日：2012-09-13

申请人： Je-Hun Lee ,  Ki-Won Kim ,  Do-Hyun Kim ,  Woo-Geun Lee ,  Kap-Soo Yoon

发明人： Je-Hun Lee ,  Ki-Won Kim ,  Do-Hyun Kim ,  Woo-Geun Lee ,  Kap-Soo Yoon

IPC分类号： H01L35/24

CPC分类号： H01L27/1225 ,  H01L21/0214 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02554 ,  H01L21/02565 ,  H01L23/53238 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/1262 ,  H01L29/45 ,  H01L29/4908 ,  H01L29/513 ,  H01L29/518 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/7869 ,  H01L2924/0002 ,  H01L2924/00

摘要： A TFT array substrate includes a semiconductive oxide layer disposed on an insulating substrate and including a channel portion, a gate electrode overlapping the semiconductive oxide layer, a gate insulating layer interposed between the semiconductive oxide layer and the gate electrode, and a passivation layer disposed on the semiconductive oxide layer and the gate electrode. At least one of the gate insulating layer and the passivation layer includes an oxynitride layer, and the oxynitride layer has a higher concentration of oxygen than that of nitrogen in a location of the oxynitride layer closer to the semiconductive oxide layer.

摘要翻译： TFT阵列基板包括设置在绝缘基板上并包括沟道部分的半导体氧化物层，与半导体氧化物层重叠的栅极电极，插入在半导体氧化物层和栅电极之间的栅极绝缘层，以及设置在 半导体氧化物层和栅电极。 栅极绝缘层和钝化层中的至少一个包括氧氮化物层，并且氧氮化物层在氧氮化物层的位置更靠近半导体氧化物层的位置处具有比氮的浓度高的氧氮化物层。

公开(公告)号：US08735890B2

公开(公告)日：2014-05-27

申请号：US13328658

申请日：2011-12-16

申请人： Ki-Won Kim ,  Je-Hun Lee ,  Sung-Haeng Cho ,  Woo-Geun Lee ,  Kap-Soo Yoon ,  Do-Hyun Kim ,  Seung-Ha Choi

发明人： Ki-Won Kim ,  Je-Hun Lee ,  Sung-Haeng Cho ,  Woo-Geun Lee ,  Kap-Soo Yoon ,  Do-Hyun Kim ,  Seung-Ha Choi

IPC分类号： H01L29/786

CPC分类号： H01L27/1225 ,  H01L27/1288

摘要： In a display substrate and a method of manufacturing the display substrate, the display substrate includes a data line, a channel pattern, an insulating pattern and a pixel electrode. The data line extends in a direction on a base substrate. The channel pattern is disposed in a separate region between an input electrode connected to the data line and an output electrode spaced apart from the input electrode. The channel pattern makes contact with the input electrode and the output electrode on the input and output electrodes. The insulating pattern is spaced apart from the channel pattern on the base substrate and includes a contact hole exposing the output electrode. The pixel electrode is formed on the insulating pattern to make contact with the output electrode through the contact hole. Thus, a damage of the oxide semiconductor layer may be minimized and a manufacturing process may be simplified.

摘要翻译： 在显示基板和显示基板的制造方法中，显示基板包括数据线，通道图案，绝缘图案和像素电极。 数据线沿着基底基板上的方向延伸。 通道图案设置在与数据线连接的输入电极和与输入电极间隔开的输出电极之间的分离区域中。 通道图案与输入电极和输出电极上的输出电极接触。 绝缘图案与基底基板上的沟道图案间隔开，并且包括暴露输出电极的接触孔。 像素电极形成在绝缘图案上，以通过接触孔与输出电极接触。 因此，可以使氧化物半导体层的损伤最小化，并且可以简化制造工艺。

公开(公告)号：US08624238B2

公开(公告)日：2014-01-07

申请号：US13004665

申请日：2011-01-11

申请人： Jong-In Kim ,  Young-Wook Lee ,  Jean-Ho Song ,  Jae-Hyoung Yoon ,  Sung-Ryul Kim ,  Byeong-Beom Kim ,  Je-Hyeong Park ,  Woo-Geun Lee

发明人： Jong-In Kim ,  Young-Wook Lee ,  Jean-Ho Song ,  Jae-Hyoung Yoon ,  Sung-Ryul Kim ,  Byeong-Beom Kim ,  Je-Hyeong Park ,  Woo-Geun Lee

IPC分类号： H01L21/34 ,  H01L29/786

CPC分类号： H01L27/1225 ,  H01L27/124 ,  H01L27/1288

摘要： A thin-film transistor (TFT) substrate having reduced defects is fabricated using a reduced number of masks. The TFT substrate includes gate wiring formed on a substrate. The gate wiring includes a gate electrode. A semiconductor pattern is formed on the gate wiring. An etch-stop pattern is formed on the semiconductor pattern. Data wiring includes a source electrode which is formed on the semiconductor pattern and the etch-stop pattern. Each of the gate wiring and the data wiring includes a copper-containing layer and a buffer layer formed on or under the copper-containing layer.

摘要翻译： 使用减少数量的掩模制造具有减少的缺陷的薄膜晶体管（TFT）基板。 TFT基板包括形成在基板上的栅极布线。 栅极布线包括栅电极。 在栅极布线上形成半导体图形。 在半导体图案上形成蚀刻停止图案。 数据布线包括形成在半导体图案上的源电极和蚀刻停止图案。 栅极布线和数据布线中的每一个包括在含铜层上形成的含铜层和缓冲层。