公开(公告)号：US07863670B2

公开(公告)日：2011-01-04

申请号：US12490147

申请日：2009-06-23

申请人： Yasushi Ishii ,  Takashi Hashimoto ,  Yoshiyuki Kawashima ,  Koichi Toba ,  Satoru Machida ,  Kozo Katayama ,  Kentaro Saito ,  Toshikazu Matsui

发明人： Yasushi Ishii ,  Takashi Hashimoto ,  Yoshiyuki Kawashima ,  Koichi Toba ,  Satoru Machida ,  Kozo Katayama ,  Kentaro Saito ,  Toshikazu Matsui

IPC分类号： H01L29/792

CPC分类号： H01L27/115 ,  H01L21/823462 ,  H01L27/0629 ,  H01L27/0922 ,  H01L27/105 ,  H01L27/11526 ,  H01L27/11546 ,  H01L27/11568 ,  H01L29/6653

摘要： In a semiconductor device which includes a split-gate type memory cell having a control gate and a memory gate, a low withstand voltage MISFET and a high withstand voltage MISFET, variations of the threshold voltage of the memory cell are suppressed. A gate insulating film of a control gate is thinner than a gate insulating film of a high withstand voltage MISFET, the control gate is thicker than a gate electrode 14 of the low withstand voltage MISFET and the ratio of thickness of a memory gate with respect to the gate length of the memory gate is larger than 1. The control gate and a gate electrode 15 are formed in a multilayer structure including an electrode material film 8A and an electrode material layer 8B, and the gate electrode 14 is a single layer structure formed at the same time as the electrode material film 8A of the control gate.

摘要翻译： 在包括具有控制栅极和存储器栅极的分离栅极型存储单元，低耐压MISFET和高耐压MISFET的半导体器件中，抑制了存储单元的阈值电压的变化。 控制栅极的栅极绝缘膜比高耐压MISFET的栅极绝缘膜薄，控制栅极比低耐压MISFET的栅电极14厚，存储栅的厚度比相对于 存储器栅极的栅极长度大于1.控制栅极和栅电极15形成为包括电极材料膜8A和电极材料层8B的多层结构，并且栅电极14是形成的单层结构 同时作为控制栅极的电极材料膜8A。

公开(公告)号：US20070262382A1

公开(公告)日：2007-11-15

申请号：US11727591

申请日：2007-03-27

申请人： Yasushi Ishii ,  Takashi Hashimoto ,  Yoshiyuki Kawashima ,  Koichi Toba ,  Satoru Machida ,  Kozo Katayama ,  Kentaro Saito ,  Toshikazu Matsui

发明人： Yasushi Ishii ,  Takashi Hashimoto ,  Yoshiyuki Kawashima ,  Koichi Toba ,  Satoru Machida ,  Kozo Katayama ,  Kentaro Saito ,  Toshikazu Matsui

IPC分类号： H01L27/12 ,  H01L27/01 ,  H01L31/0392 ,  H01L21/8234 ,  H01L21/336

CPC分类号： H01L27/115 ,  H01L21/823462 ,  H01L27/0629 ,  H01L27/0922 ,  H01L27/105 ,  H01L27/11526 ,  H01L27/11546 ,  H01L27/11568 ,  H01L29/6653

摘要： In a semiconductor device which includes a split-gate type memory cell having a control gate and a memory gate, a low withstand voltage MISFET and a high withstand voltage MISFET, variations of the threshold voltage of the memory cell are suppressed. A gate insulating film of a control gate is thinner than a gate insulating film of a high withstand voltage MISFET, the control gate is thicker than a gate electrode 14 of the low withstand voltage MISFET and the ratio of thickness of a memory gate with respect to the gate length of the memory gate is larger than 1. The control gate and a gate electrode 15 are formed in a multilayer structure including an electrode material film 8A and an electrode material layer 8B, and the gate electrode 14 is a single layer structure formed at the same time as the electrode material film 8A of the control gate.

摘要翻译： 在包括具有控制栅极和存储器栅极的分离栅极型存储单元，低耐压MISFET和高耐压MISFET的半导体器件中，抑制了存储单元的阈值电压的变化。 控制栅极的栅极绝缘膜比高耐压MISFET的栅极绝缘膜薄，控制栅极比低耐压MISFET的栅电极14厚，存储栅的厚度比相对于 存储器栅极的栅极长度大于1.控制栅极和栅极电极15形成为包括电极材料膜8A和电极材料层8B的多层结构，并且栅电极14是单层 结构与控制门的电极材料膜8A同时形成。

公开(公告)号：US20090256193A1

公开(公告)日：2009-10-15

申请号：US12490147

申请日：2009-06-23

申请人： YASUSHI ISHII ,  Takashi Hashimoto ,  Yoshiyuki Kawashima ,  Koichi Toba ,  Satoru Machida ,  Kozo Katayama ,  Kentaro Saito ,  Toshikazu Matsui

发明人： YASUSHI ISHII ,  Takashi Hashimoto ,  Yoshiyuki Kawashima ,  Koichi Toba ,  Satoru Machida ,  Kozo Katayama ,  Kentaro Saito ,  Toshikazu Matsui

IPC分类号： H01L29/792

CPC分类号： H01L27/115 ,  H01L21/823462 ,  H01L27/0629 ,  H01L27/0922 ,  H01L27/105 ,  H01L27/11526 ,  H01L27/11546 ,  H01L27/11568 ,  H01L29/6653

摘要： In a semiconductor device which includes a split-gate type memory cell having a control gate and a memory gate, a low withstand voltage MISFET and a high withstand voltage MISFET, variations of the threshold voltage of the memory cell are suppressed. A gate insulating film of a control gate is thinner than a gate insulating film of a high withstand voltage MISFET, the control gate is thicker than a gate electrode 14 of the low withstand voltage MISFET and the ratio of thickness of a memory gate with respect to the gate length of the memory gate is larger than 1. The control gate and a gate electrode 15 are formed in a multilayer structure including an electrode material film 8A and an electrode material layer 8B, and the gate electrode 14 is a single layer structure formed at the same time as the electrode material film 8A of the control gate.

摘要翻译： 在包括具有控制栅极和存储器栅极的分离栅极型存储单元，低耐压MISFET和高耐压MISFET的半导体器件中，抑制了存储单元的阈值电压的变化。 控制栅极的栅极绝缘膜比高耐压MISFET的栅极绝缘膜薄，控制栅极比低耐压MISFET的栅电极14厚，存储栅的厚度比相对于 存储器栅极的栅极长度大于1.控制栅极和栅电极15形成为包括电极材料膜8A和电极材料层8B的多层结构，并且栅电极14是形成的单层结构 同时作为控制栅极的电极材料膜8A。

公开(公告)号：US07557005B2

公开(公告)日：2009-07-07

申请号：US11727591

申请日：2007-03-27

申请人： Yasushi Ishii ,  Takashi Hashimoto ,  Yoshiyuki Kawashima ,  Koichi Toba ,  Satoru Machida ,  Kozo Katayama ,  Kentaro Saito ,  Toshikazu Matsui

发明人： Yasushi Ishii ,  Takashi Hashimoto ,  Yoshiyuki Kawashima ,  Koichi Toba ,  Satoru Machida ,  Kozo Katayama ,  Kentaro Saito ,  Toshikazu Matsui

IPC分类号： H01L21/336

CPC分类号： H01L27/115 ,  H01L21/823462 ,  H01L27/0629 ,  H01L27/0922 ,  H01L27/105 ,  H01L27/11526 ,  H01L27/11546 ,  H01L27/11568 ,  H01L29/6653

摘要： In a semiconductor device which includes a split-gate type memory cell having a control gate and a memory gate, a low withstand voltage MISFET and a high withstand voltage MISFET, variations of the threshold voltage of the memory cell are suppressed. A gate insulating film of a control gate is thinner than a gate insulating film of a high withstand voltage MISFET, the control gate is thicker than a gate electrode 14 of the low withstand voltage MISFET and the ratio of thickness of a memory gate with respect to the gate length of the memory gate is larger than 1. The control gate and a gate electrode 15 are formed in a multilayer structure including an electrode material film 8A and an electrode material layer 8B, and the gate electrode 14 is a single layer structure formed at the same time as the electrode material film 8A of the control gate.

摘要翻译： 在包括具有控制栅极和存储器栅极的分离栅极型存储单元，低耐压MISFET和高耐压MISFET的半导体器件中，抑制了存储单元的阈值电压的变化。 控制栅极的栅极绝缘膜比高耐压MISFET的栅极绝缘膜薄，控制栅极比低耐压MISFET的栅电极14厚，存储栅的厚度比相对于 存储器栅极的栅极长度大于1.控制栅极和栅电极15形成为包括电极材料膜8A和电极材料层8B的多层结构，并且栅电极14是形成的单层结构 同时作为控制栅极的电极材料膜8A。

公开(公告)号：US20100237404A1

公开(公告)日：2010-09-23

申请号：US12718002

申请日：2010-03-05

申请人： KOICHI TOBA ,  Yasushi Ishii ,  Yoshiyuki Kawashima ,  Satoru Machida ,  Munekatsu Nakagawa ,  Kentaro Saito ,  Toshikazu Matsui ,  Takashi Hashimoto ,  Kosuke Okuyama

发明人： KOICHI TOBA ,  Yasushi Ishii ,  Yoshiyuki Kawashima ,  Satoru Machida ,  Munekatsu Nakagawa ,  Kentaro Saito ,  Toshikazu Matsui ,  Takashi Hashimoto ,  Kosuke Okuyama

IPC分类号： H01L29/792 ,  H01L21/336

CPC分类号： H01L29/42324 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/115 ,  H01L27/11526 ,  H01L27/11531 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/7885

摘要： A semiconductor device having a non-volatile memory is disclosed, whose disturb defect can be diminished or prevented. A memory cell of the non-volatile memory has a memory gate electrode formed over a main surface of a semiconductor substrate through an insulating film for charge storage. A first side wall is formed on a side face of the memory gate electrode, and at a side face of the first side wall, a second side wall is formed. On an upper surface of an n+-type semiconductor region for source in the memory cell there is formed a silicide layer whose end portion on the memory gate electrode MG side is defined by the second side wall.

摘要翻译： 公开了一种具有非易失性存储器的半导体器件，其干扰缺陷可被减弱或防止。 非易失性存储器的存储单元具有通过用于电荷存储的绝缘膜形成在半导体衬底的主表面上的存储栅电极。 第一侧壁形成在存储栅电极的侧面上，在第一侧壁的侧面形成有第二侧壁。 在存储单元中用于源极的n +型半导体区域的上表面上形成硅化物层，其存储栅极电极MG侧的端部由第二侧壁限定。

公开(公告)号：US07745288B2

公开(公告)日：2010-06-29

申请号：US11717053

申请日：2007-03-13

申请人： Koichi Toba ,  Yasushi Ishii ,  Yoshiyuki Kawashima ,  Satoru Machida ,  Munekatsu Nakagawa ,  Kentaro Saito ,  Toshikazu Matsui ,  Takashi Hashimoto ,  Kosuke Okuyama

发明人： Koichi Toba ,  Yasushi Ishii ,  Yoshiyuki Kawashima ,  Satoru Machida ,  Munekatsu Nakagawa ,  Kentaro Saito ,  Toshikazu Matsui ,  Takashi Hashimoto ,  Kosuke Okuyama

IPC分类号： H01L21/336

CPC分类号： H01L29/42324 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/115 ,  H01L27/11526 ,  H01L27/11531 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/7885

摘要： A semiconductor device having a non-volatile memory is disclosed, whose disturb defect can be diminished or prevented. A memory cell of the non-volatile memory has a memory gate electrode formed over a main surface of a semiconductor substrate through an insulating film for charge storage. A first side wall is formed on a side face of the memory gate electrode, and at a side face of the first side wall, a second side wall is formed. On an upper surface of an n+-type semiconductor region for source in the memory cell there is formed a silicide layer whose end portion on the memory gate electrode MG side is defined by the second side wall.

摘要翻译： 公开了一种具有非易失性存储器的半导体器件，其干扰缺陷可被减弱或防止。 非易失性存储器的存储单元具有通过用于电荷存储的绝缘膜形成在半导体衬底的主表面上的存储栅电极。 第一侧壁形成在存储栅电极的侧面上，在第一侧壁的侧面形成有第二侧壁。 在存储单元中用于源极的n +型半导体区域的上表面上形成硅化物层，其存储栅极电极MG侧的端部由第二侧壁限定。

公开(公告)号：US08530958B2

公开(公告)日：2013-09-10

申请号：US12718002

申请日：2010-03-05

申请人： Koichi Toba ,  Yasushi Ishii ,  Yoshiyuki Kawashima ,  Satoru Machida ,  Munekatsu Nakagawa ,  Kentaro Saito ,  Toshikazu Matsui ,  Takashi Hashimoto ,  Kosuke Okuyama

发明人： Koichi Toba ,  Yasushi Ishii ,  Yoshiyuki Kawashima ,  Satoru Machida ,  Munekatsu Nakagawa ,  Kentaro Saito ,  Toshikazu Matsui ,  Takashi Hashimoto ,  Kosuke Okuyama

IPC分类号： H01L29/792

CPC分类号： H01L29/42324 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/115 ,  H01L27/11526 ,  H01L27/11531 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/7885

摘要： A semiconductor device having a non-volatile memory is disclosed, whose disturb defect can be diminished or prevented. A memory cell of the non-volatile memory has a memory gate electrode formed over a main surface of a semiconductor substrate through an insulating film for charge storage. A first side wall is formed on a side face of the memory gate electrode, and at a side face of the first side wall, a second side wall is formed. On an upper surface of an n+-type semiconductor region for source in the memory cell there is formed a silicide layer whose end portion on the memory gate electrode MG side is defined by the second side wall.

摘要翻译： 公开了一种具有非易失性存储器的半导体器件，其干扰缺陷可被减弱或防止。 非易失性存储器的存储单元具有通过用于电荷存储的绝缘膜形成在半导体衬底的主表面上的存储栅电极。 第一侧壁形成在存储栅电极的侧面上，在第一侧壁的侧面形成有第二侧壁。 在存储单元中用于源极的n +型半导体区域的上表面上形成硅化物层，其存储栅极电极MG侧的端部由第二侧壁限定。

公开(公告)号：US20070228446A1

公开(公告)日：2007-10-04

申请号：US11717053

申请日：2007-03-13

申请人： Koichi Toba ,  Yasushi Ishii ,  Yoshiyuki Kawashima ,  Satoru Machida ,  Munekatsu Nakagawa ,  Kentaro Saito ,  Toshikazu Matsui ,  Takashi Hashimoto ,  Kosuke Okuyama

发明人： Koichi Toba ,  Yasushi Ishii ,  Yoshiyuki Kawashima ,  Satoru Machida ,  Munekatsu Nakagawa ,  Kentaro Saito ,  Toshikazu Matsui ,  Takashi Hashimoto ,  Kosuke Okuyama

IPC分类号： H01L29/76

CPC分类号： H01L29/42324 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/115 ,  H01L27/11526 ,  H01L27/11531 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/7885

摘要： A semiconductor device having a non-volatile memory is disclosed, whose disturb defect can be diminished or prevented. A memory cell of the non-volatile memory has a memory gate electrode formed over a main surface of a semiconductor substrate through an insulating film for charge storage. A first side wall is formed on a side face of the memory gate electrode, and at a side face of the first side wall, a second side wall is formed. On an upper surface of an n+-type semiconductor region for source in the memory cell there is formed a silicide layer whose end portion on the memory gate electrode MG side is defined by the second side wall.

摘要翻译： 公开了一种具有非易失性存储器的半导体器件，其干扰缺陷可被减弱或防止。 非易失性存储器的存储单元具有通过用于电荷存储的绝缘膜形成在半导体衬底的主表面上的存储栅电极。 第一侧壁形成在存储栅电极的侧面上，在第一侧壁的侧面形成有第二侧壁。 在存储单元中用于源极的n + + / - 型半导体区域的上表面上形成硅化物层，其存储栅电极MG侧的端部由第二侧壁限定。

公开(公告)号：US08084800B2

公开(公告)日：2011-12-27

申请号：US12239807

申请日：2008-09-28

申请人： Yoshiyuki Kawashima ,  Koichi Toba ,  Yasushi Ishii ,  Toshikazu Matsui ,  Takashi Hashimoto

发明人： Yoshiyuki Kawashima ,  Koichi Toba ,  Yasushi Ishii ,  Toshikazu Matsui ,  Takashi Hashimoto

IPC分类号： H01L29/78 ,  H01L21/02 ,  H01L21/8242 ,  H01L21/20

CPC分类号： H01L28/60 ,  H01L27/0629 ,  H01L27/0805 ,  H01L27/105 ,  H01L27/10805 ,  H01L27/11526 ,  H01L27/11531 ,  H01L27/11573 ,  H01L28/40

摘要： In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.

摘要翻译： 关于包括电容器元件的半导体器件，提供了一种能够提高电容器元件的可靠性的技术。 电容器元件形成在半导体衬底上形成的元件隔离区域中。 电容器元件包括通过电容器绝缘膜形成在下电极上的下电极和上电极。 基本上，下电极和上电极由形成在多晶硅膜的表面上的多晶硅膜和硅化钴膜形成。 形成在上电极上的钴硅化物膜的端部与上电极的端部间隔开一定距离。 此外，形成在下电极上的钴硅化物膜的端部与上电极和下电极之间的边界间隔一定距离。

公开(公告)号：US20120306051A1

公开(公告)日：2012-12-06

申请号：US13587008

申请日：2012-08-16

申请人： Yoshiyuki Kawashima ,  Koichi Toba ,  Yasushi Ishii ,  Toshikazu Matsui ,  Takashi Hashimoto

发明人： Yoshiyuki Kawashima ,  Koichi Toba ,  Yasushi Ishii ,  Toshikazu Matsui ,  Takashi Hashimoto

IPC分类号： H01L27/08

CPC分类号： H01L28/60 ,  H01L27/0629 ,  H01L27/0805 ,  H01L27/105 ,  H01L27/10805 ,  H01L27/11526 ,  H01L27/11531 ,  H01L27/11573 ,  H01L28/40

摘要： In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor element. A capacitor element is formed in an element isolation region formed over a semiconductor substrate. The capacitor element includes a lower electrode and an upper electrode formed over the lower electrode through a capacitor insulating film. Basically, the lower electrode and the upper electrode are formed from polysilicon films and a cobalt silicide film formed over the surfaces of the polysilicon films. End portions of the cobalt silicide film formed over the upper electrode are spaced apart a distance from end portions of the upper electrode. Besides, end portions of the cobalt silicide film formed over the lower electrode are spaced apart a distance from boundaries between the upper electrode and the lower electrode.

摘要翻译： 关于包括电容器元件的半导体器件，提供了一种能够提高电容器元件的可靠性的技术。 电容器元件形成在半导体衬底上形成的元件隔离区域中。 电容器元件包括通过电容器绝缘膜形成在下电极上的下电极和上电极。 基本上，下电极和上电极由形成在多晶硅膜的表面上的多晶硅膜和硅化钴膜形成。 形成在上电极上的钴硅化物膜的端部与上电极的端部间隔开一定距离。 此外，形成在下电极上的钴硅化物膜的端部与上电极和下电极之间的边界间隔一定距离。