Heat-curable polyimide silicone Composition and a cured film therefrom
    5.
    发明申请
    Heat-curable polyimide silicone Composition and a cured film therefrom 有权
    热固性聚酰亚胺硅酮组合物及其固化膜

    公开(公告)号:US20090062479A1

    公开(公告)日:2009-03-05

    申请号:US12230762

    申请日:2008-09-04

    IPC分类号: C08L79/08 C08L71/02

    摘要: A heat-curable resin composition, comprising (A) a polyimide silicone resin having a phenolic hydroxyl group and a radically polymerizable group bonded to a silicon atom, (B) an epoxy resin in such an amount that a molar ratio of the epoxy groups of the epoxy resin to the phenolic hydroxyl groups of the polyimide silicone resin (A) ranges from 0.2 to 10, and a catalytic amount of (C) an organic peroxide.

    摘要翻译: 一种热固性树脂组合物,其包含(A)具有酚羟基的聚酰亚胺硅树脂和与硅原子键合的自由基聚合性基团,(B)环氧树脂,其量使得环氧基的摩尔比 聚酰亚胺硅树脂(A)的酚羟基的环氧树脂为0.2〜10,催化量为(C)有机过氧化物。

    Phenolic OH and radically polymerizable group containing polyimide silicone and epoxy resin
    6.
    发明授权
    Phenolic OH and radically polymerizable group containing polyimide silicone and epoxy resin 有权
    酚OH和自由基聚合基团含聚酰亚胺硅酮和环氧树脂

    公开(公告)号:US07834100B2

    公开(公告)日:2010-11-16

    申请号:US12230762

    申请日:2008-09-04

    IPC分类号: C08L79/08

    摘要: A heat-curable resin composition, comprising (A) a polyimide silicone resin having a phenolic hydroxyl group and a radically polymerizable group bonded to a silicon atom, (B) an epoxy resin in such an amount that a molar ratio of the epoxy groups of the epoxy resin to the phenolic hydroxyl groups of the polyimide silicone resin (A) ranges from 0.2 to 10, and a catalytic amount of (C) an organic peroxide.

    摘要翻译: 一种热固性树脂组合物,其包含(A)具有酚羟基的聚酰亚胺硅树脂和与硅原子键合的自由基聚合性基团,(B)环氧树脂,其量使得环氧基的摩尔比 聚酰亚胺硅树脂(A)的酚羟基的环氧树脂为0.2〜10,催化量为(C)有机过氧化物。

    Solvent-free polyimide silicone resin composition and a resin film composed of the same
    8.
    发明申请
    Solvent-free polyimide silicone resin composition and a resin film composed of the same 有权
    无溶剂的聚酰亚胺硅树脂组合物和由其组成的树脂膜

    公开(公告)号:US20060084714A1

    公开(公告)日:2006-04-20

    申请号:US11111809

    申请日:2005-05-23

    IPC分类号: C03C25/10

    摘要: A solvent-free resin composition comprising (a) a polyimide silicone resin having repeating units represented by the following general formulas (1-1) and (1-2), wherein X is a tetravalent organic group, Y is a divalent organic group, and Z is a divalent organic group having an organosiloxane moiety, (b) a reactive diluent, and (c) a photo-polymerization initiator, characterized in that a film of said resin composition with a film thickness of 100 μm prepared on a quartz glass substrate shows a light transmittance of 80% or higher at wavelengths of from 350 nm to 450 nm.

    摘要翻译: 1.一种无溶剂树脂组合物,其含有(a)具有下述通式(1-1)和(1-2)表示的重复单元的聚酰亚胺硅酮树脂,其中X为四价有机基团,Y为二价有机基团, Z为具有有机硅氧烷部分的二价有机基团,(b)反应性稀释剂,(c)光聚合引发剂,其特征在于,在石英玻璃上制备膜厚为100μm的所述树脂组合物的膜 衬底在350nm至450nm的波长处显示出80%或更高的透光率。

    Colorless and transparent polyimidesilicone resin having thermosetting functional groups
    10.
    发明授权
    Colorless and transparent polyimidesilicone resin having thermosetting functional groups 有权
    无色透明的具有热固性官能团的聚酰亚胺树脂

    公开(公告)号:US07041766B2

    公开(公告)日:2006-05-09

    申请号:US10681119

    申请日:2003-10-09

    IPC分类号: C08G77/26

    摘要: A colorless and transparent thermosetting polyimidesilicone resin comprising structural units of the following general formula (1) and structural units of the general formula (4), said resin being soluble in an organic solvent wherein X is a tetravalent organic group having 4 or more carbon atoms, none of the carbon atoms of X being bound to a plurality of carbonyl groups, Y is a diamine residue and Z is a diaminosiloxane residue.

    摘要翻译: 一种无色透明的热固性聚酰亚胺树脂,其包含以下通式(1)的结构单元和通式(4)的结构单元,所述树脂可溶于有机溶剂,其中X为具有4个或更多个碳原子的四价有机基团 X的碳原子都不与多个羰基结合,Y是二胺残基,Z是二氨基硅氧烷残基。