摘要:
A twin-ONO-type SONOS memory includes a semiconductor substrate having a source region, a drain region and a channel region between the source and drain regions, twin silicon oxide-silicon nitride-silicon oxide (ONO) dielectric layers, a first ONO dielectric layer being on the channel region and the source region and as second ONO dielectric layer being on the channel region and the drain region, and a control gate on the channel region, between the twin ONO dielectric layers, the twin ONO dielectric layers extending along at least lower lateral sides of the control gate adjacent the channel region, wherein the twin ONO dielectric layers extend towards the source and drain regions further than the control gate.
摘要:
A twin-ONO-type SONOS memory includes a semiconductor substrate having a source region, a drain region and a channel region between the source and drain regions, twin silicon oxide-silicon nitride-silicon oxide (ONO) dielectric layers, a first ONO dielectric layer being on the channel region and the source region and as second ONO dielectric layer being on the channel region and the drain region, and a control gate on the channel region, between the twin ONO dielectric layers, the twin ONO dielectric layers extending along at least lower lateral sides of the control gate adjacent the channel region, wherein the twin ONO dielectric layers extend towards the source and drain regions further than the control gate.
摘要:
A method of manufacturing a twin-ONO-type SONOS memory using a reverse self-alignment process, wherein an ONO dielectric layer is formed under a gate and physically separated into two portions using a reverse self-alignment process irrespective of photolithographic limits. To facilitate the reverse self-alignment, a buffer layer and spacers for defining the width of the ONO dielectric layer are adopted. Thus, the dispersion of trapped charges during programming and erasing can be appropriately adjusted, thus improving the characteristics of the SONOS. The present invention prevents the redistribution of charges in time after the programming and erasing operations.
摘要:
Provided is a trench isolation for a semiconductor device. The device includes an insulating layer formed on the inner surface of a trench and includes at least an N-containing CVD oxide layer, and a nitride liner formed on the insulating layer.
摘要:
Non-volatile memory devices according to embodiments of the invention can include, for example, a semiconductor substrate, a source region, a drain region, an impurity region, a vertical structure, a control gate insulating layer, a control gate electrode, a gate insulating layer, and a gate electrode. The impurity region is in a floating state between the source region and the drain region. The vertical structure is formed of a tunneling layer, a charge trapping layer, and a blocking layer sequentially stacked between the source region and the impurity region. The control gate insulating layer is between the source region and the impurity region and adjacent to the vertical structure. The control gate electrode is formed on the vertical structure and the control gate insulating layer. The gate insulating layer is between the impurity region and the drain region. The gate electrode is formed on the gate insulating layer.
摘要:
A non-volatile memory integrated circuit device and a method fabricating the same are disclosed. The non-volatile memory integrated circuit device includes a semiconductor substrate, word and select lines, and a floating junction region, a bit line junction region and a common source region. The semiconductor substrate has a plurality of substantially rectangular field regions, and the short and long sides of each substantially rectangular field region are parallel to the row and column directions of a matrix, respectively. The word lines and select lines extend parallel to the row direction on the semiconductor substrate, the word lines crossing a plurality of substantially rectangular field regions disposed in the row direction, and the select lines partially overlapping substantially rectangular field regions arranged in the row direction of the matrix, such that the parts of the long sides of the substantially field regions and the short sides of the substantially rectangular field regions are located below the select lines. The floating junction region is formed within the semiconductor substrate between the word lines and the select lines, the bit line junction region is formed opposite the floating junction region, and the common source region is formed opposite the floating junction region.
摘要:
A non-volatile memory integrated circuit device and a method fabricating the same are disclosed. The non-volatile memory integrated circuit device includes a semiconductor substrate, word and select lines, and a floating junction region, a bit line junction region and a common source region. The semiconductor substrate has a plurality of substantially rectangular field regions, and the short and long sides of each substantially rectangular field region are parallel to the row and column directions of a matrix, respectively. The word lines and select lines extend parallel to the row direction on the semiconductor substrate, the word lines crossing a plurality of substantially rectangular field regions disposed in the row direction, and the select lines partially overlapping substantially rectangular field regions arranged in the row direction of the matrix, such that the parts of the long sides of the substantially field regions and the short sides of the substantially rectangular field regions are located below the select lines. The floating junction region is formed within the semiconductor substrate between the word lines and the select lines, the bit line junction region is formed opposite the floating junction region, and the common source region is formed opposite the floating junction region.
摘要:
A non-volatile memory device includes a memory cell array with a plurality of unit memory cells arranged in a matrix pattern, each of the unit memory cells having first and second non-volatile memory transistors sharing a common source, and a selection transistor connected between the common source and one of the first and second non-volatile memory transistors, a first word line coupled to control gates of the first non-volatile memory transistors arranged in a column direction of the memory cell array, a second word line coupled to control gates of the second non-volatile memory transistors arranged in the column direction of the memory cell array, a selection line coupled to gates of the selected transistors arranged in the column direction of the memory cell array, and at least one bit line coupled to drains of the first and second non-volatile memory transistors.
摘要:
Example embodiments relate to a non-volatile memory device and a method of forming the same. A non-volatile memory device according to example embodiments may include a conductive pattern provided on the semiconductor substrate. A tunnel insulator may be provided on the conductive pattern. A memory gate structure may be provided on the semiconductor substrate so as to cover a first end of the conductive pattern. The first end may include an upward tapering, first protrusion. A select gate structure may be provided on the semiconductor substrate so as to cover the second end of the conductive pattern. The second end may include an upward tapering, second protrusion. The coverage of the first protrusion by the memory gate structure may be greater than the coverage of the second protrusion by the select gate structure.
摘要:
Example embodiments are directed to a mask ROM, a mask ROM embedded EEPROM and a method of fabricating the same. The mask ROM may include a select gate pattern and a memory gate pattern disposed between a source region and a drain region at each of the on-cell and the off-cell. The on-cell may include a cell diffusion region between the select gate pattern and the memory gate pattern.