摘要:
A method of manufacturing a grain-oriented steel sheet including hot-rolling a slab prepared using molten steel containing, by mass %, C of not more than about 0.08%, Si of about 2.0 to about 8.0% and Mn of about 0.005 to about 3.0%; optionally annealing the hot-rolled steel sheet; performing cold rolling once, or twice or more with intermediate annealing therebetween; performing primary recrystallization annealing in a low- or non-oxidizative atmosphere and adjusting the C content in the steel sheet after primary recrystallization annealing to be held in the range of about 0.005 to about 0.025 mass %; performing secondary recrystallization annealing; decarburization annealing; and, preferably, performing additional high-temperature continuous or batch annealing. A grain-oriented electrical steel sheet having a sufficiently high magnetic flux density and a low iron loss can be advantageously obtained even when it is manufactured without using an inhibitor.
摘要:
A grain oriented electromagnetic steel sheet is free from an undercoating mainly composed of forsterite (Mg2SiO4), excellent in processability and magnetic properties and useful to production cost, and has a composition containing, by % by mass, 2.0 to 8.0% of Si, wherein secondary recrystallized grains contains fine crystal grains having a grain diameter of 0.15 mm to 0.50 mm at a rate of 2 grains/cm2 or more. In the process of producing the steel sheet, inhibitors are not utilized, and the fine crystal grains are achieved by high purification and low temperature final annealing.
摘要翻译:晶粒取向电磁钢板不含主要由镁橄榄石(Mg 2 SiO 4)组成的底涂层,其加工性能和磁性能优异并且对生产成本有用,并且具有 以质量%计含有2.0〜8.0%的Si的组合物,其中二次再结晶晶粒以2晶粒/ cm 2的速度包含粒径为0.15mm至0.50mm的细晶粒, 或者更多。 在制造钢板的过程中,不利用抑制剂,通过高纯化和低温最终退火实现细晶粒。
摘要:
A grain oriented electromagnetic steel sheet is free from an undercoating mainly composed of forsterite (Mg2SiO4), excellent in processability and magnetic properties and useful to production cost, and has a composition containing, by % by mass, 2.0 to 8.0% of Si, wherein secondary recrystallized grains contains fine crystal grains having a grain diameter of 0.15 mm to 0.50 mm at a rate of 2 grains/cm2 or more. In the process of producing the steel sheet, inhibitors are not utilized, and the fine crystal grains are achieved by high purification and low temperature final annealing.
摘要:
A grain oriented electromagnetic steel sheet is free from an undercoating mainly composed of forsterite (Mg2SiO4), excellent in processability and magnetic properties and useful to production cost, and has a composition containing, by % by mass, 2.0 to 8.0% of Si, wherein secondary recrystallized grains contains fine crystal grains having a grain diameter of 0.15 mm to 0.50 mm at a rate of 2 grains/cm2 or more. In the process of producing the steel sheet, inhibitors are not utilized, and the fine crystal grains are achieved by high purification and low temperature final annealing.
摘要翻译:晶粒取向电磁钢板不含主要由镁橄榄石(Mg 2 SiO 4)组成的底涂层,其加工性能和磁性能优异并且对生产成本有用,并且具有 以质量%计含有2.0〜8.0%的Si的组合物,其中二次再结晶晶粒以2晶粒/ cm 2的速度包含粒径为0.15mm至0.50mm的细晶粒, 或者更多。 在制造钢板的过程中,不利用抑制剂,通过高纯化和低温最终退火实现细晶粒。
摘要:
Electrical steel sheets having superior magnetic properties, anti-noise properties, and workability, are ideal for use a compact iron core material in electric apparatuses, such as compact transformers, motors, and electric generators. A totally new electrical steel sheet and a manufacturing method therefor are proposed, in which the electrical steel sheet is not only most advantageous in magnetic properties but also advantageous from economic point of view. That is, the electrical steel sheet of the present invention is composed of from about 2.0 to 8.0 wt % Si, from about 0.005 to 3.0 wt % Mn, from about 0.0010 to 0.020 wt % Al, balance essentially iron. The magnetic flux density B50(L) in a rolling direction and the magnetic flux density B50(C) in the direction perpendicular thereto are 1.70 T or more, and the B50(L)/B50(C) is 1.005 to 1.100. In addition, the secondary recrystallized grains inclined by 20′ or less with respect to the {100} orientation are present in the steel sheet at an areal ratio of 50 to 80%, and secondary recrystallized grains inclined by 20° or less with respect to the {110} orientation are present in the steel sheet at an areal ratio of 6 to 20%.
摘要:
According to one embodiment, a method of manufacturing a semiconductor memory device is provided. In the method, a laminated body in which a first silicon layer, a first sacrificial layer, a second silicon layer, and a second sacrificial layer are laminated in turn is formed. A first insulating film is formed on the laminated body. A trench is formed in the laminated body and the first insulating film. A third sacrificial layer is formed into the trench. The third sacrificial layer is etched by wet etching to be retreated from a top surface of the third sacrificial layer, thereby etching end faces of the first sacrificial layer and the second sacrificial layer.
摘要:
According to one embodiment, a nonvolatile semiconductor memory device comprises a first conductive layer, a second conductive layer, a first inter-electrode insulating film, and a third conductive layer stacked above the first conductive layer, a memory film, a semiconductor layer, an insulating member, and a silicide layer. The memory film and the semiconductor layer is formed on the inner surface of through hole provided in the second conductive layer, the first inter-electrode insulating film, and the third conductive layer. The insulating member is buried in a slit dividing the second conductive layer, the first inter-electrode insulating film, and the third conductive layer. The silicide layer is formed on surfaces of the second conductive layer and the third conductive layer in the slit. The distance between the second conductive layer and the third conductive layer along the inner surface of the slit is longer than that of along the stacking direction.
摘要:
A transformation processing system input data including a data record area for storing target date and a transformation processing identification information record area for storing transformation processing identification information about transformation processing executed upon the target data. The transformation processing system includes: a reverse transformation information recording unit which records a target data pointer indicating the data record area in transformed data, a transformation processing identification information pointer indicating the transformation processing identification information record area, and reverse transformation processing identification information about reverse transformation processing; a target data transformation unit which transforms the target data and records it in the data record area; and a transformation processing identification information recording unit which adds the transformation processing identification information about the transformation processing executed by the target data transformation unit to the transformation processing identification information record area in the input data.
摘要:
The invention provides an organic material-immobilizing structure employing new immobilization means, characterized in that at least a part of the surface of the substrate is comprised of one or more members containing silicon oxide, the organic material is bound to the surface of the substrate through a binding domain bound to the organic material and containing an amino acid sequence capable of binding to silicon oxide, selected from the group consisting of amino acid sequences of SEQ ID NOS: 1 and 2: Val-Ser-Pro-Met-Arg-Ser-Ala-Thr-Thr-His-Thr-Val; and Ile-Pro-Met-His-Val-His-His-Lys-His-Pro-His-Val, and derivatives thereof.
摘要翻译:本发明提供一种使用新的固定装置的有机材料固定结构,其特征在于,基底表面的至少一部分由含有氧化硅的一种或多种构件组成,有机材料通过 与有机材料结合并含有能够结合氧化硅的氨基酸序列的结合结构域,其选自SEQ ID NO:1和2的氨基酸序列:Val-Ser-Pro-Met-Arg-Ser -Ala-Thr-Thr-His-Thr-Val; 和Ile-Pro-Met-His-Val-His-His-Lys-His-Pro-His-Val及其衍生物。
摘要:
A metalized film capacitor capable of exhibiting stable performance in a wide temperature range is provided. The metalized film capacitor has an elliptical cross sectional shape having a major axis of 60 mm or above. In this capacitor, offset for shifting in the width direction of a pair of metalized film is set to 1.2 mm or above. Since the bonding state between metal vapor-deposited electrode and metal sprayed electrode formed on the end surface is stable, a stable contact between metal sprayed electrode and dielectric film is maintained, thereby preferably maintaining tan σand exhibiting excellent performance even if the use temperature range is increased and the thermal stress is increased.