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公开(公告)号:US20060291246A1
公开(公告)日:2006-12-28
申请号:US11287236
申请日:2005-11-28
申请人: Yasushi Hattori , Shinji Saito , Shinya Nunoue , Masahiro Yamamoto , Naomi Shida , Kei Kaneko , Genichi Hatakoshi
发明人: Yasushi Hattori , Shinji Saito , Shinya Nunoue , Masahiro Yamamoto , Naomi Shida , Kei Kaneko , Genichi Hatakoshi
IPC分类号: F21V7/04
CPC分类号: H01L33/507 , H01L33/505 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2924/3025 , H01S5/005 , H01S5/02248 , H01S5/0228 , H01S5/183 , H01S5/32341 , H01S5/327 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor light emitting element includes a semiconductor light emitting element emitting light beams in ultraviolet ranges and visible ranges, and a fluorescent element absorbing the light beams from the semiconductor light emitting element and outputting visible light beams in a light taking-out direction different from a light emitting direction. The light beams emitted from the light emitting element is absorbed within the semiconductor light emitting device.
摘要翻译: 半导体发光元件包括发射紫外范围和可见光范围的光束的半导体发光元件,以及吸收来自半导体发光元件的光束的荧光元件,并且沿与第一半导体发光元件不同的光取出方向输出可见光束 发光方向。 从发光元件发射的光束在半导体发光器件内被吸收。
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公开(公告)号:US07525127B2
公开(公告)日:2009-04-28
申请号:US11287236
申请日:2005-11-28
申请人: Yasushi Hattori , Shinji Saito , Shinya Nunoue , Masahiro Yamamoto , Naomi Shida , Kei Kaneko , Genichi Hatakoshi
发明人: Yasushi Hattori , Shinji Saito , Shinya Nunoue , Masahiro Yamamoto , Naomi Shida , Kei Kaneko , Genichi Hatakoshi
IPC分类号: H01L27/15
CPC分类号: H01L33/507 , H01L33/505 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2924/3025 , H01S5/005 , H01S5/02248 , H01S5/0228 , H01S5/183 , H01S5/32341 , H01S5/327 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor light emitting element includes a semiconductor light emitting element emitting light beams in ultraviolet ranges and visible ranges, and a fluorescent element absorbing the light beams from the semiconductor light emitting element and outputting visible light beams in a light taking-out direction different from a light emitting direction. The light beams emitted from the light emitting element are absorbed within the semiconductor light emitting device.
摘要翻译: 半导体发光元件包括发射紫外范围和可见光范围的光束的半导体发光元件,以及吸收来自半导体发光元件的光束的荧光元件,并且沿与第一半导体发光元件不同的光取出方向输出可见光束 发光方向。 从发光元件发射的光束被吸收在半导体发光器件内。
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公开(公告)号:US20070138484A1
公开(公告)日:2007-06-21
申请号:US11561670
申请日:2006-11-20
IPC分类号: H01L33/00
CPC分类号: H01L33/505 , H01L33/20 , H01L33/62 , H01L2224/48091 , H01L2224/8592 , H01L2924/01019 , H01L2924/01067 , H01L2924/01068 , H01L2924/01322 , H01L2924/10156 , H01L2924/00014
摘要: A light-emitting device is provided, which includes a substrate, a light-emitting element configured to emit light having a first wavelength, the light-emitting element having a pair of electrodes and being formed above the substrate, a metal layer interposed between the substrate and the light-emitting element and having a planar configuration, and a wavelength converting layer formed on the metal layer. The periphery of the metal layer is at least partially constituted by a plurality of projected portions and a plurality of recessed portions. The plurality of projected portions locates outside of the light-emitting element. The wavelength converting layer absorbs at least part of the light emitted from the light-emitting element and converts the first wavelength, thereby light having a second wavelength differing in wavelength from the first wavelength is emitted.
摘要翻译: 提供一种发光装置,其包括基板,配置为发射具有第一波长的光的发光元件,所述发光元件具有一对电极并形成在所述基板的上方,金属层插入在所述基板 基板和发光元件,并且具有平面构造,以及形成在金属层上的波长转换层。 金属层的周边至少部分地由多个突起部和多个凹部构成。 多个突出部位于发光元件的外侧。 波长转换层吸收从发光元件发射的光的至少一部分并转换第一波长,从而发射具有与第一波长不同的波长的第二波长的光。
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公开(公告)号:US20070001568A1
公开(公告)日:2007-01-04
申请号:US11348410
申请日:2006-02-07
申请人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
发明人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
IPC分类号: H01J1/62
CPC分类号: H01L33/505 , C09K11/7734 , C09K11/7774 , H01L33/20 , H01L33/502 , H01L2224/48091 , H01L2224/8592 , H01L2924/3025 , H05B33/10 , H05B33/14 , Y10T428/24521 , Y10T428/25 , Y10T428/256 , Y10T428/258 , H01L2924/00014 , H01L2924/00
摘要: A light-emitting device is provided, which includes a supporting member, a light-emitting element disposed on the supporting member to emit a light, and a fluorescent layer formed on the light-emitting element and having a thickness ranging from 80 to 240 μm, the fluorescent layer containing a light-transmitting member and a fluorescent substance having a particle diameter ranging from 20 to 45 μm at a concentration of 40 to 60 wt %.
摘要翻译: 提供了一种发光装置,其包括支撑构件,设置在支撑构件上以发光的发光元件和形成在发光元件上并具有80至240μm的厚度的荧光层 荧光层含有40〜60重量%的透光性物质和粒径为20〜45μm的荧光物质。
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公开(公告)号:US20110171761A1
公开(公告)日:2011-07-14
申请号:US13053922
申请日:2011-03-22
申请人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
发明人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
IPC分类号: H01L33/50
CPC分类号: H01L33/505 , C09K11/7734 , C09K11/7774 , H01L33/20 , H01L33/502 , H01L2224/48091 , H01L2224/8592 , H01L2924/3025 , H05B33/10 , H05B33/14 , Y10T428/24521 , Y10T428/25 , Y10T428/256 , Y10T428/258 , H01L2924/00014 , H01L2924/00
摘要: A method of manufacturing a light-emitting device includes disposing a light-emitting element on a supporting member, dispersing a fluorescent substance having a particle diameter of 20 to 45 μm in a material of the light-transmitting member at a concentration of 40 to 60 wt %, dripping raw material for the fluorescent layer on the light-emitting element while lowering the viscosity of the raw material, and thermally curing the coated layer.
摘要翻译: 发光装置的制造方法包括将发光元件配置在支撑构件上,将具有20〜45μm的粒径的荧光物质分散在透光构件的材料中,浓度为40〜60 wt%,同时在降低原料粘度的同时滴加发光元件上荧光层的原料,并使涂层热固化。
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公开(公告)号:US07663307B2
公开(公告)日:2010-02-16
申请号:US11355886
申请日:2006-02-17
申请人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
发明人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
CPC分类号: H01L33/20 , H01L33/505 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2924/01004 , H01L2924/01012 , H01L2924/0102 , H01L2924/01057 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: A light-emitting device is provided, which includes a supporting member, a light-emitting element disposed on the supporting member to emit a light, the light-emitting element having a semiconductor substrate and a polygonal top surface, an electrode pad formed on the top surface of the light-emitting element, a first lead electrode formed on the supporting member, a conductive wire connecting the electrode pad with the first lead electrode, the conductive wire being arranged to pass over one of corners of the polygonal top surface of the light-emitting element and along a ridge formed contiguous to the one of corners and corresponding to a boundary between neighboring side surfaces of the light-emitting element, and a fluorescent layer containing a light-transmitting member and a fluorescent substance.
摘要翻译: 提供一种发光装置,其包括支撑构件,设置在支撑构件上以发光的发光元件,具有半导体衬底和多边形顶表面的发光元件,形成在所述支撑构件上的电极垫 所述发光元件的顶表面,形成在所述支撑构件上的第一引线电极,将所述电极焊盘与所述第一引线电极连接的导线,所述导线布置成越过所述第一引线电极的多边形顶表面中的一个角 发光元件并且沿着与所述角部中的一个相邻并且对应于所述发光元件的相邻侧表面之间的边界形成的脊,以及包含透光构件和荧光物质的荧光层。
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公开(公告)号:US08974852B2
公开(公告)日:2015-03-10
申请号:US13053922
申请日:2011-03-22
申请人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
发明人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
CPC分类号: H01L33/505 , C09K11/7734 , C09K11/7774 , H01L33/20 , H01L33/502 , H01L2224/48091 , H01L2224/8592 , H01L2924/3025 , H05B33/10 , H05B33/14 , Y10T428/24521 , Y10T428/25 , Y10T428/256 , Y10T428/258 , H01L2924/00014 , H01L2924/00
摘要: A method of manufacturing a light-emitting device includes disposing a light-emitting element on a supporting member, dispersing a fluorescent substance having a particle diameter of 20 to 45 μm in a material of the light-transmitting member at a concentration of 40 to 60 wt %, dripping raw material for the fluorescent layer on the light-emitting element while lowering the viscosity of the raw material, and thermally curing the coated layer.
摘要翻译: 发光装置的制造方法包括将发光元件配置在支撑构件上,将具有20〜45μm的粒径的荧光物质分散在透光构件的材料中,浓度为40〜60 wt%,同时在降低原料粘度的同时滴加发光元件上荧光层的原料,并使涂层热固化。
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公开(公告)号:US07932666B2
公开(公告)日:2011-04-26
申请号:US11348410
申请日:2006-02-07
申请人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
发明人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
IPC分类号: H01J1/62
CPC分类号: H01L33/505 , C09K11/7734 , C09K11/7774 , H01L33/20 , H01L33/502 , H01L2224/48091 , H01L2224/8592 , H01L2924/3025 , H05B33/10 , H05B33/14 , Y10T428/24521 , Y10T428/25 , Y10T428/256 , Y10T428/258 , H01L2924/00014 , H01L2924/00
摘要: A light-emitting device is provided, which includes a supporting member, a light-emitting element disposed on the supporting member to emit a light, and a fluorescent layer formed on the light-emitting element and having a thickness ranging from 80 to 240 μm, the fluorescent layer containing a light-transmitting member and a fluorescent substance having a particle diameter ranging from 20 to 45 μm at a concentration of 40 to 60 wt %.
摘要翻译: 提供一种发光装置,其包括支撑构件,设置在支撑构件上以发光的发光元件和形成在发光元件上并具有80至240μm的厚度的荧光层 荧光层含有透光性物质和浓度为40〜60重量%的粒径为20〜45μm的荧光物质。
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公开(公告)号:US20070013304A1
公开(公告)日:2007-01-18
申请号:US11355886
申请日:2006-02-17
申请人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
发明人: Kei Kaneko , Naomi Shida , Masahiro Yamamoto , Yasushi Hattori
IPC分类号: H01L33/00
CPC分类号: H01L33/20 , H01L33/505 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2924/01004 , H01L2924/01012 , H01L2924/0102 , H01L2924/01057 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: A light-emitting device is provided, which includes a supporting member, a light-emitting element disposed on the supporting member to emit a light, the light-emitting element having a semiconductor substrate and a polygonal top surface, an electrode pad formed on the top surface of the light-emitting element, a first lead electrode formed on the supporting member, a conductive wire connecting the electrode pad with the first lead electrode, the conductive wire being arranged to pass over one of corners of the polygonal top surface of the light-emitting element and along a ridge formed contiguous to the one of corners and corresponding to a boundary between neighboring side surfaces of the light-emitting element, and a fluorescent layer containing a light-transmitting member and a fluorescent substance.
摘要翻译: 提供一种发光装置,其包括支撑构件,设置在支撑构件上以发光的发光元件,具有半导体衬底和多边形顶表面的发光元件,形成在所述支撑构件上的电极垫 所述发光元件的顶表面,形成在所述支撑构件上的第一引线电极,将所述电极焊盘与所述第一引线电极连接的导线,所述导线布置成越过所述第一引线电极的多边形顶表面中的一个角 发光元件并且沿着与所述角部中的一个相邻并且对应于所述发光元件的相邻侧表面之间的边界形成的脊,以及包含透光构件和荧光物质的荧光层。
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公开(公告)号:US09130127B2
公开(公告)日:2015-09-08
申请号:US13204082
申请日:2011-08-05
申请人: Hiroshi Katsuno , Yasuo Ohba , Satoshi Mitsugi , Shinji Yamada , Mitsuhiro Kushibe , Kei Kaneko
发明人: Hiroshi Katsuno , Yasuo Ohba , Satoshi Mitsugi , Shinji Yamada , Mitsuhiro Kushibe , Kei Kaneko
CPC分类号: H01L33/382 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/385 , H01L2224/48091 , H01L2224/73265 , H01L2933/0091 , H01L2924/00014
摘要: According to one embodiment, a semiconductor light emitting device includes a stacked structure body, first and second electrodes. The stacked structure body includes first and second semiconductor layers and a light emitting layer provided between the second and first semiconductor layers, and has first and second major surfaces. The first electrode has a first contact part coming into contact with the first semiconductor layer. The second electrode has a part coming into contact with the second semiconductor layer. A surface of the first semiconductor layer on a side of the first major surface has a first part having a part overlapping a contact surface with the first semiconductor layer and a second part having a part overlapping the second semiconductor layer. The second part has irregularity. A pitch of the irregularity is longer than a peak wavelength of emission light. The first part has smaller irregularity than the second part.
摘要翻译: 根据一个实施例,半导体发光器件包括堆叠结构体,第一和第二电极。 叠层结构体包括第一和第二半导体层以及设置在第二和第一半导体层之间的发光层,并且具有第一和第二主表面。 第一电极具有与第一半导体层接触的第一接触部分。 第二电极具有与第二半导体层接触的部分。 第一主表面一侧的第一半导体层的表面具有第一部分,其第一部分具有与第一半导体层的接触表面重叠的部分,第二部分具有与第二半导体层重叠的部分。 第二部分是不规律的。 不规则的间距比发光的峰值波长长。 第一部分具有比第二部分更小的不规则性。
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