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公开(公告)号：US4553844A
公开(公告)日：1985-11-19
申请号：US432799
申请日：1982-10-05
申请人： Yasuo Nakagawa , Yoshitada Oshida , Kanji Ishige
发明人： Yasuo Nakagawa , Yoshitada Oshida , Kanji Ishige
CPC分类号： G01B11/2518
摘要： Method and system of detecting a configuration of a three-dimensional object, in which use is made of a spot beam to be directed to the object. The spot beam is caused to scan the object in a horizontal direction and the resulting spot image is detected through observation in a direction transverse to the horizontal direction. The system includes a laser light source, two Fourier transformation lenses having their Fourier transformation planes intersecting each other on the optical axes of the lenses on a light deflector, a photoelectric converter provided on the object plane of one of the lenses, the laser light source being disposed on the same meridian as the converter, and at least one reflecting mirror provided for forming a real image of the spot of the beam on the object.
摘要翻译： 检测三维物体的构造的方法和系统，其中使用要指向物体的点光束。 使点光束在水平方向上扫描物体，并且通过沿横向于水平方向的方向观察来检测所得到的光斑图像。 该系统包括激光光源，两个傅立叶变换透镜，其傅立叶变换平面在光偏转器上的透镜的光轴上彼此相交，设置在其中一个透镜的物平面上的光电转换器，激光光源 设置在与转换器相同的子午线上，以及至少一个反射镜，用于在物体上形成光束点的实际图像。
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公开(公告)号：US4819327A
公开(公告)日：1989-04-11
申请号：US17532
申请日：1987-02-24
申请人： Syuuzi Tatsuoka , Hiroshi Sekiyama , Kanji Ishige
发明人： Syuuzi Tatsuoka , Hiroshi Sekiyama , Kanji Ishige
CPC分类号： B23K1/08 , H05K3/3468 , H05K2201/09781 , H05K2201/10189 , H05K2203/046 , H05K3/3405 , Y10T29/49144
摘要： This invention relates to a method of soldering electronic components for a printed circuit board by dipping the printed circuit board into a molten solder inside a soldering bath. When the printed circuit board is dipped into the molten solder inside the soldering bath, it is dipped together with a member that attracts the molten solder, and when the printed circuit board is pulled up from the molten solder, it is pulled up while the edge of the member keeps contact with a solder connection portion of the printed circuit board. After the printed circuit board is pulled from the molten solder, the edge of the member is separated from the printed circuit board to remove any excessive solder adhering to the connection portion by the surface tension of the solder.
摘要翻译： 本发明涉及一种通过将印刷电路板浸入焊接槽内的熔融焊料来焊接印刷电路板的电子部件的方法。 当印刷电路板浸入焊锡槽内的熔融焊料中时，将其与吸引熔融焊料的部件浸在一起，并且当印刷电路板从熔融焊料中拉出时，其被拉起，而边缘 的构件与印刷电路板的焊接连接部分保持接触。 在从熔融焊料拉出印刷电路板之后，该部件的边缘与印刷电路板分离，以通过焊料的表面张力除去附着在连接部分上的任何过量的焊料。
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公开(公告)号：US4437603A
公开(公告)日：1984-03-20
申请号：US221458
申请日：1980-12-30
IPC分类号： G05B19/40 , G05B19/414 , H05K3/10 , H05K13/06
CPC分类号： H05K13/06 , G05B19/40 , G05B19/4142 , G05B2219/34239 , Y10T29/49162
摘要： A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head. The wire guide unit sequentially pays out the insulated fine wire onto the printed circuit board carried by the X-Y table, the bonding unit exposes the core of the payed-out insulated wire and fuses the wire for connection thereof to the conductor pad of the printed circuit board by heating and depressing the payed-out wire, and the wire cutter unit cuts away the wire after completion of wiring.
摘要翻译： 在布线图案的印刷电路板上自动布线作为布线图案的印刷电路板上的毛发的绝缘细线的机器被设置在相邻的要布线的导体印刷电路板之间，该XY台可在X和Y方向上移动 ，并且XY台根据配线位置移动。 安装在XY工作台上方的线引导单元，接合单元和线切割器单元围绕垂直于XY工作台表面的轴可旋转地支撑的头部被旋转，以便在各个方向上被定向成光学 支撑装置用于沿着键合头的旋转轴从上方对操作进行光学监视。 导线单元顺序地将绝缘细线支撑到由XY工作台承载的印刷电路板上，接合单元暴露所付出的绝缘电线的芯并将导线熔接到印刷电路板的导体焊盘上 通过加热和压下付出的电线，线切割器单元在接线完成之后切断电线。
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