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27 条记录 (耗时 0.022 秒)

    Conductive ink
    4.
    发明授权
    Conductive ink 失效
    导电油墨

    公开(公告)号：US5407473A

    公开(公告)日：1995-04-18

    申请号：US174807

    申请日：1993-12-29

    申请人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    发明人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    IPC分类号： H01B1/14 ,  H01L23/498 ,  H05K1/09 ,  C09D11/02

    CPC分类号： H01B1/14 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092

    摘要： Conductive ink has an inorganic compound comprising 70.0-95.0 wt. % of CuO which is conductive and 5.0-30.0 wt. % of inorganic binder mixed with each other, and solvent and organic binder in which the inorganic compound is dispersed. The inorganic binder consists of lead borosilicate crystalline glass or aluminum borosilicate crystalline glass soften and crystallizes at 850.degree.-950.degree. C. The diameter of CuO powder of the inorganic compound is 100-7.0 .mu.m. The diameter of the lead borosilicate crystalline glass powder or the aluminum borosilicate crystalline glass powder of the inorganic compound is 1.0-5.0 .mu.m. The organic binder consists of ethyl cellulose or copolymer of polyisobytylmethacrylate and poly.alpha.-methylstyrene. The conductive ink contains the organic binder at 0.5-2.0 wt. %.

    摘要翻译： 导电油墨具有70.0-95.0重量％的无机化合物。 导电的CuO％和5.0-30.0wt。 相互混合的无机粘合剂的％，以及其中分散无机化合物的溶剂和有机粘合剂。 无机粘合剂由硼硅酸铅晶体玻璃或硼硅酸铝晶体玻璃软化并在850-950℃下结晶。无机化合物的CuO粉末的直径为100-7.0μm。 硼硅酸铅晶体玻璃粉末或无机化合物的硼硅酸铝结晶玻璃粉末的直径为1.0-5.0μm。 有机粘合剂由乙基纤维素或聚甲基丙烯酸异丁酯和聚α-甲基苯乙烯的共聚物组成。 导电油墨含有0.5-2.0重量％的有机粘合剂。 ％。

    Method of making multi-layered ceramic substrates
    7.
    发明授权
    Method of making multi-layered ceramic substrates 失效
    制作多层陶瓷基板的方法

    公开(公告)号：US5662755A

    公开(公告)日：1997-09-02

    申请号：US526312

    申请日：1995-09-11

    申请人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    发明人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    IPC分类号： H01L21/48 ,  H01L23/15 ,  H05K3/24 ,  B32B31/26 ,  B32B31/12

    CPC分类号： H05K3/248 ,  H01L21/4857 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2203/308 ,  H05K3/4629 ,  Y10T29/49163

    摘要： A method of making a multi-layered ceramic substrate which includes the steps of laminating a desired number of green sheets each being made of glass ceramics containing at least an organic binder and a solvent and each having a pattern of electrodes formed thereon by the use of an electroconductive paste, to thereby provide a green sheet laminate, The electrodes on opposite surfaces or an entire surface layer of the green sheet laminate are subsequently printed with a paste comprising an inorganic component added with at least an organic binder containing a Zn composition. On each surface of the laminate printed with the paste of the Zn composition, a green sheet made of an inorganic composition incapable of being sintered at a temperature of crystallization of the glass ceramics is then laminated thereby providing a laminate plate which is subsequently fired. After the firing, both of the inorganic composition incapable of firing sintered and the Zn composition are removed from the opposite surfaces of the laminate. The paste of the Zn composition may contains a main component selected from the group consisting of Zn, ZnO, Zn(OH).sub.2, ZnAl.sub.2 O.sub.4, and ZnCO.sub.3.

    摘要翻译： 一种制造多层陶瓷基板的方法，其包括以下步骤：将所需数量的生坯片材层叠，所述生坯片材由至少含有有机粘合剂和溶剂的玻璃陶瓷制成，并且各自具有通过使用 导电糊，从而提供生片层压体。随后用包含添加至少含有Zn组合物的有机粘合剂的无机组分的糊料印刷相对表面上的电极或生片层压体的整个表面层。 在印有Zn组合物的糊料的层压板的每个表面上，将由玻璃陶瓷的结晶温度下不能烧结的无机组合物制成的生片层叠，从而提供随后烧制的层压板。 烧成后，从层叠体的相对面除去无法烧成的无机组合物和Zn组合物。 Zn组合物的糊剂可以含有选自Zn，ZnO，Zn（OH）2，ZnAl 2 O 4和ZnCO 3的主要成分。

    Conductor composition and method of manufacturing a multilayered ceramic body using the composition
    10.
    发明授权
    Conductor composition and method of manufacturing a multilayered ceramic body using the composition 失效
    导体组合物和使用该组合物制造多层陶瓷体的方法

    公开(公告)号：US4906405A

    公开(公告)日：1990-03-06

    申请号：US194967

    申请日：1988-05-17

    申请人： Seiichi Nakatani ,  Tsutomu Nishimura ,  Satoru Yuhaku ,  Minehiro Itagaki

    发明人： Seiichi Nakatani ,  Tsutomu Nishimura ,  Satoru Yuhaku ,  Minehiro Itagaki

    IPC分类号： H01B1/08 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46

    CPC分类号： H05K3/4611 ,  C03C3/072 ,  C03C8/14 ,  H01B1/08 ,  H05K1/092 ,  H05K3/4629 ,  H05K1/0306

    摘要： Disclosed are a CuO conductor paste which is effective for making a multilayered ceramic body, the conductor material of which is made of copper, and a method of manufacturing a multilayered ceramic body using the conductor paste. The conductor paste is made of CuO as the main component with an addition of at least one of PbO-based glass, or any of Bi.sub.2 O.sub.3 -based glass, CuO-based glass and CuAl.sub.2 O.sub.4 as the additive. The multilayered ceramic body is manufactured by a method comprising a forming process for making a multilayered body from the conductor paste and dielectric material, a binder removing process by heat treating the multilayered body, thus obtained, in air, a reduction process for reducing CuO to copper in a mixed gas atmosphere of hydrogen and nitrogen, and a sintering process for sintering the multilayered body thus reduced in a nitrogen gas atmosphere.

    摘要翻译： 公开了一种CuO导体糊，其制造多层陶瓷体，其导体材料由铜制成，以及使用该导体膏制造多层陶瓷体的方法。 导体糊以CuO为主要成分，添加PbO系玻璃，Bi2O3系玻璃，CuO系玻璃，CuAl 2 O 4等中的至少一种作为添加剂。 多层陶瓷体通过包括从导体糊和电介质材料制造多层体的成形方法的方法制造，通过在空气中热处理由此获得的多层体的粘合剂去除工艺，将CuO还原为 在氢气和氮气的混合气体气氛中的铜，以及在氮气气氛中烧结多层体的烧结方法。