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    Apparatus for cleaning substrate
    1.
    发明授权
    Apparatus for cleaning substrate 有权
    清洗基板的设备

    公开(公告)号：US06248009B1

    公开(公告)日：2001-06-19

    申请号：US09506320

    申请日：2000-02-18

    申请人： Kenya Ito ,  Naoki Matsuda ,  Mitsuhiko Shirakashi ,  Fumitoshi Oikawa ,  Koji Ato

    发明人： Kenya Ito ,  Naoki Matsuda ,  Mitsuhiko Shirakashi ,  Fumitoshi Oikawa ,  Koji Ato

    IPC分类号： B24B2118

    CPC分类号： B24B37/345 ,  B08B1/007 ,  B08B1/04 ,  B08B3/04 ,  H01L21/67046 ,  H01L21/67051

    摘要： The present invention relates to a substrate cleaning apparatus, and more particularly to a substrate cleaning apparatus suitable for cleaning a substrate which requires a high level of cleanliness, such as a semiconductor wafer, a glass substrate, a liquid crystal panel, etc. The substrate cleaning apparatus comprises a substrate holder for holding a substrate while rotating the substrate in a substantially horizontal plane, a cleaning device for scrubbing a surface to be cleaned of the substrate, a cleaning device holder for holding the cleaning device rotatably about its own axis, the cleaning device having a shaft and a cleaning member disposed around the shaft, the cleaning member being permeable to a cleaning liquid, the shaft having an axially extending shaft hole and a cleaning liquid ejection port extending radially therethrough from the shaft hole, and a fluid-lubricated bearing disposed between the shaft and the cleaning device holder in at least one end thereof and lubricated by a cleaning liquid as a lubricating fluid.

    摘要翻译： 本发明涉及一种基板清洗装置，更具体地涉及一种适用于清洗需要高清洁度的基板的基板清洗装置，例如半导体晶片，玻璃基板，液晶面板等。基板 清洁装置包括用于在基本水平的平面中旋转基板的同时保持基板的基板保持件，用于洗涤基板的待清洁表面的清洁装置，用于围绕其自身轴线可旋转地保持清洁装置的清洁装置保持器， 所述清洁装置具有轴和设置在所述轴周围的清洁构件，所述清洁构件可透过清洁液体，所述轴具有轴向延伸的轴孔和从所述轴孔径向延伸穿过的清洁液体喷射口， 润滑轴承在其至少一端设置在轴和清洁装置保持器之间并具有润滑剂 通过作为润滑液的清洗液进行。

    Cleaning apparatus
    2.
    发明授权
    Cleaning apparatus 失效
    清洁装置

    公开(公告)号：US6148463A

    公开(公告)日：2000-11-21

    申请号：US80453

    申请日：1998-05-19

    申请人： Noburu Shimizu ,  Koji Ato

    发明人： Noburu Shimizu ,  Koji Ato

    IPC分类号： B08B1/04 ,  B08B3/10 ,  H01L21/304 ,  B08B11/02 ,  A46B13/04

    CPC分类号： B08B3/10 ,  B08B1/04

    摘要： The cleaning apparatus of the present invention comprises a cleaning member 105 adapted to be rotated while maintaining contact with a surface of a semiconductor wafer W, to thereby clean the surface of the semiconductor wafer W, and a drive motor 50 for rotating the cleaning member 105. A linear bushing 75 and coil springs 81 are provided between the cleaning member 105 and the drive motor 50. The linear bushing 75 ensures that the cleaning member 105 is capable of slidably moving in a direction of an axis of rotation. The coil springs 81 ensure that the cleaning member 105 applies a predetermined pressure to the semiconductor wafer W. A pressure in a casing 1 [(1-1), (1-2) and (1-3)] is set to a negative pressure relative to an outside air pressure by suction through a pipe 111.

    摘要翻译： 本发明的清洁装置包括：清洁部件105，其适于旋转，同时保持与半导体晶片W的表面的接触，从而清洁半导体晶片W的表面;以及驱动电机50，用于使清洁部件105旋转 线性衬套75和螺旋弹簧81设置在清洁构件105和驱动马达50之间。线性衬套75确保清洁构件105能够沿着旋转轴线的方向可滑动地移动。 螺旋弹簧81确保清洁构件105向半导体晶片W施加预定的压力。壳体1 [（1-1），（1-2）和（1-3）]中的压力被设置为负 通过管111的抽吸相对于外部空气压力的压力。

    Method and apparatus for polishing a substrate
    3.
    发明授权
    Method and apparatus for polishing a substrate 有权
    抛光基板的方法和装置

    公开(公告)号：US06494985B1

    公开(公告)日：2002-12-17

    申请号：US09434482

    申请日：1999-11-05

    申请人： Hiroshi Sotozaki ,  Koji Ato

    发明人： Hiroshi Sotozaki ,  Koji Ato

    IPC分类号： B24B4900

    CPC分类号： B24B37/345 ,  B24B51/00 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/30625 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67219

    摘要： A substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal display is polished to a flat mirror finish, and then cleaning a polished substrate that is cleaned to a high degree of cleanliness. A polishing section having at least one polishing unit for performs primary polishing and secondary polishing of the substrate by pressing the substrate against a polishing surface. A cleaning section cleans the substrate which has been polished to remove particles attached to the substrate by a scrubbing cleaning. Metal ions are removed from the substrate by supplying an etching liquid.

    摘要翻译： 将诸如半导体晶片，玻璃基板或液晶显示器之类的基板抛光到平面镜面，然后清洁被清洁的抛光的基板以达到高清洁度。 一种具有至少一个抛光单元的抛光部分，用于通过将衬底压靠在抛光表面上进行一次抛光和二次抛光。 清洁部分通过洗涤清洁来清洁已经被抛光的基底以去除附着到基底上的颗粒。 通过提供蚀刻液体从基板去除金属离子。

    Substrate cleaning apparatus and method
    6.
    发明申请
    Substrate cleaning apparatus and method 审中-公开
    基板清洗装置及方法

    公开(公告)号：US20050252535A1

    公开(公告)日：2005-11-17

    申请号：US10536961

    申请日：2004-05-26

    申请人： Yukiko Nishioka ,  Koji Ato ,  Ryosuke Yonekura ,  Yoshikazu Ariga

    发明人： Yukiko Nishioka ,  Koji Ato ,  Ryosuke Yonekura ,  Yoshikazu Ariga

    IPC分类号： H01L21/304 ,  B08B7/00 ,  H01L21/00

    CPC分类号： H01L21/67028 ,  H01L21/67051

    摘要： A substrate cleaning apparatus is used for cleaning and drying a substrate such as a semiconductor wafer used in a semiconductor fabricating process or the like. The substrate cleaning apparatus includes a substrate holding mechanism (10) configured to hold the substrate (W), and a rotating mechanism (20) configured to rotate the substrate holding mechanism (10). At least one of components of the substrate cleaning apparatus has a surface structure to which droplets are hardly attached.

    摘要翻译： 基板清洗装置用于清洗和干燥半导体制造工艺等中使用的半导体晶片等基板。 基板清洗装置具备：保持基板（W）的基板保持机构（10）和旋转基板保持机构（10）的旋转机构（20）。 基板清洗装置的至少一个部件具有难以附着液滴的表面结构。

    Cleaning apparatus
    7.
    发明授权
    Cleaning apparatus 有权
    清洁装置

    公开(公告)号：US06439962B1

    公开(公告)日：2002-08-27

    申请号：US09238612

    申请日：1999-01-28

    申请人： Koji Ato

    发明人： Koji Ato

    IPC分类号： B24B4912

    CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67259

    摘要： An apparatus performs at least one of cleaning and drying a semiconductor wafer while rotating the semiconductor wafer. The apparatus has a rotating mechanism for rotating the semiconductor wafer, and a sensor for detecting a reference position such as a notch or an orientation flat of the semiconductor wafer. The semiconductor wafer may be stopped from rotating to align the reference position with a predetermined position based on an output signal from the sensor.

    摘要翻译： 一种装置在半导体晶片旋转的同时执行清洗和干燥半导体晶片中的至少一个。 该装置具有用于旋转半导体晶片的旋转机构和用于检测诸如半导体晶片的凹口或取向平面的基准位置的传感器。 可以基于来自传感器的输出信号，使半导体晶片停止旋转以使基准位置与预定位置对准。

    Polishing device and substrate processing device
    8.
    发明授权
    Polishing device and substrate processing device 有权
    抛光装置和基板处理装置

    公开(公告)号：US07850817B2

    公开(公告)日：2010-12-14

    申请号：US10481001

    申请日：2003-04-09

    申请人： Satoshi Wakabayashi ,  Tetsuji Togawa ,  Ryuichi Kosuge ,  Koji Ato ,  Hiroshi Sotozaki

    发明人： Satoshi Wakabayashi ,  Tetsuji Togawa ,  Ryuichi Kosuge ,  Koji Ato ,  Hiroshi Sotozaki

    IPC分类号： C23F1/00

    CPC分类号： B24B37/345 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

    摘要： A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions.

    摘要翻译： 抛光装置具有多个抛光单元。 在每个抛光单元中设置有用于在抛光表面上的抛光位置和晶片接收/传送位置之间移动顶环的移动机构。 提供线性转运器用于在包括晶片接收/传送位置的多个传送位置之间传送晶片。 用于在线性运送器和顶环之间接收和输送晶片的推动器设置在作为晶片接收/传送位置的转移位置处。