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1.发明授权Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device 失效多层布线基板，其制造方法，半导体装置以及无线电子装置公开(公告)号：US07592250B2
公开(公告)日：2009-09-22
申请号：US11653417
申请日：2007-01-16
申请人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazunori Yamamoto
发明人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazunori Yamamoto
IPC分类号： H01L21/4763
CPC分类号： H05K1/162 , H05K3/4602 , H05K2201/0347 , H05K2201/09509 , H05K2201/0959
摘要： A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device.
摘要翻译： 具有优异成型性的多层布线基板和具有抑制电容变化的电容器，其制造方法，在多层布线板上安装半导体芯片的半导体器件以及安装半导体器件的无线电子器件。
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2.发明授权Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device 有权多层布线板及其制造方法，半导体装置及无线电电子装置公开(公告)号：US07239013B2
公开(公告)日：2007-07-03
申请号：US10521470
申请日：2003-05-30
申请人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazunori Yamamoto
发明人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazunori Yamamoto
IPC分类号： H01L23/52
CPC分类号： H05K1/162 , H05K3/4602 , H05K2201/0347 , H05K2201/09509 , H05K2201/0959
摘要： A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.
摘要翻译： 具有优异的成形性的多层布线基板和具有抑制电容变化的电容器，其制造方法，在多层布线板上安装半导体芯片的半导体器件，以及安装该半导体器件的无线电电子器件。
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3.发明申请Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device 失效多层布线基板，其制造方法，半导体装置以及无线电子装置公开(公告)号：US20070108588A1
公开(公告)日：2007-05-17
申请号：US11653417
申请日：2007-01-16
申请人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazunori Yamamoto
发明人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazunori Yamamoto
IPC分类号： H01L23/52
CPC分类号： H05K1/162 , H05K3/4602 , H05K2201/0347 , H05K2201/09509 , H05K2201/0959
摘要： A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device.
摘要翻译： 具有优异成型性的多层布线基板和具有抑制电容变化的电容器，其制造方法，在多层布线板上安装半导体芯片的半导体器件以及安装半导体器件的无线电子器件。
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4.发明申请Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device 有权多层布线板及其制造方法，半导体装置及无线电电子装置公开(公告)号：US20060063367A1
公开(公告)日：2006-03-23
申请号：US10521470
申请日：2003-05-30
申请人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazumori Yamamoto
发明人： Yasushi Shimada , Yoshitaka Hirata , Hiroyuki Kuriya , Kazuhisa Otsuka , Masanori Yamaguchi , Yuichi Shimayama , Ken Madarame , Etsuo Mizushima , Yuusuke Kondou , Kazumori Yamamoto
IPC分类号： H01L21/4763
CPC分类号： H05K1/162 , H05K3/4602 , H05K2201/0347 , H05K2201/09509 , H05K2201/0959
摘要： A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.
摘要翻译： 具有优异的成形性的多层布线基板和具有抑制电容变化的电容器，其制造方法，在多层布线板上安装半导体芯片的半导体器件，以及安装该半导体器件的无线电电子器件。
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5.发明授权公开(公告)号：US09397381B2
公开(公告)日：2016-07-19
申请号：US13983796
申请日：2011-11-04
CPC分类号： H01P5/00 , H01P5/028 , H01P5/185 , H01P11/001 , H05K1/024 , H05K2201/0959 , Y10T29/49016
摘要： This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole.
摘要翻译： 该电磁耦合结构包括层压体，该层叠体与插入在内部导电层之间的内部电介质层，一对外部电介质层彼此相对，层叠体彼此相对，并且一对外部导电层彼此面对， 一对外部电介质层插入其间。 一对外导体层包括布线部分和设置在布线部分的前端的导电贴片部分，并且导电贴片部分在与布线部分的延伸方向垂直的方向上具有比布线部分长的部分。 在层叠体中，配置穿过内部电介质层和内部导电层的孔，一对外部导电层通过形成在孔内部的金属膜进行电磁耦合。
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6.发明申请公开(公告)号：US20130328646A1
公开(公告)日：2013-12-12
申请号：US13983796
申请日：2011-11-04
CPC分类号： H01P5/00 , H01P5/028 , H01P5/185 , H01P11/001 , H05K1/024 , H05K2201/0959 , Y10T29/49016
摘要： This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole.
摘要翻译： 该电磁耦合结构包括层压体，该层叠体与插入在内部导电层之间的内部电介质层，一对外部电介质层彼此相对，层叠体彼此相对，并且一对外部导电层彼此面对， 一对外部电介质层插入其间。 一对外导体层包括布线部分和设置在布线部分的前端的导电贴片部分，并且导电贴片部分在与布线部分的延伸方向垂直的方向上具有比布线部分长的部分。 在层叠体中，配置穿过内部电介质层和内部导电层的孔，一对外部导电层通过形成在孔内部的金属膜进行电磁耦合。
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7.发明申请公开(公告)号：US20130057365A1
公开(公告)日：2013-03-07
申请号：US13583271
申请日：2011-03-03
CPC分类号： H01P1/047 , H01P5/028 , H05K1/0239 , H05K1/024 , H05K1/0251 , H05K3/4602 , H05K2201/0187 , H05K2201/0959 , H05K2201/09854
摘要： An electromagnetic field coupling structure that is used in a microwave band frequency band, includes: a laminated body in which an inner dielectric layer 23 is sandwiched and laminated between a plurality of inner conductor layers 12 and 15 which become a plurality of ground layers; a pair of outer dielectric layers 21 and 25 facing each other with the laminated body interposed therebetween; and a pair of outer conductor layers 11 and 16 facing each other with the pair of outer dielectric layers 21 and 25 interposed therebetween. The laminated body is provided with a hole S which penetrates the inner dielectric layer 23 and the inner conductor layers 12 and 15 which become the plurality of ground layers, and the inner conductor layers 12 and 15 which become the plurality of ground layers are electrically connected via a tubular metal film 3 formed on an inner wall of the hole S, whereby the pair of outer conductor layers 11 and 16 are electromagnetically coupled.
摘要翻译： 在微波带频带中使用的电磁场耦合结构包括：层叠体，其中内部电介质层23夹在并层叠在成为多个接地层的多个内部导体层12和15之间; 一对外部电介质层21和25彼此面对，层叠体彼此相对; 一对外导体层11和16彼此面对，一对外部电介质层21和25插入其间。 层叠体设置有穿过形成多个接地层的内部电介质层23和内部导体层12和15的孔S，并且成为多个接地层的内部导体层12和15电连接 通过形成在孔S的内壁上的管状金属膜3，由此一对外导体层11和16被电磁耦合。
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公开(公告)号：US09078365B2
公开(公告)日：2015-07-07
申请号：US12298168
申请日：2007-04-26
申请人： Koji Morita , Shin Takanezawa , Kazunaga Sakai , Yuusuke Kondou
发明人： Koji Morita , Shin Takanezawa , Kazunaga Sakai , Yuusuke Kondou
CPC分类号： H05K1/0326 , C08G59/26 , C08J5/24 , H05K2201/068 , Y10T442/20
摘要： Disclosed is a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, and a prepreg, a laminate, and a wiring board formed using the resin composition. The resin composition comprises an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.
摘要翻译： 公开了一种树脂组合物，不仅有利于以低成本生产树脂组合物，而且不利于热膨胀，而且可以使用树脂组合物形成预浸料，层压体和布线板。 该树脂组合物包括具有芳环的绝缘树脂，其中具有芳环的绝缘树脂在层合体制备之后的台上的交联点之间的分子量为300至1,000，由弹性剪切模量 在Tg或更高的温度下测量的绝缘树脂。
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公开(公告)号：US20090200071A1
公开(公告)日：2009-08-13
申请号：US12298168
申请日：2007-04-26
申请人： Koji Morita , Shin Takanezawa , Kazunaga Sakai , Yuusuke Kondou
发明人： Koji Morita , Shin Takanezawa , Kazunaga Sakai , Yuusuke Kondou
CPC分类号： H05K1/0326 , C08G59/26 , C08J5/24 , H05K2201/068 , Y10T442/20
摘要： To provide a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, a prepreg, a laminate, and a wiring board.A resin composition for use in production of a laminate, the resin composition comprising an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.
摘要翻译： 为了提供一种树脂组合物，其不仅有利于低成本地制造树脂组合物，而且不利于热膨胀的可能性，预浸料，层压体和布线板。 一种用于生产层压体的树脂组合物，所述树脂组合物包括具有芳环的绝缘树脂，其中具有芳环的绝缘树脂在制备后的载物台上的交联点之间的分子量为300至1,000 由在Tg或更高的温度下测量的绝缘树脂的弹性剪切模量确定。
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公开(公告)号：US09431886B2
公开(公告)日：2016-08-30
申请号：US13588295
申请日：2012-08-17
申请人： Yoshifumi Shimura , Takuya Maeda , Yuusuke Kondou
发明人： Yoshifumi Shimura , Takuya Maeda , Yuusuke Kondou
CPC分类号： H02K41/02 , H02K1/18 , H02K1/2706 , H02K1/2786 , H02K5/02 , H02K15/03 , H02K15/12 , H02K41/031 , Y10T29/49009 , Y10T29/49012 , Y10T29/49075 , Y10T29/49078
摘要： A method for producing a magnet plate for a linear motor is provided. The magnet plate comprises a base plate and a plurality of magnets juxtaposed to one another on a surface of the base plate. The method comprises providing the plurality of magnets on a surface of the base plate at a certain interval, placing the base plate into a mold, supplying a resin material into the mold, so as to form a resin molding covering the plurality of magnets on the surface of the base plate by means of injection molding, and magnetizing the plurality of magnets.
摘要翻译： 提供一种用于制造用于线性电动机的磁体板的方法。 磁板包括基板和在基板的表面上彼此并置的多个磁体。 该方法包括以一定间隔在基板的表面上设置多个磁体，将基板放入模具中，将树脂材料供给到模具中，以形成覆盖多个磁体的树脂模制件 通过注射成型形成基板的表面，并对多个磁体进行磁化。
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