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公开(公告)号：US20140091819A1
公开(公告)日：2014-04-03
申请号：US13630215
申请日：2012-09-28
Applicant: XILINX, INC.
Inventor： Yuqing Gong , Henley Liu , Myongseob Kim , Suresh P. Parameswaran , Cheang-Whang Chang , Boon Y. Ang
IPC: G01R31/3187
CPC classification number: G01R31/31926 , G01R31/2812 , G01R31/31717 , G01R31/31723 , H01L2224/16225 , H01L2924/15311
Abstract: An integrated circuit (IC) comprises routing circuitry including a plurality of signal line segments in routing layers of the IC, and a plurality of micro-bump contacts coupled to the routing circuitry. The IC includes a plurality of test circuits coupled to respective subsets of the plurality of signal line segments. Each test circuit is configured to connect micro-bump contacts in the respective subset to form first and second sets of daisy chains. Each test circuit is configured to test the first and second sets of daisy chains for open circuits and test for short circuits between the first and second sets of daisy chains. Each test circuit is configured to determine the locations of detected open circuits and determine the locations of detected short circuits.
Abstract translation: 集成电路（IC）包括路由电路，其包括在IC的路由层中的多个信号线段以及耦合到路由电路的多个微突点接触。 IC包括耦合到多个信号线段的相应子集的多个测试电路。 每个测试电路被配置为连接相应子集中的微凸块触点以形成第一组和第二组菊花链。 每个测试电路被配置为测试用于开路的第一和第二组菊花链，并测试第一组和第二组菊花链之间的短路。 每个测试电路被配置为确定检测到的开路的位置并确定检测到的短路的位置。
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公开(公告)号：US08810269B2
公开(公告)日：2014-08-19
申请号：US13630215
申请日：2012-09-28
Applicant: Xilinx, Inc.
Inventor： Yuqing Gong , Henley Liu , Myongseob Kim , Suresh P. Parameswaran , Cheang-Whang Chang , Boon Y. Ang
IPC: G01R31/3187
CPC classification number: G01R31/31926 , G01R31/2812 , G01R31/31717 , G01R31/31723 , H01L2224/16225 , H01L2924/15311
Abstract: An integrated circuit (IC) comprises routing circuitry including a plurality of signal line segments in routing layers of the IC, and a plurality of micro-bump contacts coupled to the routing circuitry. The IC includes a plurality of test circuits coupled to respective subsets of the plurality of signal line segments. Each test circuit is configured to connect micro-bump contacts in the respective subset to form first and second sets of daisy chains. Each test circuit is configured to test the first and second sets of daisy chains for open circuits and test for short circuits between the first and second sets of daisy chains. Each test circuit is configured to determine the locations of detected open circuits and determine the locations of detected short circuits.
Abstract translation: 集成电路（IC）包括路由电路，其包括在IC的路由层中的多个信号线段以及耦合到路由电路的多个微突点接触。 IC包括耦合到多个信号线段的相应子集的多个测试电路。 每个测试电路被配置为连接相应子集中的微凸块触点以形成第一组和第二组菊花链。 每个测试电路被配置为测试用于开路的第一和第二组菊花链，并测试第一组和第二组菊花链之间的短路。 每个测试电路被配置为确定检测到的开路的位置并确定检测到的短路的位置。
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公开(公告)号：US10262911B1
公开(公告)日：2019-04-16
申请号：US15379258
申请日：2016-12-14
Applicant: Xilinx, Inc.
Inventor： Yuqing Gong , Henley Liu , Myongseob Kim , Suresh P. Parameswaran , Cheang-Whang Chang , Boon Y. Ang
Abstract: A circuit for testing bond connections between a first die and a second die is described. The circuit comprises a defect monitoring circuit implemented on the first die, which is configured as a test die; and a plurality of bond connections between the first die and the second die; wherein the defect monitoring circuit is configured to detect a defect in a bond connection of the plurality of bond connections between the first die and the second die. A method of testing bond connections between a first die and a second die is also described.
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公开(公告)号：US10302504B1
公开(公告)日：2019-05-28
申请号：US15418544
申请日：2017-01-27
Applicant: Xilinx, Inc.
Inventor： Suresh P. Parameswaran , Boon Y. Ang , Ankur Jain
Abstract: The disclosure provides simple, low-cost but accurate systems and related methods for on-die temperature sensing typically using calibration and without the need for precision voltage references. In some implementations, the system utilizes two user selectable temperature sensing elements and two user selectable DACs to provide a digital code for the sensed temperature. In some implementations, the two sensing elements can be used to calibrate against each other. For example, calibration can be useful to account for silicon local/global variation. Typically, one of the temperature sensors is diode-based, while the other is resistor-based. However, those of skill in the art will recognize that, in accordance with the disclosure, more than two sensors can be provided that can be calibrated against one another.
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