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公开(公告)号：US20120235253A1
公开(公告)日：2012-09-20
申请号：US13465213
申请日：2012-05-07
申请人： Xiaojie Xue , Carl Raleigh , Thomas M. Goida
发明人： Xiaojie Xue , Carl Raleigh , Thomas M. Goida
IPC分类号： H01L29/84 , H01L23/495
CPC分类号： B81B7/0048 , B81B7/0074 , B81B2207/012 , B81B2207/095 , H01L2924/0002 , H01L2924/00
摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.
摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。
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公开(公告)号：US08174111B2
公开(公告)日：2012-05-08
申请号：US12570950
申请日：2009-09-30
申请人： Xiaojie Xue , Carl Raleigh , Thomas M. Goida
发明人： Xiaojie Xue , Carl Raleigh , Thomas M. Goida
IPC分类号： H01L29/72
CPC分类号： B81B7/0048 , B81B7/0074 , B81B2207/012 , B81B2207/095 , H01L2924/0002 , H01L2924/00
摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.
摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。
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公开(公告)号：US08624380B2
公开(公告)日：2014-01-07
申请号：US13465213
申请日：2012-05-07
申请人： Xiaojie Xue , Carl Raleigh , Thomas M. Goida
发明人： Xiaojie Xue , Carl Raleigh , Thomas M. Goida
IPC分类号： H01L29/72
CPC分类号： B81B7/0048 , B81B7/0074 , B81B2207/012 , B81B2207/095 , H01L2924/0002 , H01L2924/00
摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.
摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。
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公开(公告)号：US08692366B2
公开(公告)日：2014-04-08
申请号：US13085294
申请日：2011-04-12
申请人： Xiaojie Xue , Carl Raleigh
发明人： Xiaojie Xue , Carl Raleigh
IPC分类号： H01L23/48
CPC分类号： B81B7/0074 , H01L2224/48091 , H01L2924/00014
摘要： A MEMS package includes a substrate having an L-shaped cross-section. The substrate includes a vertical portion having a front surface and a back surface, and a horizontal portion protruding from a lower part of the front surface of the vertical portion, wherein the front surface of the vertical portion includes a mounting region. A MEMS die is mounted on the mounting region such that the MEMS die is oriented substantially parallel to the front surface; a lid attached to the front surface of the substrate while covering the MEMS die; and a plurality of leads formed on a bottom surface of the substrate. The leads can extend substantially parallel to one another, and substantially perpendicular to the front surface. The MEMS die can be oriented substantially perpendicular to a PCB substrate on which the package is mounted.
摘要翻译： MEMS封装包括具有L形横截面的衬底。 基板包括具有前表面和后表面的垂直部分和从垂直部分的前表面的下部突出的水平部分，其中垂直部分的前表面包括安装区域。 MEMS管芯安装在安装区域上，使得MEMS管芯基本上平行于前表面定向; 在覆盖MEMS芯片的同时，附接到基板的前表面的盖子; 以及形成在所述基板的底表面上的多个引线。 引线可以基本上彼此平行地延伸并且基本上垂直于前表面延伸。 MEMS管芯可以基本上垂直于其上安装封装件的PCB基板定向。
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公开(公告)号：US20100078739A1
公开(公告)日：2010-04-01
申请号：US12570950
申请日：2009-09-30
申请人： Xiaojie Xue , Carl Raleigh
发明人： Xiaojie Xue , Carl Raleigh
CPC分类号： B81B7/0048 , B81B7/0074 , B81B2207/012 , B81B2207/095 , H01L2924/0002 , H01L2924/00
摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.
摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。
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公开(公告)号：US20130256896A1
公开(公告)日：2013-10-03
申请号：US13438370
申请日：2012-04-03
申请人： Xiaojie Xue
发明人： Xiaojie Xue
CPC分类号： B81B7/0077 , B81B2201/0242 , B81B2201/025 , B81B2207/095 , B81B2207/096 , B81C1/00325 , B81C1/00333 , B81C1/00873 , B81C2203/0118 , H01L21/50 , H01L23/041 , H01L23/49805 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/48227 , H01L2224/97 , H01L2924/0002 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/85 , H01L2224/81
摘要： Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias. MEMS devices or integrated circuits are formed or mounted onto the device regions. A capping substrate having recesses is mounted over the device substrate, enclosing the device regions within cavities defined by the recesses. A plurality of aligned through-wafer contacts extend through the capping substrate and the device substrate. The device substrate and capping substrate can be singulated by cutting through the aligned through-wafer contacts, with the severed through-wafer contacts forming vertical mount leads. A vertical mount package includes a device sealed between a device substrate and a capping substrate. At least of the side edges of the package includes exposed conductive elements for vertical mount leads.
摘要翻译： 公开了垂直安装封装及其制造方法。 一种用于制造垂直安装封装的方法包括：在前表面上提供具有多个器件区域的器件基板，以及多个贯通晶片通孔。 MEMS器件或集成电路形成或安装到器件区域上。 具有凹槽的封盖基板安装在器件基板上，将器件区域包围在由凹槽限定的空腔内。 多个对准的跨晶片触点延伸穿过封盖衬底和器件衬底。 可以通过切割对准的通过晶片的触点来切割器件衬底和封盖衬底，切断的晶片接触件形成垂直安装引线。 垂直安装封装包括密封在器件基板和封盖基板之间的器件。 封装的至少侧边缘包括用于垂直安装引线的露出的导电元件。
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公开(公告)号：US08836132B2
公开(公告)日：2014-09-16
申请号：US13438370
申请日：2012-04-03
申请人： Xiaojie Xue
发明人： Xiaojie Xue
IPC分类号： H01L23/48
CPC分类号： B81B7/0077 , B81B2201/0242 , B81B2201/025 , B81B2207/095 , B81B2207/096 , B81C1/00325 , B81C1/00333 , B81C1/00873 , B81C2203/0118 , H01L21/50 , H01L23/041 , H01L23/49805 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/48227 , H01L2224/97 , H01L2924/0002 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/85 , H01L2224/81
摘要： Vertical mount packages and methods for making the same are disclosed. A method for manufacturing a vertical mount package includes providing a device substrate with a plurality of device regions on a front surface, and a plurality of through-wafer vias. MEMS devices or integrated circuits are formed or mounted onto the device regions. A capping substrate having recesses is mounted over the device substrate, enclosing the device regions within cavities defined by the recesses. A plurality of aligned through-wafer contacts extend through the capping substrate and the device substrate. The device substrate and capping substrate can be singulated by cutting through the aligned through-wafer contacts, with the severed through-wafer contacts forming vertical mount leads. A vertical mount package includes a device sealed between a device substrate and a capping substrate. At least of the side edges of the package includes exposed conductive elements for vertical mount leads.
摘要翻译： 公开了垂直安装封装及其制造方法。 一种用于制造垂直安装封装的方法包括：在前表面上提供具有多个器件区域的器件基板，以及多个贯通晶片通孔。 MEMS器件或集成电路形成或安装到器件区域上。 具有凹槽的封盖基板安装在器件基板上，将器件区域包围在由凹槽限定的空腔内。 多个对准的跨晶片触点延伸穿过封盖衬底和器件衬底。 可以通过切割对准的通过晶片的触点来切割器件衬底和封盖衬底，切断的晶片接触件形成垂直安装引线。 垂直安装封装包括密封在器件基板和封盖基板之间的器件。 封装的至少侧边缘包括用于垂直安装引线的露出的导电元件。
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公开(公告)号：US20120080764A1
公开(公告)日：2012-04-05
申请号：US13085294
申请日：2011-04-12
申请人： Xiaojie Xue
发明人： Xiaojie Xue
CPC分类号： B81B7/0074 , H01L2224/48091 , H01L2924/00014
摘要： A MEMS package includes a substrate having an L-shaped cross-section. The substrate includes a vertical portion having a front surface and a back surface, and a horizontal portion protruding from a lower part of the front surface of the vertical portion, wherein the front surface of the vertical portion includes a mounting region. A MEMS die is mounted on the mounting region such that the MEMS die is oriented substantially parallel to the front surface; a lid attached to the front surface of the substrate while covering the MEMS die; and a plurality of leads formed on a bottom surface of the substrate. The leads can extend substantially parallel to one another, and substantially perpendicular to the front surface. The MEMS die can be oriented substantially perpendicular to a PCB substrate on which the package is mounted.
摘要翻译： MEMS封装包括具有L形横截面的衬底。 基板包括具有前表面和后表面的垂直部分和从垂直部分的前表面的下部突出的水平部分，其中垂直部分的前表面包括安装区域。 MEMS管芯安装在安装区域上，使得MEMS管芯基本上平行于前表面定向; 在覆盖MEMS芯片的同时，附接到基板的前表面的盖子; 以及形成在所述基板的底表面上的多个引线。 引线可以基本上彼此平行地延伸并且基本上垂直于前表面延伸。 MEMS管芯可以基本上垂直于其上安装封装件的PCB基板定向。
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