公开(公告)号：US5287000A

公开(公告)日：1994-02-15

申请号：US674969

申请日：1991-03-26

申请人： Yasushi Takahashi ,  Kazuyuki Miyazawa ,  Hidetoshi Iwai ,  Masaya Muranaka ,  Yoshitaka Kinoshita ,  Satoru Koshiba

发明人： Yasushi Takahashi ,  Kazuyuki Miyazawa ,  Hidetoshi Iwai ,  Masaya Muranaka ,  Yoshitaka Kinoshita ,  Satoru Koshiba

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L27/10 ,  H01L29/44 ,  H02G3/08

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49541 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/49179 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011

摘要： According to one aspect of the present invention, a semiconductor chip, which can be mounted in a zigzag in-line type package (ZIP) partially using a tabless lead frame, includes bonding pads arranged on the chip so that the chip can be applied also to other different types of packages. These different types of packages include a small out-line J-bent type package (SOJ) which uses a lead frame with tab, and a dual in-line type package (DIP) which uses a tabless lead frame. Further, a plurality of bonding pad pairs are provided amongst the bonding pads on the chip, each pad of such bonding pad pairs having the same function as the other pad associated therewith thereby duplicating a common function in different bonding pads on the semiconductor chip so as to make the semiconductor chip compatible with a variety of or different types of packages. In accordance with another aspect of the invention, a resin-encapsulated semiconductor device of the ZIP structure is provided in which a semiconductor pellet having a plurality of external terminals disposed on a device-forming surface along each side of the planar shape is encapsulated with a resin, wherein inner leads for signals connected electrically with external terminals, disposed opposing to the surface of the resin-encapsulated portion disposed with outer leads and disposed along the most remote side of the semiconductor pellet, are arranged so as to overlap the semiconductor pellet.

摘要翻译： 根据本发明的一个方面，可以使用无引线引线框架部分地以锯齿形的在线型封装（ZIP）安装的半导体芯片包括布置在芯片上的焊盘，使得芯片也可以被应用 到其他不同类型的包。 这些不同类型的封装包括使用带引脚的引线框架的小型外部J型弯曲型封装（SOJ）和使用无引脚引线框架的双列直插型封装（DIP）。 此外，在芯片上的接合焊盘之间设置多个接合焊盘对，这种接合焊盘对的每个焊盘具有与其相关联的另一个焊盘相同的功能，从而在半导体芯片上的不同接合焊盘中复制共同的功能，以便 使半导体芯片与各种或不同类型的封装兼容。 根据本发明的另一方面，提供了一种ZIP结构的树脂封装的半导体器件，其中具有设置在沿着平面形状的每一侧的器件形成表面上的多个外部端子的半导体芯片被封装在 树脂，其中与外部端子电连接的信号的内部引线设置成与设置有外部引线并沿着半导体芯片的最远侧设置的树脂封装部分的表面相对设置，以与半导体芯片重叠。