公开(公告)号：US20180286734A1

公开(公告)日：2018-10-04

申请号：US15937450

申请日：2018-03-27

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Brook Raymond ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Salvatore Bonafede ,  Erich Radauscher ,  Carl Ray Prevatte, JR. ,  António José Marques Trindade ,  Tanya Yvette Moore

IPC: H01L21/683 ,  H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/91 ,  B32B37/00

Abstract: A method of micro-transfer printing a micro-device from a support substrate comprises providing the micro-device, forming a pocket in or on the support substrate, providing a release layer over the micro-device or the pocket, optionally providing a base layer on a side of the release layer opposite the micro-device, disposing the micro-device in the pocket with the release layer between the micro-device and the support substrate so that no portion of the support substrate or the optional base layer is in contact with the micro-device, etching the release layer to completely separate the micro-device from the support substrate or the optional base layer, providing a stamp having a conformable stamp post and pressing the stamp post against the separated micro-device to adhere the micro-device to the stamp post, and removing the stamp and micro-device from the support substrate.

公开(公告)号：US20200052176A1

公开(公告)日：2020-02-13

申请号：US16660776

申请日：2019-10-22

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Tanya Yvette Moore ,  Ronald S. Cok ,  Salvatore Bonafede ,  Brook Raymond ,  Christopher Andrew Bower ,  Carl Ray Prevatte, JR.

IPC: H01L33/62 ,  H01L33/48

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.

公开(公告)号：US10510937B2

公开(公告)日：2019-12-17

申请号：US16186173

申请日：2018-11-09

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Tanya Yvette Moore ,  Ronald S. Cok ,  Salvatore Bonafede ,  Brook Raymond ,  Christopher Andrew Bower ,  Carl Ray Prevatte, Jr.

IPC: H01L23/538 ,  H01L41/083 ,  H01L23/12 ,  H01L33/62 ,  H01L33/48 ,  H01L41/047 ,  H01L25/065

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.

公开(公告)号：US20170173852A1

公开(公告)日：2017-06-22

申请号：US14975041

申请日：2015-12-18

Applicant: X-Celeprint Limited

Inventor： Tanya Yvette Moore ,  Ronald S. Cok ,  David Gomez

IPC: B29C59/02 ,  B29C59/00

CPC classification number: B29C59/026 ,  B29C59/002 ,  B29C59/02 ,  B29C2059/023 ,  B29C2059/028 ,  B29L2007/001 ,  B29L2031/34 ,  B41F16/00 ,  B41F17/00 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/81 ,  H01L24/95 ,  H01L2224/81005 ,  H01L2224/81345 ,  H01L2224/81901 ,  H01L2224/81986

Abstract: A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.

公开(公告)号：US20180323178A1

公开(公告)日：2018-11-08

申请号：US16039191

申请日：2018-07-18

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Brook Raymond ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Salvatore Bonafede ,  Erich Radauscher ,  Carl Ray Prevatte, Jr. ,  António José Marques Trindade ,  Tanya Yvette Moore

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L25/041 ,  H01L25/072 ,  H01L25/50 ,  H01L33/0095 ,  H01L33/62

Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.

公开(公告)号：US20190157532A1

公开(公告)日：2019-05-23

申请号：US16186173

申请日：2018-11-09

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Tanya Yvette Moore ,  Ronald S. Cok ,  Salvatore Bonafede ,  Brook Raymond ,  Christopher Andrew Bower ,  Carl Ray Prevatte, JR.

IPC: H01L33/62 ,  H01L33/48

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electrical component over the substrate surface to electrically contact the connection post to the notch conductor.