摘要:
A circuit for driving an organic light emitting diode display includes a display panel that displays an image by using organic light emitting diodes disposed at intersection areas of a plurality of gate lines and a plurality of data lines; a threshold voltage detection control unit that supplies a precharge voltage by sequentially turning on transistors for threshold voltage detection, which are connected among the data lines and the organic light emitting diodes on the display panel, in units of horizontal lines, and enables threshold voltages to be detected; and a source driver that detects threshold voltages of all organic light emitting diodes arranged on a corresponding horizontal line, and repeats an operation, as necessary, for sampling/holding the detected threshold voltages through M sample/hold circuits, converting the sampled/held threshold voltages into digital signals, and storing the digital signals in a memory.
摘要:
Disclosed is a power supply line in which a voltage drop generated in a resistance component of a metal line which delivers a power voltage is minimized so that the level of the power supply voltage delivered to a semiconductor chip becomes constant in the entire area of the semiconductor chip. The semiconductor chip includes: at least two power supply pads to which a power voltage applied from an external unit of the semiconductor chip is supplied; power supply main metal lines connected to each of the power supply pads; power supply branch metal lines extended from each of the power supply main metal lines to deliver a power voltage to a circuit in the semiconductor chip; and at least an electrostatic discharge (ESD) improvement dummy pad, wherein the ESD improvement dummy pad is electrically connected to the corresponding power supply main metal line and the corresponding power supply branch metal line to minimize a voltage drop.
摘要:
Disclosed is a power supply line in which a voltage drop generated in a resistance component of a metal line which delivers a power voltage is minimized so that the level of the power supply voltage delivered to a semiconductor chip becomes constant in the entire area of the semiconductor chip. The semiconductor chip includes: at least two power supply pads to which a power voltage applied from an external unit of the semiconductor chip is supplied; power supply main metal lines connected to each of the power supply pads; power supply branch metal lines extended from each of the power supply main metal lines to deliver a power voltage to a circuit in the semiconductor chip; and at least an electrostatic discharge (ESD) improvement dummy pad, wherein the ESD improvement dummy pad is electrically connected to the corresponding power supply main metal line and the corresponding power supply branch metal line to minimize a voltage drop.
摘要:
Provided are a method of arranging gamma buffers capable of decreasing a Kelvin of a source driver included in a flat panel display and minimizing a temperature deviation between source drivers, and the flat panel display applying the method. The method of arranging a plurality of gamma buffers which are arranged in one or more source drivers to output corresponding gamma voltages, includes a step of calculating power consumptions of the gamma buffers, wherein the method further comprises one or more steps of: changing tab points of the gamma buffers by using the calculated power consumptions of the gamma buffers; and changing positions of the gamma buffers by using the calculated power consumptions of the gamma buffers.
摘要:
Disclosed is a liquid crystal display panel driving circuit for driving a liquid crystal display panel with a resolution of N bits. N-bit digital data including upper X bits and lower Y bits is inputted. The liquid crystal display panel driving circuit includes a resistor string unit according to areas, a DAC converter switching unit according to areas, and an interpolation amplifier. The resistor string unit outputs analog reference voltages at different ratios according to three areas. The DAC converter switching unit receives the N-bit digital data, selects (Y+1) analog voltages from the analog reference voltages based on the upper X bits, outputs the (Y+1) analog voltages, and outputs the (Y+1) analog voltages of different combinations based on the lower Y bits. The interpolation amplifier receives the (Y+1) analog voltages and generates an interpolated output voltage by setting weights for the (Y+1) analog voltages by using multi-factors.
摘要:
Disclosed are an offset compensation gamma buffer and a gray scale voltage generation circuit using the same. The offset compensation gamma buffer includes: a buffer which outputs an input voltage input to a positive or negative input terminal as an output voltage; and a switching unit which selectively connects the input voltage and the output voltage of the buffer to the positive and negative input terminals in response to a control signal. The output voltage of the offset compensation gamma buffer is supplied to the input of a gray scale voltage generation circuit of a source driver for driving a liquid crystal panel. The offset of the offset compensation gamma buffer is compensated using an inversion timing of the control signal. The output voltage of the offset compensation gamma buffer is supplied as a reference voltage of the voltage divider unit for generating the gray scale voltages, and the offset of the gray scale voltages is also compensated.
摘要:
Provided is a pad layout structure of a semiconductor chip capable of preventing lead-broken problems when packaging the semiconductor chip with a high aspect ratio in a tape carrier package (TCP). In the pad layout structure of the semiconductor chip, a plurality pads are arranged along upper, lower, left and right sides of the semiconductor chip with a high aspect ratio, and a longitudinal width of pads arranged at the left and right sides and a transverse width of pads arranged at both edges of the upper and lower sides are greater than a transverse width of pads arranged at centers of the upper and lower sides.
摘要:
Provided is a pad layout structure of a semiconductor chip capable of preventing lead-broken problems when packaging the semiconductor chip with a high aspect ratio in a tape carrier package (TCP). In the pad layout structure of the semiconductor chip, a plurality pads are arranged along upper, lower, left and right sides of the semiconductor chip with a high aspect ratio, and a longitudinal width of pads arranged at the left and right sides and a transverse width of pads arranged at both edges of the upper and lower sides are greater than a transverse width of pads arranged at centers of the upper and lower sides.
摘要:
Provided are a semiconductor integrated circuit having a heat release pattern in a chip so as to release heat generated inside the chip and a system board having a heat release unit used to release heat generated inside the semiconductor integrated circuit. The semiconductor integrated circuit includes: one or more output pads directly connected to an output terminal having a heat release pattern; a power supply pad supplying power; and one or more dummy pads connected to a metal line for supplying power or an internal output terminal of an internal function block, wherein the heat release pattern includes a plurality of unit contacts at the output terminal or a plurality of strip contacts having an area of about or larger than the sum of two or more of the unit contacts.
摘要:
A method of removing offsets between channels of a liquid crystal panel is provided. The method includes: alternately arranging first type output buffers and second type output buffers for driving the pixels in units of at least two rows of the pixels; and arranging the first type output buffers and the second type output buffers in units of at least two columns of the pixels so that the output buffers with types opposite to those of previous two columns are arranged. The second type output buffers are embodied by switching connections among the differential transistors and connections among the load transistors in the first type output buffers.