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公开(公告)号:US12024591B2
公开(公告)日:2024-07-02
申请号:US18459383
申请日:2023-08-31
发明人: De Wu , Yi Wang , Shuhang Liao , Junxing Su
IPC分类号: C08F212/08 , C08F232/08 , C08G65/48 , C08G81/02 , C08J5/18 , C08K7/18 , C08L71/12
CPC分类号: C08G65/485 , C08J5/18 , C08K7/18 , C08L71/126 , C08F212/08 , C08F232/08 , C08G81/025 , C08G2261/126 , C08J2353/00 , C08J2371/12 , C08L2203/16
摘要: The present disclosure provides a method for modifying a polyphenylene ether resin, a laminated film composite, a laminated film, and a substrate. The method for modifying a polyphenylene ether resin using an indene oligomer to reduce the molecular weight of the polyphenylene ether to obtain an indene oligomer-modified polyphenylene ether resin. The modified polyphenylene ether with a smaller molecular weight has a lower softening point and melting point, a better interfacial adhesion, and can be better adhered to a substrate of an integrated circuit. Meanwhile, because it has a lower dielectric constant and dielectric loss, the dielectric constant and dielectric loss of the substrate can be reduced, thereby solving the technical problem of electric leakage and heat generation caused when the existing polyphenylene ether resin is applied to an integrated circuit when the feature size of the integrated circuit is reduced.
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公开(公告)号:US11767450B2
公开(公告)日:2023-09-26
申请号:US18307588
申请日:2023-04-26
发明人: De Wu , Shuhang Liao , Ting Li , Yi Wang , Junxing Su
IPC分类号: C09J163/00 , C09J11/08 , C09J11/06
CPC分类号: C09J163/00 , C09J11/06 , C09J11/08 , C09J2301/312
摘要: Embodiments of the present application disclose an adhesive, a die attach film and a preparation method therefor, and relate to the technical field of chip packaging. The adhesive includes epoxy resin, phenoxy resin, an indene oligomer, filler and a curing agent; and 20-60 parts of the epoxy resin, 20-30 parts of the phenoxy resin, 5-10 parts of the indene oligomer, 15-30 parts of the filler and 1-5 parts of the curing agent are provided in parts by mass. The present application further provides the die attach film and the preparation method therefor. In the adhesive provided by the present application, the epoxy resin, the phenoxy resin and the indene oligomer are used as curable substrates to improve a thermal stress obtained after the adhesive is cured, so that the die attach film prepared therefrom is not easy to warp in a temperature change process.
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公开(公告)号:US11286386B1
公开(公告)日:2022-03-29
申请号:US17509175
申请日:2021-10-25
发明人: De Wu , Shuhang Liao , Yi Wang , Junxing Su , Feifei Liang
摘要: A circuit build-up film for wafer-level packaging (WLP) includes 40 to 60 parts by mass of a first epoxy resin, 15 to 30 parts by mass of a second epoxy resin, 25 to 50 parts by mass of a curing agent, 0.1 to 5 parts by mass of a curing accelerator, 5 to 20 parts by mass of an additive, 320 to 650 parts by mass of an inorganic filler, and 0.01 to 5 parts by mass of a silane coupling agent (SCA), where the additive is obtained by subjecting an epoxy resin to a reaction with a polyhydroxyl-terminated dendritic crosslinking agent. The build-up film shows prominent fluidity during heating and curing, and can completely fill gaps among wafers. A packaging process using the build-up film is simple. Regardless of the number of wafers, packaging can be completed through one procedure with the build-up film.
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公开(公告)号:US11978686B2
公开(公告)日:2024-05-07
申请号:US18459006
申请日:2023-08-30
发明人: De Wu , Shuhang Liao , Liu Zhang , Junxing Su
CPC分类号: H01L23/295 , H01L21/56
摘要: Disclosed are a chip protective film, a method for manufacturing the same, and a chip, which relate to the technical field of electronic chip protective films. The chip protective film includes: a first protective layer, and a second protective layer attached to at least a portion of a surface of the first protective layer. The second protective layer includes by mass: 90%-97% acrylate compounds; 0.1-5% fluorine-containing compounds; and a second adjuvant. The chip protective film features strong adhesion, low friction coefficient, high hardness, and good scratch resistance, which effectively solves the technical problem in the prior art that chip protective films are not scratch resistant.
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公开(公告)号:US11879076B1
公开(公告)日:2024-01-23
申请号:US18307765
申请日:2023-04-26
发明人: De Wu , Shuhang Liao , Ting Li , Junxing Su
IPC分类号: C09J163/00 , C08L63/00 , C08G59/38 , C08G59/62 , H01L23/29 , C09J7/30 , C09J11/04 , C09J11/06
CPC分类号: C09J163/00 , C09J7/30 , C09J11/04 , C09J11/06
摘要: The present application discloses a composition, an adhesive film including the composition and a chip packaging structure. The composition includes epoxy resin, a surfactant, a curing agent and filler, wherein the surfactant is selected from a modified hexafluoropropylene compound. The surfactant in the composition is the modified hexafluoropropylene compound, the modified hexafluoropropylene compound is lower in surface energy, good in water resistance and oil resistance and capable of effectively lowering the surface tension of the composition, and therefore, when being used for preparing the adhesive film, the composition is higher in coating wettability. In, addition, the composition has stronger chemical cleaning resistance, and in a process that a residual solder flux obtained in a soldering process of a chip is cleaned, a chip protection film prepared from the composition has stronger cleaning resistance to an alkaline solution so as not to be easy to fall off.
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公开(公告)号:US12098230B2
公开(公告)日:2024-09-24
申请号:US18523968
申请日:2023-11-30
发明人: De Wu , Yi Wang , Shuhang Liao , Junxing Su
IPC分类号: C08J5/18 , C08F283/00 , C08F283/04 , C08G73/12 , C08K3/36 , H05K3/22
CPC分类号: C08F283/00 , C08F283/045 , C08G73/12 , C08J5/18 , C08K3/36 , H05K3/22 , C08J2351/08
摘要: A build-up film with low dielectric loss, a preparation method therefor, and a circuit substrate structure are provided. The build-up film is prepared from raw materials including 5-10 parts by mass of monofunctional benzoxazine having indene oligomer, 40-65 parts by mass of polymerized aromatic-based maleimide, 30-50 parts by mass of allyl benzoxazine, 0.1-3 parts by mass of initiator, 250-400 parts by mass of inorganic filler, and 0.1-5 parts by mass of silane coupling agent. The build-up film has low dielectric loss and high tensile strength. Low dielectric loss enables it to be applied in the field of 5G. For example, the build-up film can be used to packaging integrated circuit substrates, which is conducive to minimizing the transmission loss.
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公开(公告)号:US11804463B2
公开(公告)日:2023-10-31
申请号:US18307569
申请日:2023-04-26
发明人: De Wu , Shengquan Wang , Yi Wang , Shuhang Liao , Junxing Su
IPC分类号: H01L23/00 , C08G59/40 , C08L63/00 , C09J163/00 , C08G59/62 , C09J11/04 , H01L23/29 , C08K3/36
CPC分类号: H01L24/29 , C08G59/4007 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16221 , H01L2224/2929 , H01L2224/29387 , H01L2224/32221 , H01L2224/73204 , H01L2924/0665
摘要: The present application discloses an underfill for chip packaging, including 19-25% of epoxy resin, 55-60% of filler, 15-25% of curing agent and 0.5-0.8% of accelerator in mass percentage, wherein the curing agent includes a polycondensate of paraxylene and dihydroxynaphthalene and a polycondensate of paraxylene and naphthol. Both of the polycondensate of paraxylene and dihydroxynaphthalene and the polycondensate of paraxylene and naphthol are selected to be used in the underfill for chip packaging in the present application, so that the underfill has stronger adhesiveness after being cured. In addition, the present application further provides a chip packaging structure using the underfill.
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