摘要:
The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.
摘要:
The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.
摘要:
A pallet-storing block of an electronic component-mounting apparatus stores a plurality of pallets each carrying thereon a tray containing a large number of electronic components. A desired pallet selected from the pallets is moved along a transfer path, in a manner such that the desired pallet is advanced to be introduced into a pickup area which extends to cover almost all of the transfer path or withdrawn from the pickup area into the pallet-storing block. Desired electronic components are sequentially picked up from the desired pallet introduced into the pickup area and mounted on a circuit board. The desired pallet is moved to a desired position within the pickup area.
摘要:
The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
摘要:
The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
摘要:
The invention provides a mounting apparatus with a beam which is free from adverse effect on its performance due to thermal distortion and misalignment of its guide rails, on which the beam for mounting operation travels. One end of the beam is rotatably supported on a slide, which moves along the guide rails. Another end of the beam is also rotatably supported on another slider through a moving element. The slider and the mounting element move along the guide rail. The moving element moves in a direction perpendicular to the guide rails.
摘要:
A pallet-storing block of an electronic component-mounting apparatus stores a plurality of pallets each carrying thereon a tray containing a large number of electronic components. A desired pallet selected from the pallets is moved along a transfer path, in a manner such that the desired pallet is advanced to be introduced into a pickup area which extends to cover almost all of the transfer path or withdrawn from the pickup area into the pallet-storing block. Desired electronic components are sequentially picked up from the desired pallet introduced into the pickup area and mounted on a circuit board. The desired pallet is moved to a desired position within the pickup area.
摘要:
The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
摘要:
An electronic component mounting apparatus has a pair of guides, a beam traveling along the guides and a mounting head placed on the beam. A first linear motor moves the beam along the guides, and a second linear motor moves the mounting head along the beam. A thermal insulating portion placed between the beam and the guides thermally insulates the two components from each other. Thermal conduction portions are placed on the fixed elements of the first and second linear motors. This configuration assures an accurate operation of the mounting apparatus by eliminating thermal deformations of their components.
摘要:
The invention prevents reduction of a pickup rate even when a storage tape in use and a new storage tape are connected to each other with a connection tape. A component recognition camera takes an image of an electronic component held by a suction nozzle, and a recognition processing device performs recognition processing. When a positional shifting amount calculated by CPU based on the recognition processing result is more than α, a board recognition camera takes an image of a storage portion of a storage tape storing a next electronic component to be picked up. When a positional shifting amount of the storage portion calculated based on the recognition processing result is more than β, the CPU enables seam passage processing. Based on the image taking of the storage portion by the board recognition camera and the recognition processing by the recognition processing device which are performed each time the storage tape is fed N times, the CPU controls correction of a pickup position.