公开(公告)号：US20070101573A1

公开(公告)日：2007-05-10

申请号：US11594785

申请日：2006-11-09

申请人： Yasufumi Masaki ,  Masahide Mutou ,  Takashi Shindou ,  Masato Kawashima ,  Yoshio Mori ,  Tsuguo Wada ,  Yoshiyuki Uchinono ,  Norimasa Kaji

发明人： Yasufumi Masaki ,  Masahide Mutou ,  Takashi Shindou ,  Masato Kawashima ,  Yoshio Mori ,  Tsuguo Wada ,  Yoshiyuki Uchinono ,  Norimasa Kaji

IPC分类号： H05K3/10 ,  B23P17/00

CPC分类号： H05K3/10 ,  H05K1/0284 ,  H05K1/053 ,  H05K1/056 ,  H05K1/183 ,  H05K3/0058 ,  H05K3/16 ,  H05K3/44 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2203/0323 ,  H05K2203/105 ,  H05K2203/1355 ,  H05K2203/1366 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49798

摘要： In order to obtain a 3D circuit board manufacturing method capable of improving productivity and accuracy of circuit formation, the metal hoop material 1 provided with the positioning pilot holes 2 is employed. Since the 3D structures 3 are formed on the hoop material 1 with a preset interval maintained therebetween in a lengthwise direction of the hoop material 1, the series of processes can be conducted on a roll 1A (winding of the hoop material 1) basis, which results that handling between the individual processes can be done more easily while increase of troubles and manufacturing costs can be prevented. Further, since the positioning pilot holes 2 serve to facilitate accurate positioning, plating and/or laser processing can be conducted continuously with high precision while a tact time for the positioning work can be reduced.

摘要翻译： 为了获得能够提高电路形成的生产率和精度的3D电路板的制造方法，使用具有定位导向孔2的金属箍材1。 由于三维结构体3在环箍材料1上沿环箍材料1的长度方向以预定的间隔形成在一起，所以可以在卷1A（环箍材1的卷绕）的基础上进行一系列的处理， 结果，可以更容易地进行各个处理之间的处理，同时可以防止麻烦和制造成本的增加。 此外，由于定位导向孔2用于促进精确的定位，因此可以以高精度连续地进行电镀和/或激光加工，同时可以减少定位工作的节拍时间。