-
1.Packaging structure for a semiconductor element flip-chip mounted on a mounting board having staggered bump connection location on the pads and method thereof 失效
标题翻译: 用于半导体元件倒装芯片的封装结构,其安装在具有焊盘上的交错凸块连接位置的安装板上及其方法公开(公告)号:US06222738B1
公开(公告)日:2001-04-24
申请号:US09040394
申请日:1998-03-18
申请人: Yoshinobu Maeno , Kenichiro Abe , Kouzi Soekawa
发明人: Yoshinobu Maeno , Kenichiro Abe , Kouzi Soekawa
IPC分类号: H01L2348
CPC分类号: H01L24/06 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/78 , H01L24/81 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/06153 , H01L2224/11 , H01L2224/1134 , H01L2224/11822 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/1411 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/49431 , H01L2224/73265 , H01L2224/78301 , H01L2224/81385 , H01L2224/81801 , H01L2224/85181 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H05K1/111 , H05K3/4602 , Y10T29/49146 , H01L2924/00
摘要: A packaging structure of semiconductor elements and for mounting such elements on which high density pads are formed on a board at a high production yield, where bumps or gold wires are bonded in a staggered manner within a pad on a semiconductor element. The spaces between bumps or gold wires can be widened without changing the semiconductor element.
摘要翻译: 一种半导体元件的封装结构,并且用于安装这样的元件,其上以高生产成本在板上形成高密度焊盘,其中凸块或金线以交错方式接合在半导体元件上的焊盘内。 可以在不改变半导体元件的情况下加宽凸块或金线之间的间隔。