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    Electronic component inserting apparatus
    1.
    发明授权
    Electronic component inserting apparatus 失效
    电子部件插入装置

    公开(公告)号：US4370804A

    公开(公告)日：1983-02-01

    申请号：US183839

    申请日：1980-09-03

    申请人： Yoshihiko Misawa ,  Akira Kabeshita ,  Kazuhiro Mori ,  Hiroshi Nakagawa ,  Shigeru Araki, deceased

    发明人： Yoshihiko Misawa ,  Akira Kabeshita ,  Kazuhiro Mori ,  Hiroshi Nakagawa ,  Shigeru Araki, deceased

    IPC分类号： B23P19/04 ,  B23P21/00 ,  H05K13/04 ,  B23P23/00

    CPC分类号： H05K13/0495 ,  B23P19/04 ,  H05K13/0417 ,  Y10T29/53183

    摘要： An apparatus for automatically mounting electronic components on printed circuit boards has an insertion head which is adapted to rotate on an engaging shaft within a rotary bearing and be guided in the extent of rotation by means of a steel ball. Only the engaging shaft rotates and the position from which the components are supplied to the insertion head is stationary, the space needed for the inserting apparatus can be kept small. The bearing can be changed or the position of the bearing changed to change the insertion angle of the component relative to the printed circuit board, thus making possible various arrangements of the components on the circuit board.

    摘要翻译： 用于将电子部件自动安装在印刷电路板上的装置具有插入头，其适于在旋转轴承内的接合轴上旋转，并且通过钢球在旋转的程度中被引导。 只有接合轴旋转并且将部件供应到插入头的位置是静止的，所以插入装置所需的空间可以保持较小。 可以改变轴承或改变轴承的位置以改变部件相对于印刷电路板的插入角度，从而使电路板上部件的各种布置成为可能。

    Electronic component supply apparatus
    2.
    发明授权
    Electronic component supply apparatus 失效
    电子元件供应装置

    公开(公告)号：US4440355A

    公开(公告)日：1984-04-03

    申请号：US351466

    申请日：1982-02-23

    申请人： Kazuhiro Mori ,  Yoshihiko Misawa ,  Eiji Itemadani ,  Akira Kabeshita

    发明人： Kazuhiro Mori ,  Yoshihiko Misawa ,  Eiji Itemadani ,  Akira Kabeshita

    IPC分类号： H05K13/02 ,  H05K13/00 ,  H05K13/04 ,  B65H75/02

    CPC分类号： H05K13/0417 ,  Y10S156/922 ,  Y10S242/918 ,  Y10T156/11 ,  Y10T156/19

    摘要： The disclosure is directed to an electronic component supply apparatus for use in an electronic component mounting arrangement, which employs an electronic component carrier tape. The apparatus is arranged to separate a covering tape from a tape base of the carrier tape only at a position directly below a vacuum chuck for picking up the component, while the covering tape is separated from the tape base so as to be wound up at a winding speed lower than an intermittent feeding speed of the carrier tape by a predetermined pitch.

    摘要翻译： 本公开涉及一种用于电子部件安装装置的电子部件供应装置，其使用电子部件载带。 该设备被布置成仅将覆盖带与载带的带基分开，仅在真空卡盘的正下方的位置处，用于拾取部件，同时覆盖带与带基部分离，以便在一个 卷绕速度低于载带的间歇进给速度预定间距。

    IC component mounting method and apparatus
    6.
    发明授权
    IC component mounting method and apparatus 失效
    IC元件安装方法和装置

    公开(公告)号：US5667129A

    公开(公告)日：1997-09-16

    申请号：US432579

    申请日：1995-05-01

    申请人： Koichi Morita ,  Yoshihiko Misawa ,  Keiji Saeki ,  Akira Kabeshita ,  Nobuhisa Watanabe

    发明人： Koichi Morita ,  Yoshihiko Misawa ,  Keiji Saeki ,  Akira Kabeshita ,  Nobuhisa Watanabe

    IPC分类号： B23P21/00 ,  H01L21/60 ,  H05K13/04 ,  H05K13/08 ,  H01L21/58

    CPC分类号： H05K13/0413 ,  H05K13/046 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204

    摘要： An IC component mounting method includes sucking each of different types of IC components at a supply position to which the IC component having an electrode-provided face thereof to be bonded to a circuit board, recognizing an image of the IC component to detect a sucking position at which a sucking nozzle does not interfere with an electrode of the IC component, detecting a height of the sucking position, positioning the sucking nozzle at the sucking position while the position of the sucking nozzle in a vertical direction is controlled, sucking the IC component by a mounting head, recognizing a position of the IC component sucked by the mounting head, and recognizing a reference position of the circuit board or an IC component-mounting position thereof, and positioning the IC component at the IC component-mounting position of the circuit board and then mounting the IC component on the circuit board.

    摘要翻译： 一种IC部件安装方法，其特征在于，将具有电极配置面的IC部件的电源位置与不同类型的IC部件吸附在电路基板上，识别IC部件的图像以检测吸引位置 吸入喷嘴不与IC部件的电极干涉，检测吸引位置的高度，并且在吸嘴的位置在垂直方向上被控制的同时将吸嘴定位在吸引位置，吸引IC部件 通过安装头识别由安装头吸入的IC部件的位置，并且识别电路板的基准位置或其IC部件安装位置，并将IC部件定位在IC部件安装位置 电路板，然后将IC组件安装在电路板上。

    Component mounting apparatus
    7.
    发明授权
    Component mounting apparatus 失效
    组件安装设备

    公开(公告)号：US4473247A

    公开(公告)日：1984-09-25

    申请号：US348404

    申请日：1982-02-12

    申请人： Eiji Itemadani ,  Kazuhiro Mori ,  Sohei Tanaka ,  Akira Kabeshita

    发明人： Eiji Itemadani ,  Kazuhiro Mori ,  Sohei Tanaka ,  Akira Kabeshita

    IPC分类号： B25J15/00 ,  B25J15/06 ,  B65G47/91 ,  H01L21/68 ,  H01L21/683

    CPC分类号： B65G47/91 ,  H01L21/68 ,  H01L21/6838 ,  Y10T29/53178

    摘要： A component mounting apparatus comprises a hollow rod communicated to a source of vacuum and having a suction head for picking up generally rectangular articles one at a time by the effect of a suction force. At least one pair of finger members for clamping and releasing the articles which has been sucked onto the suction head are provided for effecting a correction in position of the article relative to the suction head. Each of the finger members has an inclined end face which is adapted to support the article sucked onto the suction head from below in engagement with the opposite lower edges of the article.

    摘要翻译： 部件安装装置包括连接到真空源的中空杆，并且具有用于通过抽吸力一次拾取大致矩形物品的吸头。 提供用于夹紧和释放被吸入到吸头上的物品的至少一对指状构件用于在物品相对于抽吸头的位置进行校正。 每个指状构件具有倾斜的端面，该倾斜端面适于从下方支撑吸附到吸头上的物品，以与物品的相对的下边缘接合。

    Assembly devices for electronic circuit components
    8.
    发明授权
    Assembly devices for electronic circuit components 失效
    电子电路组件装配装置

    公开(公告)号：US4411362A

    公开(公告)日：1983-10-25

    申请号：US405105

    申请日：1982-08-04

    申请人： Eiji Itemadani ,  Kazuhiro Mori ,  Sohei Tanaka ,  Akira Kabeshita

    发明人： Eiji Itemadani ,  Kazuhiro Mori ,  Sohei Tanaka ,  Akira Kabeshita

    IPC分类号： B65D85/86 ,  B65D73/02 ,  H05K13/02 ,  B65D75/22

    CPC分类号： B65D73/02

    摘要： Assembly devices for electrical circuit components which is suitable for feeding electronic chip components, especially for semiconductor IC chips with comb-like leads, to e.g. chip mounting apparatuses, comprises two belt-like long objects made of tape-like and belt-shaped long materials, and is capable of feeding the electronic chip components mounted thereon in a stable and continuous feeding operation.

    摘要翻译： 用于电路部件的装配装置，其适于馈送电子芯片部件，特别是用于将具有梳状引线的半导体IC芯片馈送到例如电子部件。 芯片安装装置包括由带状和带状长材料制成的两个带状长的物体，并且能够以稳定且连续的供给操作来供给安装在其上的电子元件部件。

    Thick film drawing apparatus
    9.
    发明授权
    Thick film drawing apparatus 失效
    厚膜拉伸装置

    公开(公告)号：US5080036A

    公开(公告)日：1992-01-14

    申请号：US498452

    申请日：1990-03-20

    申请人： Akira Kabeshita ,  Kazuhiro Mori

    发明人： Akira Kabeshita ,  Kazuhiro Mori

    IPC分类号： B05C13/02 ,  H05K3/12

    CPC分类号： H05K3/1241 ,  B05C13/02 ,  H05K2203/0126

    摘要： A thick film drawing apparatus includes a substrate holding member (50) for holding a substrate (a), moving coils (60) for holding the substrate holding member (50), a drawing head (20) having a nozzle (30) and a stylus (33) for emitting pastes for drawing on a surface of the substrate (a) moving thereon and pushing the substrate (a) downward, respectively, wherein in the drawing process the drawing head (20) is locked of up/down motions and the substrate holding member (50) is raised/lowered at substantially constant weaker force by the moving coils (60), and thereby a relative-moving response of the up/down directions of the nozzle (30) is improved and a contact force of the stylus (33) on the substrate (a) is kept under a predetermined constant value, therefore a thickness of thick film line (c) is kept uniform and circuit patterns are prevented from being flawed.

    摘要翻译： 厚膜拉伸装置包括用于保持基板（a）的基板保持部件（50），用于保持基板保持部件（50）的移动线圈（60），具有喷嘴（30）和 用于发射用于在其上移动的基板（a）的表面上的用于绘制的浆料的触针（33），并且分别向下推动基板（a），其中在拉伸处理中，拉拔头（20）被锁定上下运动， 通过运动线圈（60）以基本恒定的弱力使基板保持部件（50）升降，从而提高喷嘴（30）的上下方向的相对移动响应， 基板（a）上的触针（33）保持在预定的常数值，因此厚膜线（c）的厚度保持均匀，并且防止电路图案的缺陷。

    SUBSTRATE TRANSFER SYSTEM AND METHOD, AND COMPONENT MOUNTING APPARATUS AND METHOD
    10.
    发明申请
    SUBSTRATE TRANSFER SYSTEM AND METHOD, AND COMPONENT MOUNTING APPARATUS AND METHOD 审中-公开
    基板传输系统及方法及组件安装设备及方法

    公开(公告)号：US20110318144A1

    公开(公告)日：2011-12-29

    申请号：US13255378

    申请日：2010-03-10

    申请人： Sakae Kobayashi ,  Akira Kabeshita ,  Masaya Watanabe

    发明人： Sakae Kobayashi ,  Akira Kabeshita ,  Masaya Watanabe

    IPC分类号： B65G49/06

    CPC分类号： H01L21/67173 ,  B65G49/061 ,  B65G49/067 ,  B65G49/068 ,  H01L21/6838 ,  H01L21/68728 ,  H05K13/0061

    摘要： A substrate transfer device has an arm, and a support shaft fixed to one end of the arm so as to pivotably support the arm in a horizontal plane. The support shaft is placed between a first working device and a second working device. A holding unit that is supported by the other end of the arm and sucks and holds an upper surface of a substrate, a rotational driving device makes the holding unit pivot on the support shaft as a center of rotation, and a posture holding mechanism keeps the pivoting holding unit in a fixed posture in horizontal directions. The substrate is transferred while the fixed posture in the horizontal directions is maintained by pivotal movement of the holding unit, between the first working device and the second working device.

    摘要翻译： 衬底传送装置具有臂和固定到臂的一端的支撑轴，以便在水平面中可枢转地支撑臂。 支撑轴放置在第一工作装置和第二工作装置之间。 保持单元，其由臂的另一端支撑并吸收并保持基板的上表面，旋转驱动装置使保持单元以支撑轴为中心旋转，姿势保持机构保持 枢转保持单元在水平方向上以固定的姿势。 在第一工作装置和第二工作装置之间通过保持单元的枢转​​运动来维持基板的水平方向的固定姿势。