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1.发明授权公开(公告)号：US09397381B2
公开(公告)日：2016-07-19
申请号：US13983796
申请日：2011-11-04
CPC分类号： H01P5/00 , H01P5/028 , H01P5/185 , H01P11/001 , H05K1/024 , H05K2201/0959 , Y10T29/49016
摘要： This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole.
摘要翻译： 该电磁耦合结构包括层压体，该层叠体与插入在内部导电层之间的内部电介质层，一对外部电介质层彼此相对，层叠体彼此相对，并且一对外部导电层彼此面对， 一对外部电介质层插入其间。 一对外导体层包括布线部分和设置在布线部分的前端的导电贴片部分，并且导电贴片部分在与布线部分的延伸方向垂直的方向上具有比布线部分长的部分。 在层叠体中，配置穿过内部电介质层和内部导电层的孔，一对外部导电层通过形成在孔内部的金属膜进行电磁耦合。
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2.发明申请公开(公告)号：US20130328646A1
公开(公告)日：2013-12-12
申请号：US13983796
申请日：2011-11-04
CPC分类号： H01P5/00 , H01P5/028 , H01P5/185 , H01P11/001 , H05K1/024 , H05K2201/0959 , Y10T29/49016
摘要： This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole.
摘要翻译： 该电磁耦合结构包括层压体，该层叠体与插入在内部导电层之间的内部电介质层，一对外部电介质层彼此相对，层叠体彼此相对，并且一对外部导电层彼此面对， 一对外部电介质层插入其间。 一对外导体层包括布线部分和设置在布线部分的前端的导电贴片部分，并且导电贴片部分在与布线部分的延伸方向垂直的方向上具有比布线部分长的部分。 在层叠体中，配置穿过内部电介质层和内部导电层的孔，一对外部导电层通过形成在孔内部的金属膜进行电磁耦合。
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3.发明申请公开(公告)号：US20130057365A1
公开(公告)日：2013-03-07
申请号：US13583271
申请日：2011-03-03
CPC分类号： H01P1/047 , H01P5/028 , H05K1/0239 , H05K1/024 , H05K1/0251 , H05K3/4602 , H05K2201/0187 , H05K2201/0959 , H05K2201/09854
摘要： An electromagnetic field coupling structure that is used in a microwave band frequency band, includes: a laminated body in which an inner dielectric layer 23 is sandwiched and laminated between a plurality of inner conductor layers 12 and 15 which become a plurality of ground layers; a pair of outer dielectric layers 21 and 25 facing each other with the laminated body interposed therebetween; and a pair of outer conductor layers 11 and 16 facing each other with the pair of outer dielectric layers 21 and 25 interposed therebetween. The laminated body is provided with a hole S which penetrates the inner dielectric layer 23 and the inner conductor layers 12 and 15 which become the plurality of ground layers, and the inner conductor layers 12 and 15 which become the plurality of ground layers are electrically connected via a tubular metal film 3 formed on an inner wall of the hole S, whereby the pair of outer conductor layers 11 and 16 are electromagnetically coupled.
摘要翻译： 在微波带频带中使用的电磁场耦合结构包括：层叠体，其中内部电介质层23夹在并层叠在成为多个接地层的多个内部导体层12和15之间; 一对外部电介质层21和25彼此面对，层叠体彼此相对; 一对外导体层11和16彼此面对，一对外部电介质层21和25插入其间。 层叠体设置有穿过形成多个接地层的内部电介质层23和内部导体层12和15的孔S，并且成为多个接地层的内部导体层12和15电连接 通过形成在孔S的内壁上的管状金属膜3，由此一对外导体层11和16被电磁耦合。
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公开(公告)号：US07078106B2
公开(公告)日：2006-07-18
申请号：US10697116
申请日：2003-10-31
CPC分类号： C08L79/04 , C08L35/06 , C08L63/00 , H05K1/0353 , Y10T428/31855 , Y10T428/31938 , C08L2666/02 , C08L2666/20 , C08L35/00
摘要： A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1–C5 hydrocarbon group; R2 represents a halogen or a C1–C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number; and (2) a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.
摘要翻译： 一种热固性树脂组合物，其包含：（1）共聚物树脂，其包含（a）单体单元和（b）分别由以下通式（I）和（II）表示的单体单元：其中R 1， >表示氢，卤素或C 1 -C 5烃基; R 2表示卤素或C 1 -C 5烃基; x为0〜3; m和n分别为自然数; 和（2）每分子具有至少两个氰酸酯基团的氰酸酯树脂; 用于提供具有低介电常数和低介电损耗因数以及改善的耐热性的印刷线路板材料和用于电子设备的印刷线路板。
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5.发明授权Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same 有权半IPN复合材料的热固性树脂组合物，以及使用其的清漆，预浸料和金属包覆层压板公开(公告)号：US08501870B2
公开(公告)日：2013-08-06
申请号：US13615167
申请日：2012-09-13
IPC分类号： C08F8/00
CPC分类号： H05K1/0353 , C08J3/243 , C08J5/24 , C08K5/14 , C08L9/00 , C08L71/12 , C08L79/085 , C08L2205/04 , H05K2201/0158 , Y10T156/10 , Y10T428/24994 , Y10T428/31696 , Y10T428/31931 , C08L2666/14 , C08L2666/24 , C08L2666/04
摘要： Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译： 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。
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6.发明授权Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate 有权制备含有半IPN复合热固性树脂的树脂清漆的方法，并且使用该树脂清漆的方法，用于印刷线路板，预浸料和覆金属层压板的树脂清漆公开(公告)号：US08404769B2
公开(公告)日：2013-03-26
申请号：US12596165
申请日：2008-04-25
CPC分类号： H05K1/0353 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2274/00 , B32B2307/306 , B32B2307/3065 , B32B2307/726 , B32B2457/08 , C08J3/246 , C08J5/24 , C08J2387/00 , C08K3/013 , C08L9/00 , C08L15/00 , C08L21/00 , C08L47/00 , C08L71/00 , C08L71/12 , H05K1/024 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , Y10T428/31696 , C08L2666/14
摘要： Provided is a process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process includes the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer; and a resin varnish, a prepreg, and a metal-clad laminate provided using the same.
摘要翻译： 本发明提供了含有未固化的半IPN复合材料，无机填料和饱和热塑性弹性体的热固性树脂组合物的热固性树脂清漆的制造方法，其中，该方法包括以下步骤：（i）预反应（B ）丁二烯聚合物，其分子中含有其侧链中具有1,2-乙烯基的1,2-丁二烯单元的40％以上且未进行化学改性，（C）交联剂， 在（A）聚苯醚存在下，得到未固化的半IPN复合材料的聚苯醚改性丁二烯预聚物; （ii）将（D）无机填料和（E）饱和热塑性弹性体混合在一起得到混合物; 和（iii）将所得混合物和聚苯醚改性的丁二烯预聚物混合在一起; 以及使用该树脂清漆，预浸料坯和覆金属层压板。
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7.发明授权Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate 有权具有优异介电特性的树脂组合物，用于制备树脂组合物的方法，由其制备的清漆，其制备方法，用它们制备的预制物和覆金属层压板公开(公告)号：US07157506B2
公开(公告)日：2007-01-02
申请号：US10221171
申请日：2001-03-21
IPC分类号： C08K9/06
CPC分类号： B32B15/14 , B32B27/18 , B32B2311/12 , C08G73/0655 , C08K5/13 , C08K5/315 , C08K5/5419 , C08L79/04 , C08L83/04 , H05K1/0353 , Y10T428/31663 , C08L2666/02
摘要： A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiO3/2 and tetra-functional siloxane unit represented by SiO4/2, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).
摘要翻译： 一种树脂组合物，其包含分子中具有2个以上的氰基的氰酸酯化合物（A） 苯酚化合物（B）; 具有选自由式RSiO 3/2 2表示的三官能硅氧烷单元和由SiO
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8.发明申请Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using the same 有权用于印刷线路板的树脂组合物，以及使用其的消失的预浸料和覆金属层压板公开(公告)号：US20060167189A1
公开(公告)日：2006-07-27
申请号：US10529738
申请日：2003-09-29
CPC分类号： C08G73/0655 , B32B15/08 , B32B2363/00 , C08G59/4014 , C08L63/00 , C08L79/04 , H05K1/0353 , C08L2666/20
摘要： The present invention provides a resin composition for printed wiring board to be used for electronic devices in which operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal clad laminated board using the same. One invention of the present invention is a resin composition for printed wiring board containing a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a varnish, a prepreg and a metal clad laminated board using the same.
摘要翻译： 本发明提供一种用于工作频率超过1GHz的电子设备的印刷线路板用树脂组合物，以及使用该树脂组合物的清漆，预浸料坯和金属包覆层压板。 本发明的一个发明是含有分子中具有2个以上氰酸酯基的氰酸酯化合物和/或其预聚物的印刷线路板用树脂组合物，含有至少一种环氧树脂的环氧树脂，具有联苯 分子中的结构，以及清漆，预浸料和使用其的金属包覆层压板。
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9.发明申请PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE 有权生产含有SEMI-IPN复合热固性树脂的树脂的方法，并提供使用该树脂的方法，用于印刷的导线板，PREPREG和金属层压板的树脂变化公开(公告)号：US20100129676A1
公开(公告)日：2010-05-27
申请号：US12596165
申请日：2008-04-25
CPC分类号： H05K1/0353 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/10 , B32B2274/00 , B32B2307/306 , B32B2307/3065 , B32B2307/726 , B32B2457/08 , C08J3/246 , C08J5/24 , C08J2387/00 , C08K3/013 , C08L9/00 , C08L15/00 , C08L21/00 , C08L47/00 , C08L71/00 , C08L71/12 , H05K1/024 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , Y10T428/31696 , C08L2666/14
摘要： Provided is a process for producing a thermosetting resin varnish from which a printed circuit board can be produced wherein the printed circuit board has excellent dielectric properties in a high frequency band and can significantly reduce the transmission loss, and exhibits excellent heat resistance after moisture absorption and excellent thermal expansion properties and satisfies the metallic foil peeling strength.A process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process comprises the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer, a resin varnish, a prepreg, and a metal-clad laminate provided using the same.
摘要翻译： 本发明提供一种热固性树脂清漆的制造方法，由此能够制造印刷电路板，其中印刷电路板在高频带中具有优异的介电性能并且可以显着降低传输损耗，并且在吸湿后表现出优异的耐热性， 优异的热膨胀性能，并且满足金属箔剥离强度。 一种制备含有未固化的半IPN复合材料，无机填料和饱和热塑性弹性体的热固性树脂组合物的热固性树脂清漆的方法，其中该方法包括以下步骤：（i）预先反应（B） 在其分子中含有其侧链中具有1,2-乙烯基的1,2-丁二烯单元的40％以上且未经化学改性且（C）交联剂的丁二烯聚合物，在 存在（A）聚苯醚，得到未固化的半IPN复合材料的聚苯醚改性丁二烯预聚物; （ii）将（D）无机填料和（E）饱和热塑性弹性体混合在一起得到混合物; 和（iii）将得到的混合物和聚苯醚改性的丁二烯预聚物，树脂清漆，预浸渍体和使用其的覆金属层压板混合在一起。
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10.发明申请Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board 审中-公开导电箔与粘合层，导体包层层压板，印刷线路板和多层接线板公开(公告)号：US20090323300A1
公开(公告)日：2009-12-31
申请号：US12298337
申请日：2007-04-24
CPC分类号： H05K3/386 , B32B5/022 , B32B5/024 , B32B7/12 , B32B15/08 , B32B15/12 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/10 , B32B27/12 , B32B27/281 , B32B27/285 , B32B27/306 , B32B27/32 , B32B27/38 , B32B27/42 , B32B2255/06 , B32B2255/26 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/02 , B32B2262/101 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/714 , B32B2307/718 , B32B2457/08 , C09J163/00 , H05K3/427 , H05K3/4602 , H05K2201/0355 , Y10T428/24355 , Y10T428/254 , Y10T428/265 , Y10T428/2852 , Y10T428/31721 , Y10T442/2459
摘要： The invention provides an adhesive layer-attached conductive foil and a conductor-clad laminated sheet which allow transmission loss to be satisfactorily reduced especially in the high-frequency band, which exhibit excellent heat resistance, and which allow production of printed circuit boards that are adequately resistant to interlayer peeling. The adhesive layer-attached conductive foil of the invention is provided with a conductive foil and an adhesive layer formed on the conductive foil, wherein the adhesive layer is composed of a curable resin composition containing component (A): a polyfunctional epoxy resin, component (B): a polyfunctional phenol resin and component (C): a polyamideimide. The conductor-clad laminated sheet of the invention comprises an insulating layer, a conductive layer situated facing the insulating layer, and an adhesive layer sandwiched between the insulating layer and conductive layer, and the adhesive layer is composed of a cured resin composition containing components (A), (B) and (C).
摘要翻译： 本发明提供一种附着粘合剂层的导电箔和导体包覆层叠片，特别是在耐高温性优异的高频带中，能够令人满意地降低传输损失，并且能够适当地制造印刷电路板 耐层间剥离。 本发明的带粘合剂层的导电箔具有形成在导电箔上的导电箔和粘合层，其中粘合层由含有组分（A）的固化性树脂组合物组成：多官能环氧树脂，组分（ B）：多官能酚树脂和（C）成分：聚酰胺酰亚胺。 本发明的导体包覆层压片包括绝缘层，面向绝缘层的导电层和夹在绝缘层和导电层之间的粘合层，并且粘合层由含有组分的固化树脂组合物 A），（B）和（C）。
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