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公开(公告)号：US07316065B2
公开(公告)日：2008-01-08
申请号：US11364330
申请日：2006-03-01
IPC分类号： G01R3/00
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , G01R1/07342 , H01R13/2414 , H01R43/007 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.
摘要翻译： 公开了一排形成多个弹性探针的方法。 首先，提供基板，然后在基板上形成成形层，以便平行地提供两个平坦表面。 在基板上和形成层上形成光致抗蚀剂层。 然后，对光致抗蚀剂层进行图案化以形成与两个平坦表面之间的界面交叉的多个槽，其中在槽中形成有多个弹性探针。 在一个实施例中，界面是成形层的边缘斜率，使得每个弹性探针具有至少一个弹性弯曲部分。 在芯片探测期间，由于过驱动导致的弹性探针的移动方向垂直于接合焊盘的布置方向，使得弹性探头适用于探测具有高密度和细间距接合焊盘的芯片。
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公开(公告)号：US07477065B2
公开(公告)日：2009-01-13
申请号：US11605443
申请日：2006-11-29
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , G01R1/07342 , H01R13/2414 , H01R43/007 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.
摘要翻译： 公开了一排形成多个弹性探针的方法。 首先，提供基板，然后在基板上形成成形层，以便平行地提供两个平坦表面。 在基板上和形成层上形成光致抗蚀剂层。 然后，对光致抗蚀剂层进行图案化以形成与两个平坦表面之间的界面交叉的多个槽，其中在槽中形成有多个弹性探针。 在一个实施例中，界面是成形层的边缘斜率，使得每个弹性探针具有至少一个弹性弯曲部分。 在芯片探测期间，由于过驱动导致的弹性探针的移动方向垂直于接合焊盘的布置方向，使得弹性探头适用于探测具有高密度和细间距接合焊盘的芯片。
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公开(公告)号：US20070069750A1
公开(公告)日：2007-03-29
申请号：US11605443
申请日：2006-11-29
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , G01R1/07342 , H01R13/2414 , H01R43/007 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.
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公开(公告)号：US20070069749A1
公开(公告)日：2007-03-29
申请号：US11605442
申请日：2006-11-29
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , G01R1/07342 , H01R13/2414 , H01R43/007 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.
摘要翻译： 公开了一排形成多个弹性探针的方法。 首先，提供基板，然后在基板上形成成形层，以便平行地提供两个平坦表面。 在基板上和形成层上形成光致抗蚀剂层。 然后，对光致抗蚀剂层进行图案化以形成与两个平坦表面之间的界面交叉的多个槽，其中在槽中形成有多个弹性探针。 在一个实施例中，界面是成形层的边缘斜率，使得每个弹性探针具有至少一个弹性弯曲部分。 在芯片探测期间，由于过驱动导致的弹性探针的移动方向垂直于接合焊盘的布置方向，使得弹性探头适用于探测具有高密度和细间距接合焊盘的芯片。
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公开(公告)号：US20060267607A1
公开(公告)日：2006-11-30
申请号：US11364330
申请日：2006-03-01
IPC分类号： G01R31/02
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , G01R1/07342 , H01R13/2414 , H01R43/007 , Y10T29/49147 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222
摘要： A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.
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公开(公告)号：US20060042834A1
公开(公告)日：2006-03-02
申请号：US11188860
申请日：2005-07-26
申请人： Yi-Chang Lee , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
发明人： Yi-Chang Lee , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
CPC分类号： H01L24/72 , G01R1/06727 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H01R13/2407 , H05K1/0216 , H05K3/4092 , H01L2924/00
摘要： An electronic device comprises a substrate and at least a warped spring connector. The substrate has a signal bonding pad and a ground plane. The warped spring connector is disposed on the substrate and is connected to the bonding pad. The warped spring connector includes at least a ground lead electrically connected to the ground plane, a dielectric layer on the ground lead, and a transmitting lead on the dielectric layer. The transmitting lead is bonded to the bonding pad. The ground lead is isolated from and close to the transmitting lead to solve cross-talk and noise problem. Furthermore, the coefficient of thermal expansion of the transmitting lead is different from that of the dielectric layer or the ground lead such that the warped spring connector has a suspending end suspending away from the substrate.
摘要翻译： 电子设备包括基板和至少一个翘曲的弹簧连接器。 衬底具有信号焊盘和接地层。 翘曲弹簧连接器设置在基板上并连接到接合垫。 翘曲弹簧连接器至少包括电连接到接地平面的接地引线，接地引线上的电介质层和介电层上的传输引线。 传输引线接合到焊盘。 接地线与发射线隔离并靠近发射线，以解决串扰和噪声问题。 此外，传输引线的热膨胀系数与电介质层或接地引线的热膨胀系数不同，使得翘曲弹簧连接器具有悬挂远离基板的悬挂端。
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公开(公告)号：US07696443B2
公开(公告)日：2010-04-13
申请号：US11188860
申请日：2005-07-26
申请人： Yi-Chang Lee , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
发明人： Yi-Chang Lee , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
CPC分类号： H01L24/72 , G01R1/06727 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H01R13/2407 , H05K1/0216 , H05K3/4092 , H01L2924/00
摘要： An electronic device comprises a substrate and at least a warped spring connector. The substrate has a signal bonding pad and a ground plane. The warped spring connector is disposed on the substrate and is connected to the bonding pad. The warped spring connector includes at least a ground lead electrically connected to the ground plane, a dielectric layer on the ground lead, and a transmitting lead on the dielectric layer. The transmitting lead is bonded to the bonding pad. The ground lead is isolated from and close to the transmitting lead to solve cross-talk and noise problem. Furthermore, the coefficient of thermal expansion of the transmitting lead is different from that of the dielectric layer or the ground lead such that the warped spring connector has a suspending end suspending away from the substrate.
摘要翻译： 电子设备包括基板和至少一个翘曲的弹簧连接器。 衬底具有信号焊盘和接地层。 翘曲弹簧连接器设置在基板上并连接到接合垫。 翘曲弹簧连接器至少包括电连接到接地平面的接地引线，接地引线上的电介质层和介电层上的传输引线。 传输引线接合到焊盘。 接地线与发射线隔离并靠近发射线，以解决串扰和噪声问题。 此外，传输引线的热膨胀系数与电介质层或接地引线的热膨胀系数不同，使得翘曲弹簧连接器具有悬挂远离基板的悬挂端。
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公开(公告)号：US20070152689A1
公开(公告)日：2007-07-05
申请号：US11322408
申请日：2006-01-03
申请人： Yi-Chang Lee , An-Hong Liu , Hsiang-Ming Huang , Yao-Jung Lee , Yeong-Her Wang
发明人： Yi-Chang Lee , An-Hong Liu , Hsiang-Ming Huang , Yao-Jung Lee , Yeong-Her Wang
IPC分类号： G01R31/02
CPC分类号： G01R1/07378
摘要： A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circuit board and the probe head where the interposer includes a substrate and a plurality of pogo pins. The substrate has a first surface, a second surface, and a plurality of through holes penetrating from the first surface to the second surface. The pogo pins are secured in the through holes of the substrate. Each of the pogo pins has a first contact point, a second contact point, and a spring therebetween, whereby the first contact points are elastically extruded from the first surface to contact the first contact pad, and the second contact points are elastically extruded from the second surface to contact the second contact pad, so as to overcome the poor electrical connections between the printed circuit board and the probe head through the interposer due to poor coplanarity of the first contact pads of the printed circuit board.
摘要翻译： 模块化探针卡包括印刷电路板，插入件和探针头，其中印刷电路板具有多个第一接触焊盘，探头具有多个第二接触焊盘。 插入器设置在印刷电路板和探针头之间，其中插入器包括基板和多个弹簧销。 基板具有从第一表面到第二表面的第一表面，第二表面和多个通孔。 弹簧销固定在基板的通孔中。 每个弹簧销具有第一接触点，第二接触点和它们之间的弹簧，由此第一接触点从第一表面弹性挤出以接触第一接触垫，并且第二接触点从 第二表面接触第二接触焊盘，以便克服印刷电路板和探针头之间通过插入器的不良电连接，因为印刷电路板的第一接触焊盘的共面性差。
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公开(公告)号：US20070085554A1
公开(公告)日：2007-04-19
申请号：US11249464
申请日：2005-10-14
申请人： Hsiang-Ming Huang , An-Hong Liu , Yi-Chang Lee , Yao-Jung Lee , Yeong-Her Wang
发明人： Hsiang-Ming Huang , An-Hong Liu , Yi-Chang Lee , Yao-Jung Lee , Yeong-Her Wang
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R1/07364
摘要： A replaceable modular probe head is composed of a plurality of in-parallel probing modules. Each probing module has a plurality of in-series probing regions. In the present embodiment, each probing module has mechanical connection parts on its both ends to attach to a printed circuit board (PCB) to be a multi-DUT probe card. Therefore, the probing module can be replaced individually when probes are damaged or worn without replacing the whole probe head to reduce the fabrication cost of a multi-DUT probe head.
摘要翻译： 可替换的模块化探头由多个并联探测模块组成。 每个探测模块具有多个串联探测区域。 在本实施例中，每个探测模块的两端具有机械连接部分，以连接到作为多DUT探针卡的印刷电路板（PCB）。 因此，当探头损坏或磨损时，可以单独更换探测模块，而无需更换整个探头，从而降低多DUT探头的制造成本。
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公开(公告)号：US07372286B2
公开(公告)日：2008-05-13
申请号：US11322408
申请日：2006-01-03
申请人： Yi-Chang Lee , An-Hong Liu , Hsiang-Ming Huang , Yao-Jung Lee , Yeong-Her Wang
发明人： Yi-Chang Lee , An-Hong Liu , Hsiang-Ming Huang , Yao-Jung Lee , Yeong-Her Wang
IPC分类号： G01R1/073
CPC分类号： G01R1/07378
摘要： A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circuit board and the probe head where the interposer includes a substrate and a plurality of pogo pins. The substrate has a first surface, a second surface, and a plurality of through holes penetrating from the first surface to the second surface. The pogo pins are secured in the through holes of the substrate. Each of the pogo pins has a first contact point, a second contact point, and a spring therebetween, whereby the first contact points are elastically extruded from the first surface to contact the first contact pad, and the second contact points are elastically extruded from the second surface to contact the second contact pad, so as to overcome the poor electrical connections between the printed circuit board and the probe head through the interposer due to poor coplanarity of the first contact pads of the printed circuit board.
摘要翻译： 模块化探针卡包括印刷电路板，插入件和探针头，其中印刷电路板具有多个第一接触焊盘，探头具有多个第二接触焊盘。 插入器设置在印刷电路板和探针头之间，其中插入器包括基板和多个弹簧销。 基板具有从第一表面到第二表面的第一表面，第二表面和多个通孔。 弹簧销固定在基板的通孔中。 每个弹簧销具有第一接触点，第二接触点和它们之间的弹簧，由此第一接触点从第一表面弹性挤出以接触第一接触垫，并且第二接触点从 第二表面接触第二接触焊盘，以便克服印刷电路板和探针头之间通过插入器的不良电连接，因为印刷电路板的第一接触焊盘的共面性差。
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