Formulation for silicon-doped ink used to prevent chip etching
    1.
    发明授权
    Formulation for silicon-doped ink used to prevent chip etching 有权
    用于防止芯片蚀刻的掺硅油墨的配方

    公开(公告)号:US08956450B2

    公开(公告)日:2015-02-17

    申请号:US13468470

    申请日:2012-07-25

    IPC分类号: C09D11/02

    CPC分类号: C09D11/38

    摘要: An ink composition for used in an inkjet printer is provided. The ink composition includes a carrier medium, a colorant, and a silicon doping agent. The silicon doping agent may include silicic acid, silicon dioxide, or silicates. This silicon-doped ink reduces and prevents the etching of the silicon based components of the printhead. Silicon-doped inks protect the printhead from damage, thus improving printhead reliability and increasing printhead service life.

    摘要翻译: 提供一种用于喷墨打印机的油墨组合物。 油墨组合物包括载体介质,着色剂和掺硅剂。 硅掺杂剂可以包括硅酸,二氧化硅或硅酸盐。 该硅掺杂油墨减少并防止打印头的硅基部件的蚀刻。 掺硅油墨可保护打印头免受损坏,从而提高打印头的可靠性并提高打印头的使用寿命。

    Micro-fluidic pump
    3.
    发明授权
    Micro-fluidic pump 有权
    微流体泵

    公开(公告)号:US08891949B2

    公开(公告)日:2014-11-18

    申请号:US13556495

    申请日:2012-07-24

    IPC分类号: F24H1/08 F04B19/24

    CPC分类号: F04B19/24 F04B19/006 F28F3/12

    摘要: A micro-fluidic pump comprises one or more channels having an array of resistive heaters, an inlet, outlet and a substrate as a heat sink and a means of cooling the device. The pump is operated with a fire-to-fire delay and/or a cycle-to-cycle delay to control the pumping rate and minimize heating of liquid inside the pump during its operation.

    摘要翻译: 微流体泵包括一个或多个通道,其具有电阻加热器阵列,入口,出口和作为散热器的基板以及冷却装置的装置。 泵的运行时间为火焰延迟和/或周期到周期的延迟,以控制泵送速率并最大限度地减少泵在运行过程中液体的加热。

    Piezoelectric inkjet printheads and methods for monolithically forming the same
    4.
    发明授权
    Piezoelectric inkjet printheads and methods for monolithically forming the same 有权
    压电喷墨打印头及其整体成型方法

    公开(公告)号:US08608291B2

    公开(公告)日:2013-12-17

    申请号:US13191558

    申请日:2011-07-27

    申请人: Yimin Guan Eunki Hong

    发明人: Yimin Guan Eunki Hong

    IPC分类号: B41J2/045

    摘要: A piezoelectric inkjet printhead is monolithically fabricated on a substrate. The printhead includes a plurality of cavities formed into the substrate, piezoelectric actuators disposed over the top of the cavities, a fluidic structure and an ink supply channel. The piezoelectric actuators are formed over the cavities using a sacrificial material which fills the cavities and is removed after the actuators are formed. The fluidic structure defines pressurizing chambers and channels connected to the ink supply channel. The fluidic structure has a plurality of nozzle holes formed on the top surface. The cavities are connected to either a venting channel formed from the backside of the substrate or a venting chamber formed inside the fluidic structures.

    摘要翻译: 压电喷墨打印头被单片地制造在基板上。 打印头包括形成在基板中的多个空腔,设置在空腔顶部的压电致动器,流体结构和供墨通道。 使用填充空腔的牺牲材料在空腔上形成压电致动器,并且在致动器形成之后被移除。 流体结构限定了连接到供墨通道的加压室和通道。 流体结构具有形成在顶表面上的多个喷嘴孔。 空腔连接到从基板的背面形成的排气通道或形成在流体结构内部的排气室。

    MICRO-FLUIDIC PUMP
    5.
    发明申请
    MICRO-FLUIDIC PUMP 有权
    微流体泵

    公开(公告)号:US20130202278A1

    公开(公告)日:2013-08-08

    申请号:US13556495

    申请日:2012-07-24

    IPC分类号: F24H1/10

    CPC分类号: F04B19/24 F04B19/006 F28F3/12

    摘要: A micro-fluidic pump comprises one or more channels having an array of resistive heaters, an inlet, outlet and a substrate as a heat sink and a means of cooling the device. The pump is operated with a fire-to-fire delay and/or a cycle-to-cycle delay to control the pumping rate and minimize heating of liquid inside the pump during its operation.

    摘要翻译: 微流体泵包括一个或多个通道,其具有电阻加热器阵列,入口,出口和作为散热器的基板以及冷却装置的装置。 泵的运行时间为火焰延迟和/或周期到周期的延迟,以控制泵送速率并最大限度地减少泵在运行过程中液体的加热。

    On-chip fluid recirculation pump for micro-fluid applications
    6.
    发明授权
    On-chip fluid recirculation pump for micro-fluid applications 有权
    用于微流体应用的片上流体再循环泵

    公开(公告)号:US08814293B2

    公开(公告)日:2014-08-26

    申请号:US13349933

    申请日:2012-01-13

    IPC分类号: B41J29/38

    摘要: A micro-fluid ejection head has fluid ejection elements formed as thin film layers on a substrate. Fluid flow features on the substrate channel fluid from a fluid source to ejection chambers surrounding the ejection elements. A pump on the substrate circulates the fluid from the source to the ejection chambers and back again to the source. The flow refreshes the fluid in the chambers to minimize deleterious effects of evaporation. A controller coordinates the flow rate of the pump and other variables to optimize system productivity. Other embodiments contemplate pump locations, pump types, pump enumeration, and fluidic features, such as pathways, diffusers, chokes and dimensions, to name a few.

    摘要翻译: 微流体喷射头具有在基板上形成为薄膜层的流体喷射元件。 衬底上的流体流动特征使流体从流体源流向围绕喷射元件的喷射室。 衬底上的泵将流体从源循环到喷射室,并再次返回到源。 流动更新室内的流体,以最大限度地减少蒸发的有害影响。 控制器协调泵的流量和其他变量,以优化系统生产率。 其他实施例考虑泵位置,泵类型,泵计数和流体特征,例如路径,扩散器,扼流圈和尺寸,仅举几个例子。

    ON-CHIP FLUID RECIRCULATION PUMP FOR MICRO-FLUID APPLICATIONS
    7.
    发明申请
    ON-CHIP FLUID RECIRCULATION PUMP FOR MICRO-FLUID APPLICATIONS 有权
    用于微流体应用的片上流体回流泵

    公开(公告)号:US20130182022A1

    公开(公告)日:2013-07-18

    申请号:US13349933

    申请日:2012-01-13

    IPC分类号: B41J29/38 B41J2/18

    摘要: A micro-fluid ejection head has fluid ejection elements formed as thin film layers on a substrate. Fluid flow features on the substrate channel fluid from a fluid source to ejection chambers surrounding the ejection elements. A pump on the substrate circulates the fluid from the source to the ejection chambers and back again to the source. The flow refreshes the fluid in the chambers to minimize deleterious effects of evaporation. A controller coordinates the flow rate of the pump and other variables to optimize system productivity. Other embodiments contemplate pump locations, pump types, pump enumeration, and fluidic features, such as pathways, diffusers, chokes and dimensions, to name a few.

    摘要翻译: 微流体喷射头具有在基板上形成为薄膜层的流体喷射元件。 衬底上的流体流动特征使流体从流体源流向围绕喷射元件的喷射室。 衬底上的泵将流体从源循环到喷射室,并再次返回到源。 流动更新室内的流体,以最大限度地减少蒸发的有害影响。 控制器协调泵的流量和其他变量,以优化系统生产率。 其他实施例考虑泵位置,泵类型,泵计数和流体特征,例如路径,扩散器,扼流圈和尺寸,仅举几个例子。

    Capping layer for insulator in micro-fluid ejection heads
    8.
    发明授权
    Capping layer for insulator in micro-fluid ejection heads 有权
    微流体喷射头中的绝缘体封盖层

    公开(公告)号:US08376523B2

    公开(公告)日:2013-02-19

    申请号:US12764357

    申请日:2010-04-21

    IPC分类号: B41J2/05

    摘要: A micro-fluid ejection head has a resistor layer defining a heater element. An insulative layer underlies the heater element and a capping layer on the insulative layer substantially prevents ion mobility between the resistor and insulative layers. Resistance stability of the heater has been shown improved as has adhesion of the heater to the insulator. Representative layers include insulation of methyl silesquioxane (MSQ) in a thickness of about 5000 Angstroms or more, while the cap is a silicon nitride in a thickness of about 2000 Angstroms or less. Other capping layers include silicon carbide, silicon oxide or dielectrics. The resistor layer typifies TaAlN in a thickness of about 350 Angstroms, including overlying anode and cathode conductors that define the heater. Coating layers are also disclosed as are thermal barrier layers.

    摘要翻译: 微流体喷射头具有限定加热器元件的电阻层。 绝缘层位于加热器元件的下面,并且绝缘层上的覆盖层基本上防止电阻器和绝缘层之间的离子迁移。 由于加热器对绝缘体的粘附性,加热器的电阻稳定性得到改善。 代表性层包括厚度约5000埃或更大的甲基倍半硅氧烷(MSQ)的绝缘,而盖是约2000埃或更小的厚度的氮化硅。 其它覆盖层包括碳化硅,氧化硅或电介质。 电阻层以大约350埃的厚度代表TaAlN,包括覆盖加热器的阳极和阴极导体。 还公开了涂层是热障层。

    Method for making a thin film resistor
    9.
    发明授权
    Method for making a thin film resistor 有权
    制造薄膜电阻的方法

    公开(公告)号:US07918015B2

    公开(公告)日:2011-04-05

    申请号:US12336767

    申请日:2008-12-17

    IPC分类号: H01C17/00

    摘要: A process for making a fluid ejector head for a micro-fluid ejection device. In one embodiment, the process comprises depositing a thin film resistive layer on a substrate to provide a plurality of thin film heaters. The thin film resistive layer comprises a tantalum-aluminum-nitride material consisting essentially of AlN, TaN, and TaAl alloys, and containing from about 30 to about 70 atomic % tantalum, from about 10 to about 40 atomic % aluminum and from about 5 to about 30 atomic % nitrogen.

    摘要翻译: 一种用于制造微流体喷射装置的流体喷射头的方法。 在一个实施例中,该方法包括在衬底上沉积薄膜电阻层以提供多个薄膜加热器。 薄膜电阻层包括主要由AlN,TaN和TaAl合金组成的钽 - 氮化铝材料,并且含有约30至约70原子%的钽,约10至约40原子%的铝和约5至约 约30原子%的氮。