公开(公告)号：US08624380B2

公开(公告)日：2014-01-07

申请号：US13465213

申请日：2012-05-07

申请人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

发明人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

IPC分类号： H01L29/72

CPC分类号： B81B7/0048 ,  B81B7/0074 ,  B81B2207/012 ,  B81B2207/095 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.

摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。

公开(公告)号：US08174111B2

公开(公告)日：2012-05-08

申请号：US12570950

申请日：2009-09-30

申请人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

发明人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

IPC分类号： H01L29/72

CPC分类号： B81B7/0048 ,  B81B7/0074 ,  B81B2207/012 ,  B81B2207/095 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.

摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。

公开(公告)号：US20120235253A1

公开(公告)日：2012-09-20

申请号：US13465213

申请日：2012-05-07

申请人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

发明人： Xiaojie Xue ,  Carl Raleigh ,  Thomas M. Goida

IPC分类号： H01L29/84 ,  H01L23/495

CPC分类号： B81B7/0048 ,  B81B7/0074 ,  B81B2207/012 ,  B81B2207/095 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vertical mount pre-molded type package for use with a MEMS sensor may be formed with a low moisture permeable molding material that surrounds a portion of the leadframes and forms a cavity in which one or multiple dies may be held. The package includes structures to reduce package vibration, reduce die stress, increase vertical mount stability, and improve solder joint reliability. The vertical mount package includes a first leadframe having first leads and molding material substantially surrounding at least a portion of the first leads. The molding material forms a cavity for holding the MEMS sensor and forms a package mounting plane for mounting the package on a base. The cavity has a die mounting plane that is substantially non-parallel to the package mounting plane. The first leads are configured to provide electrical contacts within the cavity and to provide electrical contacts to the base.

摘要翻译： 与MEMS传感器一起使用的垂直安装的预成型型封装可以用低透湿成型材料形成，该模制材料围绕引线框架的一部分并形成可以保持一个或多个管芯的腔体。 该封装包括减少封装振动，减少模具应力，增加垂直安装稳定性以及提高焊点可靠性的结构。 垂直安装封装包括具有基本上围绕第一引线的至少一部分的第一引线和模制材料的第一引线框架。 模制材料形成用于保持MEMS传感器的空腔，并形成用于将封装安装在基座上的封装安装平面。 空腔具有基本上不平行于封装安装平面的管芯安装平面。 第一引线被配置为在空腔内提供电触头并提供到基座的电触头。

公开(公告)号：US20130241045A1

公开(公告)日：2013-09-19

申请号：US13420354

申请日：2012-03-14

申请人： Thomas M. Goida ,  Jicheng Yang

发明人： Thomas M. Goida ,  Jicheng Yang

IPC分类号： H01L23/12 ,  H01L21/50

CPC分类号： H04R19/04 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L21/52 ,  H01L23/10 ,  H01L23/12 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/3025 ,  H04R1/04 ,  H04R1/083 ,  H04R2201/003 ,  H04S2420/03 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00

摘要： Integrated devices and methods for packaging the same can include an external housing, an internal housing positioned within the external housing, and an external cavity formed between the external housing and the internal housing. An integrated device die can be positioned within the external cavity in fluid communication with an internal cavity formed by the internal lid. An air way can extend through the external cavity to the internal cavity, and can further extend from the internal cavity to the external cavity. The air way can provide fluid communication between the package exterior and the integrated device die, while reducing contamination of the integrated device die.

摘要翻译： 用于包装其的集成装置和方法可以包括外壳，位于外壳内的内壳，以及形成在外壳和内壳之间的外腔。 集成器件模具可以定位在外部空腔内，与由内部盖形成的内部空腔流体连通。 空气通道可以通过外部空腔延伸到内部空腔，并且可以从内部空腔进一步延伸到外部空腔。 空气方式可以在包装外部和集成器件裸片之间提供流体连通，同时减少集成器件裸片的污染。

公开(公告)号：US4700935A

公开(公告)日：1987-10-20

申请号：US827835

申请日：1986-02-07

申请人： Russell T. Winslow ,  Thomas M. Goida

发明人： Russell T. Winslow ,  Thomas M. Goida

IPC分类号： H01R43/02 ,  B23K3/08 ,  B23Q3/00

CPC分类号： B23K3/087 ,  Y10S269/903

摘要： A fixture for supporting integrated circuit packages during wave soldering of leads on the packages includes a carrier portion including two sets of orthogonal support members. The support members have formed edges for defining seats for receiving the packages. A frame cover includes appendages for engaging the packages and maintaining the packages in the seats. The arrangement of the orthogonal support members and cover appendages facilitates solder wave access to all leads of the packages and cleaning and drying of the packages. Heat transfer from the molten solder during the wave soldering procedure is minimized due to the low mass of the cover appendages.

摘要翻译： 用于在波导焊接包装件的引线的波峰焊时支撑集成电路封装的固定装置包括载体部分，其包括两组正交的支撑构件。 支撑构件已经形成用于限定用于接收包装的座的边缘。 框架盖包括用于接合包装并将包装保持在座中的附件。 正交支撑构件和覆盖附件的布置有助于焊料波进入包装的所有引线并且清洁和干燥封装。 在波峰焊接过程中，熔融焊料的热传递由于覆盖附件质量低而被最小化。

公开(公告)号：US20110049712A1

公开(公告)日：2011-03-03

申请号：US12896186

申请日：2010-10-01

申请人： Thomas M. Goida

发明人： Thomas M. Goida

IPC分类号： H01L23/49 ,  H01L23/498

CPC分类号： H01L25/0657 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A stacked die package in which an adhesive pad separates a bottom die from a top die. The pad may be in the form of a wall of adhesive about a central hollow area. The bottom die is attached to a base with a low temperature curing adhesive or a snap cure adhesive.

摘要翻译： 一种堆叠的模具包，其中粘合垫将底模与顶模分开。 衬垫可以围绕中央中空区域形成粘合剂壁的形式。 底部模具用低温固化粘合剂或快速固化粘合剂附接到基底上。

公开(公告)号：US09407997B2

公开(公告)日：2016-08-02

申请号：US13272045

申请日：2011-10-12

申请人： Michael D. Delaus ,  Kathy O'Donnell ,  Thomas M. Goida

发明人： Michael D. Delaus ,  Kathy O'Donnell ,  Thomas M. Goida

IPC分类号： H04R25/00 ,  H04R19/00 ,  B81C1/00 ,  H04R19/04

CPC分类号： H04R19/005 ,  B81B2201/0257 ,  B81C1/00238 ,  B81C1/00309 ,  B81C2203/0785 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R19/04 ,  H01L2924/00014 ,  H01L2924/00

摘要： A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base. Apertures in the base and integrated circuit are aligned to form an aperture from the exterior of the package to the interior.

摘要翻译： 封装的麦克风具有基座，连接到形成内部的基座的盖子，固定到内部的基座的MEMS麦克风和嵌入在基座中的集成电路。 基座和集成电路中的孔对准，以形成从包装外部到内部的孔。

公开(公告)号：US07829379B2

公开(公告)日：2010-11-09

申请号：US11874083

申请日：2007-10-17

申请人： Thomas M. Goida

发明人： Thomas M. Goida

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of manufacturing semiconductor devices by applying a pattern of adhesive pads on an active surface of a semiconductor wafer, the semiconductor wafer product so made and a stacked die package in which an adhesive wall leaves an air gap atop a bottom die. The wall may be in the form of a ring of adhesive about a central hollow area. The wafer carrying the pattern of adhesive pads on its active surface is singulated into individual dies, each die having an adhesive pad thereon. The bottom die is attached to a base with an adhesive which cures without curing the adhesive pad.

摘要翻译： 一种通过在半导体晶片的有源表面上施加粘合剂焊盘的图案，如此制造的半导体晶片产品和其中粘合剂壁离开底部顶部的气隙的堆叠管芯封装来制造半导体器件的方法。 该壁可以是围绕中心中空区域的粘合剂环的形式。 在其活性表面上承载粘合剂垫的图案的晶片被分割成单独的模具，每个模具在其上具有粘合垫。 底部模具用粘合剂附接到基部，固化剂不固化粘合剂垫。

公开(公告)号：US20080182434A1

公开(公告)日：2008-07-31

申请号：US11627050

申请日：2007-01-25

申请人： Thomas M. Goida

发明人： Thomas M. Goida

IPC分类号： H01R12/00 ,  H01R43/00

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronics package is described in which a quad flat no lead (QFN) electronic package has top and bottom surfaces. The bottom surface includes bottom contact pads arranged in a first pattern for electrical connection to corresponding package contact pads of an underlying circuit structure. The top surface includes top contact pads arranged in a second pattern for electrical connection to corresponding bottom contact pads of an overlying electronic package.

摘要翻译： 描述了一种电子封装，其中四边形无铅（QFN）电子封装具有顶表面和底表面。 底表面包括以第一图案布置的底部接触焊盘，用于电连接到下面的电路结构的相应的封装接触焊盘。 顶表面包括以第二图案布置的顶部接触垫，用于电连接到上层电子封装的相应的底部接触垫。

公开(公告)号：US20080087979A1

公开(公告)日：2008-04-17

申请号：US11549342

申请日：2006-10-13

申请人： Thomas M. Goida ,  Richard J. Sullivan ,  Michael J. Zylinski

发明人： Thomas M. Goida ,  Richard J. Sullivan ,  Michael J. Zylinski

IPC分类号： H01L29/00

CPC分类号： H01L25/50 ,  B81B7/0006 ,  H01L22/32 ,  H01L23/481 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05099

摘要： An integrated circuit has a substrate with a back side and a front side. The front side has both a working area and a front side contact in electrical communication with the working area. In a similar manner, the back side has first and second back side contacts. A first conductive path extending through the substrate electrically connects the front side contact and the first back side contact. In addition, a second conductive path electrically connects the first back side contact with the second back side contact.

摘要翻译： 集成电路具有背面和正面的基板。 前侧具有与工作区域电连通的工作区域和前侧触点。 以相似的方式，后侧具有第一和第二后侧接触。 延伸穿过基板的第一导电路径电连接前侧触点和第一后侧触点。 此外，第二导电路径将第一背面接触件与第二背面接触件电连接。