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公开(公告)号：US6163688A
公开(公告)日：2000-12-19
申请号：US315737
申请日：1999-05-20
CPC分类号： H03B5/1864
摘要： An oscillator comprises a dielectric resonator, a circuit board, and an adjustment mechanism for adjusting the relative positional relationship between the dielectric resonator and the circuit board; the dielectric resonator having a dielectric substrate, electrodes provided on two opposite faces of the dielectric substrate, and electrode removal portions provided at predetermined positions on the electrodes; and the adjustment mechanism comprising screws and springs for moving the dielectric resonator.
摘要翻译： 振荡器包括介质谐振器，电路板和用于调节介质谐振器和电路板之间的相对位置关系的调节机构; 所述介电谐振器具有电介质基板，设置在所述电介质基板的两个相对面上的电极以及设置在所述电极上的预定位置处的电极去除部; 并且该调节机构包括用于移动介质谐振器的螺钉和弹簧。
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公开(公告)号：US5872485A
公开(公告)日：1999-02-16
申请号：US901149
申请日：1997-07-28
IPC分类号： H05K1/16 , H01L21/822 , H01L27/04 , H01P3/16 , H01P5/02 , H01P5/08 , H01P5/12 , H03F3/60 , H03F3/68 , H01P5/00 , H03B5/12 , H04B1/26
CPC分类号： H01P5/087
摘要： An amplifying circuit is formed by a combination of a dielectric line waveguide and a semiconductor device. Two electrically conductive plates are provided substantially parallel to each other. Two dielectric strips are disposed between the two conductive plates, and a dielectric plate is further inserted between the dielectric strips. Ground conductors are formed on the dielectric plate. The ground conductors have an area which equals an amount required for blocking a RF signal propagating in the dielectric line waveguide. A slot line is formed between the ground conductors in a position intermediate opposed sides of the dielectric strips. Line-switching conductor patterns are provided at both sides of the ends of the slot line. A field-effect transistor is mounted on the slot line such that it bridges over the slot line. Accordingly, losses and distortion of an RF signal, which would occur in an input/output circuit, are suppressed, and the generation of parasitic coupling is eliminated. Further, the dielectric line waveguide is miniaturized free from an external circuit, and accordingly, the manufacturing cost is reduced as well.
摘要翻译： 放大电路由介质线波导和半导体器件的组合形成。 两个导电板基本上彼此平行地设置。 在两个导电板之间设置两个介质条，并且介质板进一步插入介质条之间。 接地导体形成在电介质板上。 接地导体具有等于阻挡在介质线波导中传播的RF信号所需的量的面积。 在介质条的相对两侧的位置上，在接地导体之间形成槽线。 线路切换导体图案设置在槽线的两端的两侧。 场效应晶体管安装在槽线上，使得其跨越槽线。 因此，抑制了在输入/输出电路中发生的RF信号的损耗和失真，消除了寄生耦合的产生。 此外，介电线路波导小型化而没有外部电路，因此也降低了制造成本。
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3.发明授权公开(公告)号：US06285269B1
公开(公告)日：2001-09-04
申请号：US08891143
申请日：1997-07-10
IPC分类号： H01P318
CPC分类号： H01L29/4175 , H01L23/66 , H01L29/41725 , H01L29/41775 , H01L29/42316 , H01L2223/6627 , H01L2924/0002 , H01L2924/19032 , H01L2924/3011 , H01L2924/00
摘要： A drain electrode and a source electrode are provided for an intrinsic device section on a GaAs substrate with a gate electrode placed therebetween. Almost all or substantial parts of the GaAs substrate is covered by an extending source electrode extending from the source electrode. A belt-shaped extending drain electrode is provided on the extending source electrode with a dielectric layer placed therebetween, and thereby an output-side microstripline is formed. A belt-shaped extending gate electrode is also provided on the extending source electrode with a dielectric layer placed therebetween, and thereby an input-side microstripline is formed.
摘要翻译： 为GaAs衬底上的本征器件部分提供漏电极和源电极，栅电极位于其间。 GaAs衬底的几乎全部或大部分被从源电极延伸的延伸源电极覆盖。 在延伸源电极上设置带状延伸的漏电极，其间放置介电层，从而形成输出侧微带线。 在延伸源电极上还设置有带状延伸栅电极，其间放置介电层，从而形成输入侧微带线。
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公开(公告)号：US06169301A
公开(公告)日：2001-01-02
申请号：US09030971
申请日：1998-02-26
IPC分类号： H01L2980
CPC分类号： H01L23/66 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A planar dielectric integrated circuit is provided such that energy conversion loss between a planar dielectric line and electronic components is small and that impedance matching between them can be easily obtained. By providing slots which oppose both main surfaces of a circuit substrate, two planar dielectric lines are constructed. A slot line, and a first line-conversion conductor pattern which is connected to the electromagnetic field of the slot line and a first planar dielectric line in order to perform line conversion, are provided at the end portion of the first planar dielectric line, including a slot. A coplanar line and a second line-conversion conductor which is made to project in a direction at right angles to a second planar dielectric line is provided at the end portion of the second planar dielectric line, including a slot. A semiconductor device is placed in such a manner as to be extended over the coplanar line and the slot line.
摘要翻译： 提供了平面介质集成电路，使得平面介质线和电子部件之间的能量转换损耗小，并且可以容易地获得它们之间的阻抗匹配。 通过提供与电路基板的两个主表面相对的槽，构成两个平面介质线。 在第一平面介质线的端部设置有槽线和连接到槽线的电磁场和第一平面介质线以进行线路转换的第一线路转换导体图案，包括 一个插槽。 在包括槽的第二平面介质线的端部设置有共面线和第二线转换导体，其在与第二平面介质线成直角的方向上突出。 半导体器件被放置成在共面线和缝线上延伸。
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5.发明授权Dielectric resonator, dielectric filter, dielectric duplexer, and oscillator 失效介质谐振器，介质滤波器，介质双工器和振荡器公开(公告)号：US06172572B2
公开(公告)日：2001-01-09
申请号：US09319823
申请日：1999-07-13
IPC分类号： H03B518
CPC分类号： H01P1/20318 , H01P1/2135 , H01P7/10 , H03B5/1864
摘要： A dielectric resonator allowing size reduction and easy modulation of coupling between adjacent resonating sections and electrodes is provided. A configuration is such that electric conductors 2a and 2b having openings on two main faces of a dielectric substrate 2 are arranged so as to oppose each other. Electrodes 5 and 6 are respectively formed on one main face each of supporting members 3a and 3b, the supporting members 3a and 3b are arranged via spacers 9 so as to oppose each other and so as to be apart from each other with a predetermined spacing in the thickness direction of the dielectric substrate 2 for the dielectric substrate 2, first and second conductor plates 4a and 4b are arranged apart with a predetermined spacing from the supporting members 3a and 3b, and the dielectric substrate positioning between the openings opposing each other is used as a resonating section.
摘要翻译： 提供了允许尺寸减小并且容易调制相邻谐振部分和电极之间的耦合的介质谐振器。 在电介质基板2的两个主面上具有开口的电导体2a，2b配置成彼此相对的结构。 电极5和6分别形成在每个支撑构件3a和3b的一个主面上，支撑构件3a和3b经由间隔件9布置成彼此相对并且以预定间隔彼此分开 电介质基板2的电介质基板2的厚度方向，第一导体板4a，第二导体板4b以与支撑部件3a，3b隔开规定的间隔配置，使用位于彼此相对的开口之间的电介质基板 作为共鸣部分。
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6.发明授权High-frequency module, transmitter-receiver, and method of adjusting characteristic of the high-frequency module 失效高频模块，发射机和接收机以及高频模块调整特性的方法公开(公告)号：US06911882B2
公开(公告)日：2005-06-28
申请号：US10465543
申请日：2003-06-20
申请人： Kazumasa Haruta , Takehisa Kajikawa
发明人： Kazumasa Haruta , Takehisa Kajikawa
摘要： A high-frequency module includes a dielectric plate in which a resonator is formed and a cover for covering the dielectric plate. A hole is provided in the cover. A laser beam for laser trimming passes through the hole. The area of opening and the depth of the hole are defined so that electromagnetic waves in a usable frequency band are cut off in the hole. An electrical characteristic is measured in a state where all components including the cover are assembled, and laser trimming is performed through the hole so as to obtain a desired characteristic.
摘要翻译： 高频模块包括其中形成谐振器的电介质板和用于覆盖电介质板的盖。 盖子上有一个孔。 用于激光修整的激光束穿过孔。 限定孔的开口面积和深度，使得在孔中切断可用频带的电磁波。 在组装包括盖的所有部件的状态下测量电特性，并且通过该孔执行激光修整以获得期望的特性。
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公开(公告)号：US07022554B2
公开(公告)日：2006-04-04
申请号：US10705823
申请日：2003-11-13
申请人： Kazuo Kasue , Takehisa Kajikawa , Satoru Hachinohe
发明人： Kazuo Kasue , Takehisa Kajikawa , Satoru Hachinohe
CPC分类号： H01L24/28 , H01L21/563 , H01L2224/16225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2224/0401
摘要： A method for fabricating a circuit module includes a step of filling the gap between a chip component and a substrate on which the chip component is mounted in a flip chip configuration with resin. The method uses simplified equipment and minimizes the undesired spread of resin. The resin is supplied between the sidewall of a dispenser needle and the sidewall of the chip component. Due to capillary action, a resin pool is formed and then the gap between the chip component and the substrate is spontaneously filled with the resin of the resin pool.
摘要翻译： 一种电路模块的制造方法，其特征在于，包括以芯片构成的芯片部件与芯片部件的基板之间的间隙以树脂填充的方式填充。 该方法使用简化的设备，并最大限度地减少不必要的树脂扩散。 树脂被供应在分配针的侧壁和芯片部件的侧壁之间。 由于毛细作用，形成树脂池，然后用树脂池的树脂自发填充芯片部件和基板之间的间隙。
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