Method for treatment of Bayer liquor
    1.
    发明授权
    Method for treatment of Bayer liquor 失效
    拜耳液处理方法

    公开(公告)号:US4280987A

    公开(公告)日:1981-07-28

    申请号:US53521

    申请日:1979-06-29

    IPC分类号: C01F7/14 C01F7/47 C01F7/06

    CPC分类号: C01F7/144 C01F7/473

    摘要: Bayer liquor containing carbon compounds is freed from the carbon compounds by a method which comprises adjusting the molar ratio of the aluminum component to the sodium component in the liquid to a value in the range of from 1 to 5 calculated as Al.sub.2 O.sub.3 /Na.sub.2 O and heating the resultant Bayer liquor.

    摘要翻译: 含有碳化合物的拜耳液体通过包括将铝组分与液体中的钠组分的摩尔比调节为以Al 2 O 3 / Na 2计算的1至5的范围的值,并将 结果拜耳酒。

    Reclamation method of semiconductor wafer
    3.
    发明授权
    Reclamation method of semiconductor wafer 有权
    半导体晶圆的回收方法

    公开(公告)号:US08092278B2

    公开(公告)日:2012-01-10

    申请号:US12468308

    申请日:2009-05-19

    申请人: Yasunori Yamada

    发明人: Yasunori Yamada

    IPC分类号: B24B1/00

    CPC分类号: H01L21/02032 H01L21/02021

    摘要: Chamfer correction is performed to a chamfered portion at least on a front side of a silicon wafer after an incoming inspection. Thereby, a thickness of the chamfered portion on the front side of the wafer is restored, and thus the number of reclamation cycles of the silicon wafer can be increased. In addition, the chamfered portion is not deformed even after reclamation is repeated for a plurality of times.

    摘要翻译: 在进入检查之后,至少在硅晶片的前侧对倒角部进行倒角校正。 由此,能够恢复晶片正面的倒角部的厚度,能够提高硅晶片的再生循环次数。 此外,即使在重复多次重复之后,倒角部也不变形。

    COMPUTER SYSTEM
    4.
    发明申请
    COMPUTER SYSTEM 审中-公开
    电脑系统

    公开(公告)号:US20070165018A1

    公开(公告)日:2007-07-19

    申请号:US11614175

    申请日:2006-12-21

    申请人: Yasunori Yamada

    发明人: Yasunori Yamada

    IPC分类号: G09G5/00 G06F3/038

    CPC分类号: G06F1/28

    摘要: A client device used by a user is formed by a PC as a first client and a terminal device as a second client. The terminal device is, for example, a portable type and has software capable of inputting/outputting information to/from a personal computer (PC) and being controlled at a remote place. For example, a plurality of PCs are integrated for management. Data used by the user is not stored in the terminal device side but stored in the PC side. The PC includes, for example, a sub processor and a state of the main body is monitored by the sub processor so as to detect abnormality.

    摘要翻译: 用户使用的客户端设备由作为第一客户端的PC和作为第二客户端的终端设备形成。 终端装置例如是便携式装置,并且具有能够向个人计算机(PC)输入/输出信息并且被控制在远程位置的软件。 例如,多个PC被集成用于管理。 用户使用的数据不存储在终端设备侧,但存储在PC端。 PC包括例如子处理器,并且主体的状态由子处理器监视以检测异常。

    Method of grinding semiconductor wafers, grinding surface plate, and grinding device
    6.
    发明授权
    Method of grinding semiconductor wafers, grinding surface plate, and grinding device 有权
    研磨半导体晶圆,研磨面板和研磨装置的方法

    公开(公告)号:US08092277B2

    公开(公告)日:2012-01-10

    申请号:US12470714

    申请日:2009-05-22

    IPC分类号: B24B1/00 B24B7/17

    摘要: A method of grinding semiconductor wafers including simultaneously grinding both surfaces of multiple semiconductor wafers by rotating the wafers between a pair of upper and lower rotating surface plates in a state where the wafers are held on a carrier so that centers of the wafers are positioned on a circumference of a single circle, wherein a ratio of an area of a circle passing through the centers of the wafers to an area of one of the wafers is greater than or equal to 1.33 but less than 2.0; surfaces of the fixed abrasive grains comprised in the surface plates are comprised of pellets disposed in a grid-like fashion, with the pellets provided in a center portion and pellets provided in a peripheral portion being larger in size than the pellets provided in an intermediate portion.

    摘要翻译: 一种研磨半导体晶片的方法,包括在晶片被保持在载体上的状态下,通过在一对上下旋转表面板之间旋转晶片同时研磨多个半导体晶片的两个表面,使得晶片的中心位于 圆周,其中通过晶片中心的圆的面积与一个晶片的面积的比率大于或等于1.33但小于2.0; 包含在表面板中的固定磨料颗粒的表面由网格状排列的颗粒组成,颗粒设置在中心部分,并且设置在周边部分中的颗粒的尺寸大于设置在中间部分中的颗粒 。

    METHOD FOR MANUFACTURING SOFT CAPSULE AND APPARATUS FOR MANUFACTURING THE SAME
    7.
    发明申请
    METHOD FOR MANUFACTURING SOFT CAPSULE AND APPARATUS FOR MANUFACTURING THE SAME 有权
    制造软胶囊的方法及其制造方法

    公开(公告)号:US20110162783A1

    公开(公告)日:2011-07-07

    申请号:US13119631

    申请日:2008-09-26

    IPC分类号: B32B37/02 B32B38/00 B32B37/14

    CPC分类号: A61K9/4816 A23P10/30 A61J3/07

    摘要: An apparatus for manufacturing a soft capsule containing a filling coated with a shell portion formed of a shell-sheet, having a sheet molding section forming a shell-sheet having an almost uniform thickness from a molten shell material, a capsule molding section feeding shell-sheets between a pair of die rolls and joining the shell sheets, and a filling supply section supplying a filling to the shell-sheets in time for joining the shell-sheets, in which the sheet molding section has a dryer equipped with a medium wavelength infrared heater; the shell-sheet is irradiated with a medium wavelength infrared ray from the heater to thereby obtain an almost uniform thickness, an appropriate viscosity, and moisture content; and the sheet of this state is fed to the capsule molding section.

    摘要翻译: 1.一种软胶囊的制造装置,其特征在于,具有:由壳片形成的壳体的填充物的软胶囊,具有从熔融壳材料形成厚度几乎均匀的壳片的片状成型部, 在一对模具辊之间并连接壳板的片材,以及填充供应部分及时向壳体提供用于接合壳体的填充物,其中片材成型部分具有装备有中波长红外线 加热器 用来自加热器的中波长红外线照射壳片,从而获得几乎均匀的厚度,适当的粘度和水分含量; 并且将该状态的片材供给到胶囊成型部。

    Measuring instrument with multiple signal terminals shared in multiple operation modes
    8.
    发明授权
    Measuring instrument with multiple signal terminals shared in multiple operation modes 失效
    具有多个信号端子的测量仪器在多种操作模式下共享

    公开(公告)号:US06816708B1

    公开(公告)日:2004-11-09

    申请号:US09857851

    申请日:2001-06-11

    IPC分类号: H04B1700

    摘要: A housing 1 contains a plurality of signal processing units for performing signal processing corresponding to a plurality of operation modes. At a front surface 1a of the housing, an operation panel 3, a display, and a plurality of signal terminals 5a are provided, the signal terminals being located close to the display and shared by the signal processing units. A signal name memory stores signal names 11 allocated to the respective signal terminals for each of the signal processing units. A changeover switch is switched such that the signal processing units are connected to the signal processing unit corresponding to the designated operation mode in response to the operation-input operation mode designation, and the signal name corresponding to the designated operation mode is read out from the signal name memory, and is then displayed in the vicinity of the corresponding signal terminal on a display screen 4a of the display.

    摘要翻译: 壳体1包含用于对应于多个操作模式执行信号处理的多个信号处理单元。 在壳体的前表面1a处,设置有操作面板3,显示器和多个信号端子5a,信号端子靠近显示器并被信号处理单元共享。 信号名称存储器存储为每个信号处理单元分配给各个信号端子的信号名称11。 切换切换开关,使得响应于操作输入操作模式指定,信号处理单元连接到与指定操作模式相对应的信号处理单元,并且从指定操作模式中读出与指定操作模式对应的信号名称 信号名称存储器,然后显示在显示器的显示屏幕4a上的对应信号端子附近。

    Method for manufacturing soft capsule and apparatus for manufacturing the same
    9.
    发明授权
    Method for manufacturing soft capsule and apparatus for manufacturing the same 有权
    软胶囊的制造方法及其制造装置

    公开(公告)号:US08572933B2

    公开(公告)日:2013-11-05

    申请号:US13119631

    申请日:2008-09-26

    IPC分类号: B65B47/00

    CPC分类号: A61K9/4816 A23P10/30 A61J3/07

    摘要: An apparatus for manufacturing a soft capsule containing a filling coated with a shell portion formed of a shell-sheet, having a sheet molding section forming a shell-sheet having an almost uniform thickness from a molten shell material, a capsule molding section feeding shell-sheets between a pair of die rolls and joining the shell sheets, and a filling supply section supplying a filling to the shell-sheets in time for joining the shell-sheets, in which the sheet molding section has a dryer equipped with a medium wavelength infrared heater; the shell-sheet is irradiated with a medium wavelength infrared ray from the heater to thereby obtain an almost uniform thickness, an appropriate viscosity, and moisture content; and the sheet of this state is fed to the capsule molding section.

    摘要翻译: 1.一种软胶囊的制造装置,其特征在于,具有:由壳片形成的壳体的填充物的软胶囊,具有从熔融壳材料形成厚度几乎均匀的壳片的片状成型部, 在一对模具辊之间并连接壳板的片材,以及填充供应部分及时提供用于接合壳体的壳体的填充物,其中片材成型部分具有装备有中波长红外线 加热器 用来自加热器的中波长红外线照射壳片,从而获得几乎均匀的厚度,适当的粘度和水分含量; 并且将该状态的片材供给到胶囊成型部。