公开(公告)号：US08624380B2

公开(公告)日：2014-01-07

申请号：US13465213

申请日：2012-05-07

申请人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

发明人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

IPC分类号： H01L29/72

CPC分类号： B81B7/0048 ,  B81B7/0074 ,  B81B2207/012 ,  B81B2207/095 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.

摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。

公开(公告)号：US08174111B2

公开(公告)日：2012-05-08

申请号：US12570950

申请日：2009-09-30

申请人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

发明人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

IPC分类号： H01L29/72

CPC分类号： B81B7/0048 ,  B81B7/0074 ,  B81B2207/012 ,  B81B2207/095 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.

摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。

公开(公告)号：US20120235253A1

公开(公告)日：2012-09-20

申请号：US13465213

申请日：2012-05-07

申请人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

发明人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

IPC分类号： H01L29/84 ,  H01L23/495

CPC分类号： B81B7/0048 ,  B81B7/0074 ,  B81B2207/012 ,  B81B2207/095 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.

摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。

公开(公告)号：US08692366B2

公开(公告)日：2014-04-08

申请号：US13085294

申请日：2011-04-12

申请人： Xiaojie Xue ,  Carl Raleigh

发明人： Xiaojie Xue ,  Carl Raleigh

IPC分类号： H01L23/48

CPC分类号： B81B7/0074 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A MEMS package includes a substrate having an L-shaped cross-section. The substrate includes a vertical portion having a front surface and a back surface, and a horizontal portion protruding from a lower part of the front surface of the vertical portion, wherein the front surface of the vertical portion includes a mounting region. A MEMS die is mounted on the mounting region such that the MEMS die is oriented substantially parallel to the front surface; a lid attached to the front surface of the substrate while covering the MEMS die; and a plurality of leads formed on a bottom surface of the substrate. The leads can extend substantially parallel to one another, and substantially perpendicular to the front surface. The MEMS die can be oriented substantially perpendicular to a PCB substrate on which the package is mounted.

摘要翻译： MEMS封装包括具有L形横截面的衬底。 基板包括具有前表面和后表面的垂直部分和从垂直部分的前表面的下部突出的水平部分，其中垂直部分的前表面包括安装区域。 MEMS管芯安装在安装区域上，使得MEMS管芯基本上平行于前表面定向; 在覆盖MEMS芯片的同时，附接到基板的前表面的盖子; 以及形成在所述基板的底表面上的多个引线。 引线可以基本上彼此平行地延伸并且基本上垂直于前表面延伸。 MEMS管芯可以基本上垂直于其上安装封装件的PCB基板定向。

公开(公告)号：US20100078739A1

公开(公告)日：2010-04-01

申请号：US12570950

申请日：2009-09-30

申请人： Xiaojie Xue ,  Carl Raleigh

发明人： Xiaojie Xue ,  Carl Raleigh

IPC分类号： H01L29/84 ,  H01L23/48 ,  H01L21/60

CPC分类号： B81B7/0048 ,  B81B7/0074 ,  B81B2207/012 ,  B81B2207/095 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.

摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。

公开(公告)号：US06300167B1

公开(公告)日：2001-10-09

申请号：US08354384

申请日：1994-12-12

申请人： Carl Raleigh ,  William C. Roman

发明人： Carl Raleigh ,  William C. Roman

IPC分类号： H01L2144

CPC分类号： H01L24/83 ,  H01L23/3736 ,  H01L24/32 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor device having a heat spreading layer (18,118) of material deposited by flame spraying on a back surface of the semiconductor die (12,112). The semiconductor die (12,112) has a thermal coefficient of expansion substantially similar to the thermal coefficient of expansion of the flame sprayed material. The flame sprayed material may be deposited directly on the semiconductor die (12,112) or on a backmetal layer (15). The heat spreading layer (18,118) is suitable for affixing the semiconductor die (12,112) to a metal substrate (27,127).

摘要翻译： 一种半导体器件，其具有通过火焰喷涂沉积在半导体管芯（12,112）的后表面上的材料的散热层（18,118）。 半导体管芯（12,112）的热膨胀系数基本上类似于火焰喷涂材料的热膨胀系数。 火焰喷涂材料可以直接沉积在半导体管芯（12,112）上或背衬层（15）上。 散热层（18,118）适用于将半导体管芯（12,112）固定到金属衬底（27,127）上。

公开(公告)号：US5269453A

公开(公告)日：1993-12-14

申请号：US958398

申请日：1992-10-08

申请人： Cynthia M. Melton ,  Kenneth Cholewczynski ,  Kevin D. Moore ,  Carl Raleigh

发明人： Cynthia M. Melton ,  Kenneth Cholewczynski ,  Kevin D. Moore ,  Carl Raleigh

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L23/49866 ,  H05K3/3436 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/09781 ,  H05K3/3473 ,  Y02P70/613

摘要： An integrated circuit component is attached to a printed circuit board by solder bump interconnections that are formed between metal bumps on the component and a metal-plated terminal on the board. The metal plate overlies both a bond pad and an adjacent runner of each terminal and is formed of a first metal, which is preferably a tin-base alloy. The metal bumps on the component are formed of a second metal, which is preferably an indium-base alloy. The component and board are assembled and heated to a temperature less than the melting temperatures of the first and second metals. At the interface between the bumps and the plate, the first and second metals cooperate to form a liquid phase which, upon cooling and solidifying, completes the interconnection.

摘要翻译： 集成电路部件通过形成在部件上的金属凸块和板上的金属镀覆端子之间的焊料凸块互连而附接到印刷电路板。 金属板覆盖每个端子的接合焊盘和相邻的流道两者，并且由优选为锡基合金的第一金属形成。 元件上的金属凸块由优选为铟基合金的第二金属形成。 将组件和板组装并加热到低于第一和第二金属的熔融温度的温度。 在凸块和板之间的界面处，第一和第二金属配合形成液相，其在冷却和凝固时完成互连。

公开(公告)号：US5186383A

公开(公告)日：1993-02-16

申请号：US770070

申请日：1991-10-02

申请人： Cynthia Melton ,  Carl Raleigh ,  Kenneth Cholewczynski ,  Kevin Moore

发明人： Cynthia Melton ,  Carl Raleigh ,  Kenneth Cholewczynski ,  Kevin Moore

IPC分类号： B23K1/00 ,  H01L21/60 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L24/81 ,  B23K1/0016 ,  H01L24/17 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/10135 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14505 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K2201/09781 ,  H05K2201/10568 ,  H05K2201/2036 ,  H05K2203/0723 ,  H05K3/3473 ,  Y02P70/613 ,  Y10T29/49144

摘要： A method for attaching an integrated circuit component to a printed circuit board by a plurality of solder bump interconnections utilizes a printed circuit board comprising a solder-plated circuit trace. The trace includes terminals, each including a terminal pad and a runner section. A solder plate formed of a first solder alloy is applied to the terminal to extend continuously between the pad and the runner section. Solder bumps are affixed to the component and are formed of second compositionally distinct solder alloy having a melting temperature greater than the first alloy. The component and board are then assembled so that the bumps rest against the solder-plated terminal pads, and heated to a temperature effective to melt the solder plate but not the bump alloy. Upon cooling to resolidify the solder, the solder plate is fused to the bumps to form the interconnections.

摘要翻译： 通过多个焊料凸块互连将集成电路部件附接到印刷电路板的方法利用包括焊接电镀电路迹线的印刷电路板。 轨迹包括端子，每个端子包括端子垫和流道部分。 将由第一焊料合金形成的焊盘施加到端子上，以在焊盘和流道部分之间连续延伸。 焊料凸起固定在部件上，并且由具有大于第一合金的熔化温度的第二组成不同的焊料合金形成。 然后将组件和板组装成使得凸块抵靠焊料焊接的端子焊盘，并且被加热到有效熔化焊接板而不是凸块合金的温度。 在冷却以重新固化焊料时，焊料板与凸块熔合以形成互连。