摘要:
A device and method automatically generate a program for buffering differences based on characteristics of a component. A buffer program for buffering differences of the way to use a component during different software environments is automatically generated. The device includes a controller for executing automatic generation of the buffer program, a memory including control information and a processing program, an input device for inputting the processing content of the component, and an output device for outputting the automatically generated buffer program. The memory records a plurality of forms for buffering the component as the control information and the controller extracts characteristic information based on the processing content of the component and records the extracted characteristic information as control information in the memory, selects a specified form based on the characteristic information, and generates the buffer program based on the selected form and the characteristic information.
摘要:
A device and method automatically generate a program for buffering differences based on characteristics of a component. A buffer program for buffering differences of the way to use a component during different software environments is automatically generated. The device includes a controller for executing automatic generation of the buffer program, a memory including control information and a processing program, an input device for inputting the processing content of the component, and an output device for outputting the automatically generated buffer program. The memory records a plurality of forms for buffering the component as the control information and the controller extracts characteristic information based on the processing content of the component and records the extracted characteristic information as control information in the memory, selects a specified form based on the characteristic information, and generates the buffer program based on the selected form and the characteristic information.
摘要:
The present invention is provided to apply a screen mockup developed for prototyping, without any modification, to actual product development for which the architecture differs. An automatic program generation device has: a storage part 170 for storing a screen mockup program 1720, a component setup file 1730, and execution architecture definition information 1760, a storage part 160 for storing component data, a mockup design information analysis part 110 for generating component design information from the screen mockup program 1720 and the component setup file 1730 and configuring a program execution infrastructure from the execution architecture definition information 1760, a component architecture decision part 130 for selecting on the basis of the component design information a program code fragment, which operates on the configured program execution infrastructure, and a program code generation part 140 for generating a program code from the selected program code fragment.
摘要:
A semiconductor apparatus includes a wiring pattern, an insulating film, and a thin-metal-film resistor element. The insulating film is formed on the wiring pattern having connection holes vertically penetrating there-through to expose part of the wiring pattern at bottom regions of the connection holes. The connection holes are arranged with a space there-between. The thin-metal-film resistor element is formed on the insulating film and extending to continuously overlay and contact surfaces of the insulating film, inner walls of the connection holes, and the wiring pattern at the bottom regions of the connection holes.
摘要:
A semiconductor device equipped with a metal thin film resistor is disclosed. The semiconductor device includes a second interlayer insulating film formed on a first interlayer insulating film including a formation area of a wiring pattern. Connecting holes are formed in the second interlayer insulating film corresponding to both ends of the metal thin film resistor and the wiring pattern. An upper part of each connecting hole is formed in a taper shape. A sidewall is formed on the inner wall of each connecting hole. The metal thin film resistor is formed on the second interlayer insulating film between the connecting holes, inside of each connecting hole, and on the wiring pattern.
摘要:
In a pixel density converting apparatus according to the present invention, a pixel density conversion element for converting a pixel density by a factor of an arbitrary value, such as an element of the projection method or the linear interpolation method, a pixel density conversion element for increasing or decreasing a pixel density by a factor of an integer, such as an element of the majority or logical OR method, and a binarization element for conducting binarization while correcting quantizing errors, such as an element of the error diffusion method or the average error minimizing method, are combined with each other with the advantages and disadvantages of the respective elements taken into consideration, so as to achieve excellent conversion whether or not the image on which pixel density conversion is conducted or an image area is a pseudo half-tone processed image. In consequence, excellent pixel density conversion is achieved on a binary image in which a pseudo half-tone processed image and characters or line drawings are present in a mixed state.
摘要:
An image processing apparatus displaying an identification performance between the image of half-tone and an image of tone other than the half-tone includes a device for correcting the characteristics of the input image signal and an identifying device capable of identifying whether the input image signal is the half-tone image or not without use of the image signal whose characteristics have been corrected. In accordance with the result of the identification performed by this identifying device, an output image signal is selected.
摘要:
A semiconductor apparatus includes a cell section including at least two transistors. A layer interval insulation coat is formed at least overlying the gate electrode use polysilicon and the gate contact use polysilicon. A source electrode metal coat is formed overlying the semiconductor substrate and insulated from the gate electrode use polysilicon and the gate contact use polysilicon, and is electrically connected to the body diffusion layer and the source diffusion layer. A gate use connection hole is formed on the layer interval insulation coat overlying the gate contact use polysilicon. The gate use connection hole has a width larger than that of the trench. A gate electrode metal coat is formed on the gate use connection hole and the layer interval insulation coat. The polysilicon coat is formed at the same level or lower than the surface of the semiconductor substrate.
摘要:
A semiconductor device, a method for manufacturing the semiconductor device, and an integrated circuit including the semiconductor device are disclosed. The semiconductor device includes a substrate section, a resistor formed on the substrate section, a metal pattern formed on the resistor, an oxide pattern formed on the metal pattern, and a protective film covering the resistor, the metal pattern and the oxide pattern. With this structure, the metal pattern sufficiently prevents formation of an oxide film on a surface of the resistor even when dry ashing or dry etching is performed in the manufacturing process.
摘要:
A semiconductor device includes: an insulating film; a metal thin-film resistance element; a wiring pattern formed on the insulating film, a part of which forms an electrode for electrically connecting with the metal thin-film resistance element; and a side wall produced at least on a side surface of the electrode of the wiring pattern, and made of an insulation material, wherein: the metal thin-film resistance element is produced across a top surface of the electrode and a surface of the insulating film via a surface of the side wall.