公开(公告)号：US20060063367A1

公开(公告)日：2006-03-23

申请号：US10521470

申请日：2003-05-30

申请人： Yasushi Shimada ,  Yoshitaka Hirata ,  Hiroyuki Kuriya ,  Kazuhisa Otsuka ,  Masanori Yamaguchi ,  Yuichi Shimayama ,  Ken Madarame ,  Etsuo Mizushima ,  Yuusuke Kondou ,  Kazumori Yamamoto

发明人： Yasushi Shimada ,  Yoshitaka Hirata ,  Hiroyuki Kuriya ,  Kazuhisa Otsuka ,  Masanori Yamaguchi ,  Yuichi Shimayama ,  Ken Madarame ,  Etsuo Mizushima ,  Yuusuke Kondou ,  Kazumori Yamamoto

IPC分类号： H01L21/4763

CPC分类号： H05K1/162 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/0959

摘要： A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.

摘要翻译： 具有优异的成形性的多层布线基板和具有抑制电容变化的电容器，其制造方法，在多层布线板上安装半导体芯片的半导体器件，以及安装该半导体器件的无线电电子器件。

公开(公告)号：US07592250B2

公开(公告)日：2009-09-22

申请号：US11653417

申请日：2007-01-16

申请人： Yasushi Shimada ,  Yoshitaka Hirata ,  Hiroyuki Kuriya ,  Kazuhisa Otsuka ,  Masanori Yamaguchi ,  Yuichi Shimayama ,  Ken Madarame ,  Etsuo Mizushima ,  Yuusuke Kondou ,  Kazunori Yamamoto

发明人： Yasushi Shimada ,  Yoshitaka Hirata ,  Hiroyuki Kuriya ,  Kazuhisa Otsuka ,  Masanori Yamaguchi ,  Yuichi Shimayama ,  Ken Madarame ,  Etsuo Mizushima ,  Yuusuke Kondou ,  Kazunori Yamamoto

IPC分类号： H01L21/4763

CPC分类号： H05K1/162 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/0959

摘要： A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device.

摘要翻译： 具有优异成型性的多层布线基板和具有抑制电容变化的电容器，其制造方法，在多层布线板上安装半导体芯片的半导体器件以及安装半导体器件的无线电子器件。

公开(公告)号：US07239013B2

公开(公告)日：2007-07-03

申请号：US10521470

申请日：2003-05-30

申请人： Yasushi Shimada ,  Yoshitaka Hirata ,  Hiroyuki Kuriya ,  Kazuhisa Otsuka ,  Masanori Yamaguchi ,  Yuichi Shimayama ,  Ken Madarame ,  Etsuo Mizushima ,  Yuusuke Kondou ,  Kazunori Yamamoto

发明人： Yasushi Shimada ,  Yoshitaka Hirata ,  Hiroyuki Kuriya ,  Kazuhisa Otsuka ,  Masanori Yamaguchi ,  Yuichi Shimayama ,  Ken Madarame ,  Etsuo Mizushima ,  Yuusuke Kondou ,  Kazunori Yamamoto

IPC分类号： H01L23/52

CPC分类号： H05K1/162 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/0959

摘要： A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.

摘要翻译： 具有优异的成形性的多层布线基板和具有抑制电容变化的电容器，其制造方法，在多层布线板上安装半导体芯片的半导体器件，以及安装该半导体器件的无线电电子器件。

公开(公告)号：US20070108588A1

公开(公告)日：2007-05-17

申请号：US11653417

申请日：2007-01-16

申请人： Yasushi Shimada ,  Yoshitaka Hirata ,  Hiroyuki Kuriya ,  Kazuhisa Otsuka ,  Masanori Yamaguchi ,  Yuichi Shimayama ,  Ken Madarame ,  Etsuo Mizushima ,  Yuusuke Kondou ,  Kazunori Yamamoto

发明人： Yasushi Shimada ,  Yoshitaka Hirata ,  Hiroyuki Kuriya ,  Kazuhisa Otsuka ,  Masanori Yamaguchi ,  Yuichi Shimayama ,  Ken Madarame ,  Etsuo Mizushima ,  Yuusuke Kondou ,  Kazunori Yamamoto

IPC分类号： H01L23/52

CPC分类号： H05K1/162 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/0959

摘要： A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device.

摘要翻译： 具有优异成型性的多层布线基板和具有抑制电容变化的电容器，其制造方法，在多层布线板上安装半导体芯片的半导体器件以及安装半导体器件的无线电子器件。

公开(公告)号：US06889431B2

公开(公告)日：2005-05-10

申请号：US10078448

申请日：2002-02-21

申请人： Hiroshi Okabe ,  Hirozi Yamada ,  Eriko Takeda ,  Kazunori Yamamoto ,  Hiroyuki Kuriya ,  Masanori Yamaguchi ,  Kazuhisa Otsuka ,  Yoshitaka Hirata ,  Yasushi Shimada

发明人： Hiroshi Okabe ,  Hirozi Yamada ,  Eriko Takeda ,  Kazunori Yamamoto ,  Hiroyuki Kuriya ,  Masanori Yamaguchi ,  Kazuhisa Otsuka ,  Yoshitaka Hirata ,  Yasushi Shimada

IPC分类号： H01G4/33 ,  H01L21/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/16 ,  H05K3/42 ,  H05K3/46 ,  H05K3/02

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/162 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2203/0338 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a manufacturing method of an electronic circuit device including a multi-layer circuit board incorporated with a thin film capacitor small in size and of high performance capable of attaining higher capacitance value with a thin dielectric film of high dielectric constant and with favorable film quality. A first electrode layer and a thin film dielectric layer are laminated continuously in this order in one identical to laminate each of the layers on a leveled substrate in one identical chamber and then the first electrode layer is fabricated a conductor pattern.

摘要翻译： 本发明提供一种电子电路器件的制造方法，该电子电路器件包括多层电路板，该多层电路板结合有小型和高性能的薄膜电容器，能够用高介电常数的薄电介质膜获得较高的电容值 电影质量。 将第一电极层和薄膜电介质层依次层叠在一个相同的层中，在一个相同的室中的层叠基板上层叠，然后将第一电极层制成导体图案。

公开(公告)号：US20070060672A1

公开(公告)日：2007-03-15

申请号：US10557890

申请日：2004-05-19

申请人： Yasushi Kumashiro ,  Yoshitaka Hirata ,  Shin Takanezawa ,  Yasushi Shimada ,  Kazuhisa Otsuka ,  Hiroyuki Kuriya ,  Kazunori Yamamoto

发明人： Yasushi Kumashiro ,  Yoshitaka Hirata ,  Shin Takanezawa ,  Yasushi Shimada ,  Kazuhisa Otsuka ,  Hiroyuki Kuriya ,  Kazunori Yamamoto

IPC分类号： B32B17/00 ,  B32B5/16 ,  C08K7/00 ,  C08K3/10 ,  C08K3/22

CPC分类号： H05K1/162 ,  H01B3/30 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/25 ,  Y10T428/269 ,  Y10T428/31678

摘要： There is provided an insulation material having a dielectric constant of 10 or more, comprising a filler having a dielectric constant of 50 or more and having two peaks in different particle size ranges in a particle size distribution and an insulating resin combined with each other; an insulation material having a dielectric constant of 10 or more comprising, as essential components, 1) at least one filler selected from the group consisting of barium titanate, strontium titanate, potassium titanate, magnesium titanate, lead titanate, titanium dioxide, barium zirconate, calcium zirconate and lead zirconate, 2) an insulating resin and 3) a dispersant containing a carboxylic group; or an insulation material comprising a filler having a dielectric constant of 50 or more, a dispersant for dispersing the filler and an insulating resin as essential components, wherein an extract of a cured product of the insulation material obtained by extraction with water at 120° C. for 20 hours using a pressure vessel has a pH of 6 or higher.

摘要翻译： 提供介电常数为10以上的绝缘材料，其包含介电常数为50以上的填料，并且在粒度分布中具有不同粒径范围的两个峰和彼此结合的绝缘树脂; 一种具有10或更高介电常数的绝缘材料，其包含作为必要组分的1）至少一种选自钛酸钡，钛酸锶，钛酸钾，钛酸镁，钛酸铅，二氧化钛，锆酸钡， 锆酸锆和锆酸铅，2）绝缘树脂和3）含有羧基的分散剂; 或包含介电常数为50以上的填料的绝缘材料，用于分散填料的分散剂和绝缘树脂作为必要成分，其中通过在120℃下用水萃取获得的绝缘材料的固化产物的提取物 使用压力容器20小时，pH为6以上。

公开(公告)号：US07700185B2

公开(公告)日：2010-04-20

申请号：US10557890

申请日：2004-05-19

申请人： Yasushi Kumashiro ,  Yoshitaka Hirata ,  Shin Takanezawa ,  Yasushi Shimada ,  Kazuhisa Otsuka ,  Hiroyuki Kuriya ,  Kazunori Yamamoto

发明人： Yasushi Kumashiro ,  Yoshitaka Hirata ,  Shin Takanezawa ,  Yasushi Shimada ,  Kazuhisa Otsuka ,  Hiroyuki Kuriya ,  Kazunori Yamamoto

IPC分类号： B32B5/16 ,  B32B15/04 ,  C08K7/00 ,  C08K3/22

CPC分类号： H05K1/162 ,  H01B3/30 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/25 ,  Y10T428/269 ,  Y10T428/31678

摘要： There is provided an insulation material having a dielectric constant of 10 or more, comprising a filler having a dielectric constant of 50 or more and having two peaks in different particle size ranges in a particle size distribution and an insulating resin combined with each other; an insulation material having a dielectric constant of 10 or more comprising, as essential components, 1) at least one filler selected from the group consisting of barium titanate, strontium titanate, potassium titanate, magnesium titanate, lead titanate, titanium dioxide, barium zirconate, calcium zirconate and lead zirconate, 2) an insulating resin and 3) a dispersant containing a carboxylic group; or an insulation material comprising a filler having a dielectric constant of 50 or more, a dispersant for dispersing the filler and an insulating resin as essential components, wherein an extract of a cured product of the insulation material obtained by extraction with water at 120° C. for 20 hours using a pressure vessel has a pH of 6 or higher.

摘要翻译： 提供介电常数为10以上的绝缘材料，其包含介电常数为50以上的填料，并且在粒度分布中具有不同粒径范围的两个峰和彼此结合的绝缘树脂; 一种具有10或更高介电常数的绝缘材料，其包含作为必要组分的1）至少一种选自钛酸钡，钛酸锶，钛酸钾，钛酸镁，钛酸铅，二氧化钛，锆酸钡， 锆酸锆和锆酸铅，2）绝缘树脂和3）含有羧基的分散剂; 或包含介电常数为50以上的填料的绝缘材料，用于分散填料的分散剂和绝缘树脂作为必要成分，其中通过在120℃下用水萃取获得的绝缘材料的固化产物的提取物 使用压力容器20小时，pH为6以上。

公开(公告)号：US06621170B2

公开(公告)日：2003-09-16

申请号：US09842441

申请日：2001-04-26

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US20090186955A1

公开(公告)日：2009-07-23

申请号：US12414420

申请日：2009-03-30

申请人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： C08L63/00 ,  C08J9/00

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the fillers followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

摘要翻译： 本发明提供了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还任选地包含（d）填料和/或（e） 固化促进剂; 一种制备粘合剂组合物的方法，包括：（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合; 包含形成为膜的上述粘合剂组合物的粘合膜; 一种用于安装半导体的基板，包括布线板和其上安装有芯片的侧面上的粘合膜; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。

公开(公告)号：US20070036971A1

公开(公告)日：2007-02-15

申请号：US11476725

申请日：2006-06-29

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： B32B27/38 ,  C09J163/00 ,  C08L63/00 ,  C09J7/02

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

摘要翻译： 本发明提供了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还任选地包含（d）填料和/或（e） 固化促进剂; 一种制备粘合剂组合物的方法，包括：（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合; 包含形成为膜的上述粘合剂组合物的粘合膜; 一种用于安装半导体的基板，包括布线板和其上安装有芯片的侧面上的粘合膜; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。