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    Abrasive machine
    1.
    发明授权
    Abrasive machine 有权
    磨料机

    公开(公告)号：US06435955B2

    公开(公告)日：2002-08-20

    申请号：US09737006

    申请日：2000-12-14

    申请人： Yasuhide Denda ,  Hisato Kuroiwa ,  Masanori Furukawa ,  Yoshio Nakamura

    发明人： Yasuhide Denda ,  Hisato Kuroiwa ,  Masanori Furukawa ,  Yoshio Nakamura

    IPC分类号： B24B2900

    CPC分类号： B24B37/30 ,  H01L21/30625

    摘要： The abrasive machine is capable of preventing deformation and bad abrasion of an abrasive cloth, maintaining flatness of an abrasive face of an abrasive plate and improving abrading accuracy. The abrasive machine comprises the abrasive plate and a holding unit for holding a work piece. In the holding unit, an inner head has a first concave section. An outer head has a second concave section. A holding plate is provided in the first concave section. An elastic holding member forms a first chamber. An outer enclosing member is provided to the outer head. An inner enclosing member is provided between the outer enclosing member and the inner head. A pressing member presses the abrasive face of the abrasive plate and encloses the holding plate. An elastic ring member a second chamber. A pressurizing unit pressurizes the chambers so as to press the work piece and the pressing member onto the abrasive face.

    摘要翻译： 研磨机能够防止研磨布的变形和磨损不良，保持研磨板的研磨面的平坦度并提高研磨精度。 研磨机包括研磨板和用于保持工件的保持单元。 在保持单元中，内头部具有第一凹部。 外头部具有第二凹部。 保持板设置在第一凹部中。 弹性保持构件形成第一室。 外包装件设置在外头部。 内封闭构件设置在外封闭构件和内头之间。 按压构件按压研磨板的研磨面并包围保持板。 弹性环构件，第二室。 加压单元对腔室加压，以将工件和按压构件按压到研磨面上。

    Method and device for cleaning abrasive plates on an abrasive machine
    3.
    发明授权
    Method and device for cleaning abrasive plates on an abrasive machine 失效
    用于在研磨机上清洁研磨板的方法和装置

    公开(公告)号：US06982009B2

    公开(公告)日：2006-01-03

    申请号：US10937830

    申请日：2004-09-09

    申请人： Yasuhide Denda ,  Yoshio Nakamura ,  Yoshinobu Nishimoto ,  Makoto Nakajima ,  Tsuyoshi Hasegawa ,  Norihiko Moriya

    发明人： Yasuhide Denda ,  Yoshio Nakamura ,  Yoshinobu Nishimoto ,  Makoto Nakajima ,  Tsuyoshi Hasegawa ,  Norihiko Moriya

    IPC分类号： B08B3/00

    CPC分类号： B24B37/08 ,  B08B3/024 ,  B08B15/04 ,  B08B2203/0229 ,  B24B53/017 ,  Y10S134/902

    摘要： The method of the present invention cleans abrasive faces of an upper abrasive plate and a lower abrasive plate of an abrasive machine. The method is executed by a cleaning device including: a nozzle for jetting water; a brush for preventing the jetted water from scattering in the air, the brush enclosing the nozzle; and another brush for closing a gap between the preventing brush and an outer edge of the upper abrasive plate, the method is characterized by the steps of: jetting water from the nozzle toward the abrasive face of the upper abrasive plate; moving the nozzle toward the outer edge of the upper abrasive plate; and closing the gap by the closing brush when the gap is formed between the preventing brush and the outer edge of the upper abrasive plate.

    摘要翻译： 本发明的方法清洗研磨机的上磨料板和下研磨板的磨料面。 该方法由清洁装置执行，该清洁装置包括：用于喷射水的喷嘴; 用于防止喷射水在空气中飞散的刷子，刷子包围喷嘴; 以及用于封闭防磨刷和上磨料板的外边缘之间的间隙的另一刷子，其特征在于以下步骤：从喷嘴向上磨料板的研磨面喷射水; 将喷嘴移向上磨料板的外边缘; 并且当在防磨刷和上磨料板的外边缘之间形成间隙时，通过闭合刷闭合间隙。

    Cloth cleaning device and polishing machine
    4.
    发明授权
    Cloth cleaning device and polishing machine 失效
    布清洁装置和抛光机

    公开(公告)号：US06705929B1

    公开(公告)日：2004-03-16

    申请号：US09716398

    申请日：2000-11-20

    申请人： Yoshinobu Nishimoto ,  Makoto Nakajima ,  Yoshio Nakamura ,  Yasuhide Denda ,  Chihiro Miyagawa

    发明人： Yoshinobu Nishimoto ,  Makoto Nakajima ,  Yoshio Nakamura ,  Yasuhide Denda ,  Chihiro Miyagawa

    IPC分类号： B24B700

    CPC分类号： B24B53/017 ,  B08B3/024

    摘要： Cloth cleaning device of a polishing machine which is capable of fully cleaning a polishing cloth including a part in the vicinity of a center roller. The cloth cleaning device includes an arm movable in a plane parallel to the polishing cloth between a first position above the polishing cloth and a second position outside of the polishing cloth. A jet nozzle is attached to the arm and directs high pressure water toward the polishing cloth. An enclosing member encloses the jet nozzle so as to prevent the high pressure water, which has been directed out from the jet nozzle, from scattering. The jet nozzle is oriented toward the center roller and the high pressure water is directed toward the part of the polishing cloth in the vicinity of the center roller when the arm moves the jet nozzle close to the center roller.

    摘要翻译： 能够完全清洁包括中心辊附近的部分的抛光布的抛光机的布料清洗装置。 布清洁装置包括在抛光布上方的第一位置和抛光布之外的第二位置的平行于抛光布的平面中可移动的臂。 喷嘴连接到臂上，并将高压水引向抛光布。 封闭构件包围喷嘴，以防止从喷嘴喷出的高压水不会飞散。 当喷嘴靠近中心辊移动喷嘴时，喷嘴朝向中心辊定向，高压水指向中心辊附近的抛光布的部分。

    Disk edge polishing machine and disk edge polishing system
    5.
    发明授权
    Disk edge polishing machine and disk edge polishing system 失效
    圆盘抛光机和圆盘抛光系统

    公开(公告)号：US06319100B1

    公开(公告)日：2001-11-20

    申请号：US09565668

    申请日：2000-05-05

    申请人： Yasuhide Denda ,  Satoru Kitta ,  Kiyokazu Gonda ,  Yoshio Nakamura ,  Yoshio Otsuka ,  Toshiaki Seki ,  Takuya Kakegawa ,  Atsushi Kajikura

    发明人： Yasuhide Denda ,  Satoru Kitta ,  Kiyokazu Gonda ,  Yoshio Nakamura ,  Yoshio Otsuka ,  Toshiaki Seki ,  Takuya Kakegawa ,  Atsushi Kajikura

    IPC分类号： B24B906

    CPC分类号： B24B37/02 ,  B24B9/065

    摘要： The disk edge polishing machine is capable of polishing an inner edge of a center hole of a disk and an outer edge thereof. In the disk edge polishing machine, a sucking member has a cylindrical end section. The sucking member sucks the disk by the cylindrical end section and exposes the inner edge and the outer edge of the disk. The sucking member spins together with the disk. An outer polishing member polishes the outer edge of the disk. An inner polishing member is inserted into the center hole and simultaneously polishes the inner edge of the disk. A first driving mechanism relatively moves the outer polishing member and the sucking member close to and away from the outer edge of the disk along a predetermined course. A second driving mechanism relatively moves the inner polishing member and the sucking member close to and away from the inner edge of the disk along another predetermined course extended from the predetermined course.

    摘要翻译： 盘边抛光机能够研磨盘的中心孔的内边缘及其外边缘。 在圆盘边缘抛光机中，吸引构件具有圆筒形端部。 吸引构件通过圆筒形端部吸附盘，并使盘的内缘和外边缘暴露。 抽吸构件与盘一起旋转。 外抛光部件抛光盘的外边缘。 将内部抛光构件插入中心孔中并同时抛光盘的内边缘。 第一驱动机构沿着预定的过程将外部抛光构件和吸附构件相对地移动到靠近和远离盘的外边缘的位置。 第二驱动机构使内部抛光构件和吸附构件沿着从预定路线延伸的另一预定路线相对地移动到靠近和远离盘的内边缘的位置。

    Method of cleaning abrasive plates of abrasive machine and cleaning device
    7.
    发明授权
    Method of cleaning abrasive plates of abrasive machine and cleaning device 失效
    清洗研磨机研磨板和清洗装置的方法

    公开(公告)号：US06807701B2

    公开(公告)日：2004-10-26

    申请号：US09992191

    申请日：2001-11-06

    申请人： Yasuhide Denda ,  Yoshio Nakamura ,  Yoshinobu Nishimoto ,  Makoto Nakajima ,  Tsuyoshi Hasegawa ,  Norihiko Moriya

    发明人： Yasuhide Denda ,  Yoshio Nakamura ,  Yoshinobu Nishimoto ,  Makoto Nakajima ,  Tsuyoshi Hasegawa ,  Norihiko Moriya

    IPC分类号： B08B1100

    CPC分类号： B24B37/08 ,  B08B3/024 ,  B08B15/04 ,  B08B2203/0229 ,  B24B53/017 ,  Y10S134/902

    摘要： The method of the present invention cleans abrasive faces of an upper abrasive plate and a lower abrasive plate of an abrasive machine. The method is executed by a cleaning device including: a nozzle for jetting water; a brush for preventing the jetted water from scattering in the air, the brush enclosing the nozzle; and another brush for closing a gap between the preventing brush and an outer edge of the upper abrasive plate, the method is characterized by the steps of: jetting water from the nozzle toward the abrasive face of the upper abrasive plate; moving the nozzle toward the outer edge of the upper abrasive plate; and closing the gap by the closing brush when the gap is formed between the preventing brush and the outer edge of the upper abrasive plate.

    摘要翻译： 本发明的方法清洗研磨机的上磨料板和下研磨板的磨料面。 该方法由清洁装置执行，该清洁装置包括：用于喷射水的喷嘴; 用于防止喷射水在空气中飞散的刷子，刷子包围喷嘴; 以及用于封闭防磨刷和上磨料板的外边缘之间的间隙的另一刷子，其特征在于以下步骤：从喷嘴向上磨料板的研磨面喷射水; 将喷嘴移向上磨料板的外边缘; 并且当在防磨刷和上磨料板的外边缘之间形成间隙时，通过闭合刷闭合间隙。

    Polishing system for polishing wafer
    8.
    发明授权
    Polishing system for polishing wafer 失效
    抛光晶圆抛光系统

    公开(公告)号：US5908347A

    公开(公告)日：1999-06-01

    申请号：US838636

    申请日：1997-04-11

    申请人： Makoto Nakajima ,  Yoshio Nakamura ,  Yasuhide Denda ,  Toshihisa Yanagisawa ,  Toshiaki Seki ,  Satoru Arakawa ,  Masahiro Takeuchi ,  Mitsue Ogawa ,  Masanori Fukushima

    发明人： Makoto Nakajima ,  Yoshio Nakamura ,  Yasuhide Denda ,  Toshihisa Yanagisawa ,  Toshiaki Seki ,  Satoru Arakawa ,  Masahiro Takeuchi ,  Mitsue Ogawa ,  Masanori Fukushima

    IPC分类号： B23Q41/04 ,  B24B37/00 ,  B24B37/04 ,  B24B49/00

    CPC分类号： B24B37/345 ,  B23Q41/04

    摘要： In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.

    摘要翻译： 在本发明的抛光系统中，粘合单元使用液体将晶片粘附在承载板上。 抛光单元使用抛光板抛光晶片。 馈送单元将承载板从粘合单元传送到抛光单元。 拆卸单元从承载板上取下晶片。 第一排放单元将承载板从抛光单元传送到拆卸单元。 清洁单元清洁空载板。 第二排放单元将搬运单元从拆卸单元传送到清洁单元。 第三排放单元将承载板从清洁单元传送到粘附单元。 这些单元形成为环线，使得承载板在环线中循环并且晶片在其中被抛光。

    Polishing machine
    9.
    发明授权
    Polishing machine 失效
    抛光机

    公开(公告)号：US6080048A

    公开(公告)日：2000-06-27

    申请号：US114823

    申请日：1998-07-14

    申请人： Fuminari Kotagiri ,  Yoshio Nakamura ,  Yasuhide Denda ,  Haruo Sumizawa ,  Atsushi Kajikura ,  Satoki Kanda

    发明人： Fuminari Kotagiri ,  Yoshio Nakamura ,  Yasuhide Denda ,  Haruo Sumizawa ,  Atsushi Kajikura ,  Satoki Kanda

    IPC分类号： B24B37/08 ,  B24B47/04 ,  B24B5/00

    CPC分类号： B24B37/08 ,  B24B41/067 ,  B24B47/04

    摘要： The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier is formed into a thin plate having a through-hole in which a work piece is accommodated. An upper polishing plate polishes an upper face of the work piece. A lower polishing plate pinches the work piece with the upper polishing plate and polishes a lower face of the work piece. A driving mechanism moves the carrier along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece, which has been pinched between the polishing plates, are polished by the polishing plates.

    摘要翻译： 本发明的研磨机能够提高工件的平坦度。 在抛光机中，载体形成为具有容纳工件的通孔的薄板。 上抛光板抛光工件的上表面。 下抛光板用上抛光板夹住工件并抛光工件的下表面。 驱动机构沿着圆形轨道在平面内移动载体而不旋转。 利用这种结构，被研磨板之间被夹持的工件的上表面和下表面被抛光板抛光。