摘要:
An epoxy resin composition comprising (A) a bifunctional crystalline epoxy compound, (B) an amorphous trisphenolmethane type epoxy compound having three or more of epoxy groups in a molecule, and (C) an epoxy curing agent having phenolic hydroxyl groups. The resin composition has an excellent moldability (low viscosity and can be filled with filler with high density) and high softening point, and is used preferably as an encapsulating material for electronic device.
摘要:
A display control apparatus for controlling display of a document on a display part, includes an acquiring section that acquires authentication information associated with a user entering a predefined area, a deciding section that decides whether or not the authentication information acquired by the acquiring section satisfies a display authorization condition associated with the document, and a limiting section that limits display of the document on the display part when the deciding section decides that the authentication information does not satisfy the display authorization condition.
摘要:
The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.
摘要:
An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.
摘要翻译:由式(1)表示的不饱和酰亚胺化合物:其中Q是含有4-20个碳原子的含脂环结构的烃基; R 1,R 2,R 3,R 4,R 1和R 3中的每一个表示氢原子,卤素原子,具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a,b,c,d,e和f中的每一个表示满足+ b = 4,c + d 4和e + f 4的0〜4的整数,D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团,制备式(1)的不饱和酰亚胺化合物的方法和用于制备式(1)的不饱和酰亚胺化合物的中间体。 式(1)的不饱和酰亚胺化合物在有机溶剂中很好溶解,可以得到耐热性,吸水性和柔软性优异的固化产物。
摘要:
A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.
摘要:
A thermosetting resin composition useful for a copper-clad laminate is provided, which comprise (A) an aromatic diamine compound represented by the following formula: ##STR1## wherein Ar is a divalent aromatic residue, and R.sub.1, R.sub.2, R.sub.3 and R.sub.4 each is an allyl group or a hydrogen atom but at least one of them is an allyl group, and (B) a polymaleimide compound having two or more maleimide groups in a molecule thereof.
摘要:
Provided is a granular fertilizer coated with a thermosetting resin coating, characterized in that a dissolution rate of the fertilizer is retarded by containing a hydrophobic compound in at least one of the coating portion and the fertilizer portion thereof. The dissolution rate is further retarded than that of a conventional granular coated fertilizer coated with a thermosetting resin.
摘要:
A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.
摘要:
An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.
摘要翻译:由式(1)表示的不饱和酰亚胺化合物:其中Q是含4-20个碳原子的含脂环结构的烃基; R 1,R 2,R 3,R 4,R 1和R 3中的每一个表示氢原子,卤素原子,具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a,b,c,d,e和f中的每一个表示满足+ b = 4,c + d 4和e + f 4的0〜4的整数,D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团,制备式(1)的不饱和酰亚胺化合物的方法和用于制备式(1)的不饱和酰亚胺化合物的中间体。 式(1)的不饱和酰亚胺化合物在有机溶剂中很好溶解,可以得到耐热性,吸水性和柔软性优异的固化产物。
摘要:
Magnetic recording and reproducing method and apparatus for digital signals. An input binary digital signal is converted into an intermediate signal series by a precoder having a delay circuit for two-time slot delay and a modulo-2 adder. The intermediate signal series is branched to two paths. One signal on one path is delayed by one time slot and subtracted from the other signal on the other path to produce a recording signal to be recorded on a recording medium. A signal reproduced from the recording medium is branched to two paths. One signal on one path is delayed by one time slot and added to the other signal on the other path. The added signal is decoded to produce a binary signal which corresponds to the input binary digital signal.