公开(公告)号：US09089881B2

公开(公告)日：2015-07-28

申请号：US13037487

申请日：2011-03-01

申请人： Xinming Wang ,  Fumitoshi Oikawa ,  Haruko Ono ,  Teruaki Hombo

发明人： Xinming Wang ,  Fumitoshi Oikawa ,  Haruko Ono ,  Teruaki Hombo

IPC分类号： B08B1/04 ,  H01L21/67

CPC分类号： H01L21/67046 ,  B08B1/04

摘要： A substrate is cleaned by performing a scrubbing process on a surface to be cleaned of the rotating substrate with a roll-shaped cleaning member while holding an outer circumferential surface of the roll-shaped cleaning member in contact with the surface to be cleaned of the substrate across a predetermined contact width. During at least a part of the scrubbing process, the roll-shaped cleaning member is placed at an offset cleaning position where the central axis of the roll-shaped cleaning member is spaced from the central axis of the substrate by a distance which is 0.14 to 0.5 times the contact width. The surface to be cleaned of the substrate is scrubbed with more uniform cleaning intensity while taking into account the cleaning intensity at each position (area) along the radial direction of the surface to be cleaned of the substrate.

摘要翻译： 通过在保持辊状清洁部件的外周面与基板的待清洗表面接触的同时用辊状清洁部件在旋转基板的待清洁表面上进行擦洗处理来清洁基板 跨越预定的接触宽度。 在洗涤过程的至少一部分期间，辊状清洁部件被放置在偏移清洁位置，其中辊状清洁部件的中心轴线与基板的中心轴线间隔开0.14至 接触宽度的0.5倍。 要清洁基材的表面，在考虑到沿基材待清洁表面的径向的每个位置（区域）处的清洁强度时，以更均匀的清洁强度进行擦洗。

公开(公告)号：USD710062S1

公开(公告)日：2014-07-29

申请号：US29408194

申请日：2011-12-08

申请人： Tomoatsu Ishibashi ,  Fumitoshi Oikawa ,  Hideaki Tanaka ,  Teruaki Hombo

设计人： Tomoatsu Ishibashi ,  Fumitoshi Oikawa ,  Hideaki Tanaka ,  Teruaki Hombo

公开(公告)号：US20130000671A1

公开(公告)日：2013-01-03

申请号：US13527857

申请日：2012-06-20

申请人： Xinming WANG ,  Kunimasa Matsushita ,  Fumitoshi Oikawa

发明人： Xinming WANG ,  Kunimasa Matsushita ,  Fumitoshi Oikawa

IPC分类号： B08B1/04

CPC分类号： H01L21/67046 ,  B08B1/04

摘要： A substrate cleaning method is provided, which can clean a surface of a substrate with a roll cleaning member more uniformly over the entire surface even when a point (area) exists in the cleaning area of the surface of the substrate at which the relative speed between the rotational speed of the substrate and the rotational speed of the roll cleaning member is zero. The substrate cleaning method for scrubbing a surface of a substrate with a roll cleaning member, extending along the diametrical direction of the substrate, by rotating the substrate and the roll cleaning member while keeping the roll cleaning member in contact with the surface of the substrate, includes changing a rotational speed of at least one of the substrate and the roll cleaning member or a direction of rotation of the substrate during the scrub cleaning of the surface of the substrate.

摘要翻译： 提供了一种基板清洗方法，即使在基板的表面的清洁区域中存在点（区域）时，也可以在整个表面上均匀地用辊清洁部件清洁基板表面， 基板的旋转速度和辊清洁部件的旋转速度为零。 一种基板清洗方法，用于通过在保持所述辊清洁部件与所述基板的表面接触的同时旋转所述基板和所述滚筒清洁部件，沿着所述基板的直径方向用辊清洁部件擦洗基板的表面， 包括在衬底表面的擦洗清洁期间改变衬底和辊清洁构件中的至少一个的旋转速度或衬底的旋转方向。

公开(公告)号：US20090301518A1

公开(公告)日：2009-12-10

申请号：US12225241

申请日：2007-03-06

申请人： Fumitoshi Oikawa ,  Shinji Kajita

发明人： Fumitoshi Oikawa ,  Shinji Kajita

IPC分类号： C25F3/30 ,  B08B3/12

CPC分类号： H01L21/02074 ,  B08B3/02 ,  B08B3/12 ,  B08B2203/0288 ,  B24B37/04 ,  H01L21/02052 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67219

摘要： A substrate processing apparatus includes: a polishing device 30A for polishing the surface of a substrate; and at least one of an ultrasonic cleaning device 42 for cleaning the surface of the substrate with ultrasonic waves transmitted through a liquid, and a two-fluid jet cleaning device 44 for cleaning the surface of the substrate with a two-fluid jet spouted as a mixture of a gas and a liquid. A substrate processing method includes: a polishing step of polishing the surface of a substrate; and a solid matter noncontact cleaning step of cleaning the surface of the substrate by spraying a liquid to the surface of the substrate. The above apparatus and method make it possible to efficiently clean the surface of a substrate after it is polished.

摘要翻译： 基板处理装置包括：抛光装置30A，用于抛光基板的表面; 以及用于通过液体透过的超声波清洗基板的表面的超声波清洗装置42中的至少一个以及用喷射出的液体喷射的双流体喷射器来清洗基板的表面的双流体喷射清洗装置44 气体和液体的混合物。 基板处理方法包括：研磨基板的表面的研磨工序; 以及固体物质非接触清洗步骤，通过将液体喷射到所述基板的表面来清洁所述基板的表面。 上述装置和方法使得可以在抛光后有效地清洁基板的表面。

公开(公告)号：US06248009B1

公开(公告)日：2001-06-19

申请号：US09506320

申请日：2000-02-18

申请人： Kenya Ito ,  Naoki Matsuda ,  Mitsuhiko Shirakashi ,  Fumitoshi Oikawa ,  Koji Ato

发明人： Kenya Ito ,  Naoki Matsuda ,  Mitsuhiko Shirakashi ,  Fumitoshi Oikawa ,  Koji Ato

IPC分类号： B24B2118

CPC分类号： B24B37/345 ,  B08B1/007 ,  B08B1/04 ,  B08B3/04 ,  H01L21/67046 ,  H01L21/67051

摘要： The present invention relates to a substrate cleaning apparatus, and more particularly to a substrate cleaning apparatus suitable for cleaning a substrate which requires a high level of cleanliness, such as a semiconductor wafer, a glass substrate, a liquid crystal panel, etc. The substrate cleaning apparatus comprises a substrate holder for holding a substrate while rotating the substrate in a substantially horizontal plane, a cleaning device for scrubbing a surface to be cleaned of the substrate, a cleaning device holder for holding the cleaning device rotatably about its own axis, the cleaning device having a shaft and a cleaning member disposed around the shaft, the cleaning member being permeable to a cleaning liquid, the shaft having an axially extending shaft hole and a cleaning liquid ejection port extending radially therethrough from the shaft hole, and a fluid-lubricated bearing disposed between the shaft and the cleaning device holder in at least one end thereof and lubricated by a cleaning liquid as a lubricating fluid.

摘要翻译： 本发明涉及一种基板清洗装置，更具体地涉及一种适用于清洗需要高清洁度的基板的基板清洗装置，例如半导体晶片，玻璃基板，液晶面板等。基板 清洁装置包括用于在基本水平的平面中旋转基板的同时保持基板的基板保持件，用于洗涤基板的待清洁表面的清洁装置，用于围绕其自身轴线可旋转地保持清洁装置的清洁装置保持器， 所述清洁装置具有轴和设置在所述轴周围的清洁构件，所述清洁构件可透过清洁液体，所述轴具有轴向延伸的轴孔和从所述轴孔径向延伸穿过的清洁液体喷射口， 润滑轴承在其至少一端设置在轴和清洁装置保持器之间并具有润滑剂 通过作为润滑液的清洗液进行。

公开(公告)号：US06842933B2

公开(公告)日：2005-01-18

申请号：US10671622

申请日：2003-09-29

申请人： Fumitoshi Oikawa ,  Koji Atoh

发明人： Fumitoshi Oikawa ,  Koji Atoh

IPC分类号： B08B1/00 ,  B08B1/04 ,  B08B3/02 ,  B08B3/04 ,  B08B7/04 ,  H01L21/00 ,  H01L21/304 ,  H01L21/68 ,  B08B11/00

CPC分类号： H01L21/67046 ,  B08B1/00 ,  B08B1/04 ,  H01L21/681

摘要： A cleaning apparatus for cleaning a substrate includes a cleaning member, a cleaning member carrier for holding the cleaning member and bringing the cleaning member into contact with a substrate to be cleaned, and a sensor for detecting a presence/absence of a cleaning held by the cleaning member carrier. The substrate is cleaned by causing relative movement between the cleaning member and the substrate while keeping the cleaning member and the substrate in contact with each other.

摘要翻译： 用于清洁基板的清洁装置包括清洁构件，用于保持清洁构件并使清洁构件与要清洁的基板接触的清洁构件载体，以及用于检测由所述清洁构件保持的清洁的存在/不存在的传感器 清洁构件载体。 通过在保持清洁部件和基板彼此接触的同时引起清洁部件和基板之间的相对移动来清洁基板。

公开(公告)号：US08226771B2

公开(公告)日：2012-07-24

申请号：US12225241

申请日：2007-03-06

申请人： Fumitoshi Oikawa ,  Shinji Kajita

发明人： Fumitoshi Oikawa ,  Shinji Kajita

IPC分类号： B08B3/12 ,  B08B11/02

CPC分类号： H01L21/02074 ,  B08B3/02 ,  B08B3/12 ,  B08B2203/0288 ,  B24B37/04 ,  H01L21/02052 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67219

摘要： A substrate processing apparatus includes: a polishing device 30A for polishing the surface of a substrate; and at least one of an ultrasonic cleaning device 42 for cleaning the surface of the substrate with ultrasonic waves transmitted through a liquid, and a two-fluid jet cleaning device 44 for cleaning the surface of the substrate with a two-fluid jet spouted as a mixture of a gas and a liquid. A substrate processing method includes: a polishing step of polishing the surface of a substrate; and a solid matter noncontact cleaning step of cleaning the surface of the substrate by spraying a liquid to the surface of the substrate. The above apparatus and method make it possible to efficiently clean the surface of a substrate after it is polished.

摘要翻译： 基板处理装置包括：抛光装置30A，用于抛光基板的表面; 以及用于通过液体透过的超声波清洗基板的表面的超声波清洗装置42中的至少一个以及用喷射出的液体喷射的双流体喷射器来清洗基板的表面的双流体喷射清洗装置44 气体和液体的混合物。 基板处理方法包括：研磨基板的表面的研磨工序; 以及通过将液体喷射到所述基板的表面来清洁所述基板的表面的固体物质非接触式清洁步骤。 上述装置和方法使得可以在抛光后有效地清洁基板的表面。

公开(公告)号：US06851152B2

公开(公告)日：2005-02-08

申请号：US09924464

申请日：2001-08-09

申请人： Hiroshi Sotozaki ,  Fumitoshi Oikawa

发明人： Hiroshi Sotozaki ,  Fumitoshi Oikawa

IPC分类号： B08B1/04 ,  B08B3/02 ,  B08B7/04 ,  B24D13/10 ,  H01L21/00 ,  H01L21/304 ,  A47L25/00

CPC分类号： H01L21/67051 ,  B08B1/04 ,  H01L21/67046

摘要： A substrate cleaning apparatus allows an end face and/or a bevel face of a substrate to be scrub-cleaned in a simple and effective manner. The apparatus has a plurality of rotatable substrate rotating rollers for gripping a periphery of the substrate and rotating the substrate, a cleaning roller capable of rotating and having a cleaning member which is to be brought into contact with the end face and/or the bevel face of the substrate so as to apply scrub-cleaning to the end face and/or the bevel face, and a power transmission mechanism for transmitting a rotating force of the substrate rotating roller to the cleaning roller so as to rotate the cleaning roller.

摘要翻译： 基板清洁装置允许以简单且有效的方式擦洗基板的端面和/或斜面。 该装置具有多个可旋转的基板旋转辊，用于夹持基板的周边并旋转基板，能够旋转并具有与端面和/或斜面接触的清洁构件的清洁辊 的基板，以便对端面和/或斜面施加擦洗;以及动力传递机构，用于将基板旋转辊的旋转力传递到清洁辊，以使清洁辊旋转。

公开(公告)号：US06651287B2

公开(公告)日：2003-11-25

申请号：US09903584

申请日：2001-07-13

申请人： Fumitoshi Oikawa ,  Koji Atoh

发明人： Fumitoshi Oikawa ,  Koji Atoh

IPC分类号： B08B104

CPC分类号： H01L21/67046 ,  B08B1/00 ,  B08B1/04 ,  H01L21/681

摘要： A cleaning apparatus for cleaning a substrate includes a cleaning member, a cleaning member carrier for holding the cleaning member and bringing the cleaning member into contact with a substrate to be cleaned, and a sensor for detecting a presence/absence of a cleaning held by the cleaning member carrier. The substrate is cleaned by causing relative movement between the cleaning member and the substrate while keeping the cleaning member and the substrate in contact with each other.

摘要翻译： 用于清洁基板的清洁装置包括清洁构件，用于保持清洁构件并使清洁构件与要清洁的基板接触的清洁构件载体，以及用于检测由所述清洁构件保持的清洁的存在/不存在的传感器 清洁构件载体。 通过在保持清洁部件和基板彼此接触的同时引起清洁部件和基板之间的相对移动来清洁基板。

公开(公告)号：US06412134B1

公开(公告)日：2002-07-02

申请号：US09456496

申请日：1999-12-08

申请人： Fumitoshi Oikawa

发明人： Fumitoshi Oikawa

IPC分类号： B08B104

CPC分类号： H01L21/67046 ,  B08B1/04

摘要： A cleaning device for use in a substrate cleaning apparatus is disclosed. The cleaning device includes a cleaning member brought into contact with a surface of a substrate to be cleaned, and a cleaning member holding mechanism for holding the cleaning member. The cleaning member holding mechanism includes a holding member (sleeve) having a lower portion split into a plurality of chuck jaws, and a ring member fitted onto the outer periphery of the holding member. An end portion of the cleaning member is inserted into an insertion hole formed by the chuck jaws, and the ring member is fitted onto the outer periphery of the holding member, thereby holding the cleaning member with the chuck jaws. That is, the cleaning member holding mechanism has a collet chuck structure.

摘要翻译： 公开了一种用于基板清洗装置的清洁装置。 清洁装置包括与要清洁的基板的表面接触的清洁部件和用于保持清洁部件的清洁部件保持机构。 清洁部件保持机构包括具有分割成多个卡盘爪的下部的保持部件（套筒）和嵌合在保持部件的外周上的环状部件。 清洁部件的端部插入到由夹爪形成的插入孔中，并且环形部件被装配到保持部件的外周上，从而将清洁部件夹持在卡盘爪中。 也就是说，清洁构件保持机构具有夹头卡盘结构。