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    OPTICAL SEMICONDUCTOR DEVICE
    1.
    发明申请
    OPTICAL SEMICONDUCTOR DEVICE 有权
    光学半导体器件

    公开(公告)号：US20120193740A1

    公开(公告)日：2012-08-02

    申请号：US13356104

    申请日：2012-01-23

    申请人： Yoshiyuki Doi ,  Yoshifumi Muramoto ,  Takaharu Ohyama

    发明人： Yoshiyuki Doi ,  Yoshifumi Muramoto ,  Takaharu Ohyama

    IPC分类号： H01L31/0232

    CPC分类号： H01L27/1446 ,  H01L31/0203 ,  H01L31/022408 ,  H01L31/02327 ,  H01L31/105 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The present invention is intended to provide a compact and simple optical semiconductor device that reduces crosstalk (leakage current) between light receiving elements. According to the present invention, since a back surface electrode is a mirror-like thin film, crosstalk to an adjacent light receiving element can be suppressed, thereby reducing a detection error of a light intensity. By disposing a patterned back surface electrode or by disposing an ohmic electrode at the bottom of an insulating film over the whole back surface, contact resistance on the back surface can be reduced. By using the optical semiconductor elements with a two-dimensional arrangement and by using a mirror-like thin film as the back surface electrode, crosstalk can be reduced. By accommodating the optical semiconductor elements in the housing in a highly hermetic condition, the optical semiconductor elements can be protected from an external environment.

    摘要翻译： 本发明旨在提供一种紧凑且简单的光学半导体器件，其减少光接收元件之间的串扰（漏电流）。 根据本发明，由于背面电极是镜面状的薄膜，因此能够抑制与相邻的受光元件的串扰，能够降低光强度的检测误差。 通过设置图案化的背面电极或通过在整个背面的绝缘膜的底部设置欧姆电极，可以降低背面的接触电阻。 通过使用具有二维排列的光半导体元件和通过使用镜面状的薄膜作为背面电极，可以降低串扰。 通过将光学半导体元件容纳在高度密封状态的壳体中，可以保护光学半导体元件免受外部环境的影响。

    OPTICAL MODULE
    3.
    发明申请
    OPTICAL MODULE 有权
    光学模块

    公开(公告)号：US20100322569A1

    公开(公告)日：2010-12-23

    申请号：US12666583

    申请日：2008-06-30

    申请人： Takaharu Ohyama ,  Yoshiyuki Doi ,  Ikuo Ogawa ,  Akimasa Kaneko ,  Yasuaki Tamura ,  Yuichi Suzuki

    发明人： Takaharu Ohyama ,  Yoshiyuki Doi ,  Ikuo Ogawa ,  Akimasa Kaneko ,  Yasuaki Tamura ,  Yuichi Suzuki

    IPC分类号： G02B6/36

    CPC分类号： G02B6/42 ,  G02B6/12019 ,  G02B6/30 ,  G02B6/4201 ,  G02B6/4267 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  H01L2224/48091 ,  H01S5/02208 ,  H01S5/02248 ,  H01S5/02284 ,  H01L2924/00014

    摘要： An optical module has a structure for reducing the stress applied to a package. The optical module is structured so that an end face of a waveguide (37) of a planar lightwave circuit (30) is joined to a plurality of packages (40) storing therein optical elements so that the waveguide is optically coupled to the optical elements. The optical module includes a housing (3) storing therein a planar lightwave circuit and a plurality of packages in which an upper face of a protrusion (270) formed in the bottom section is fixed to the planar lightwave circuit (30). Each of the plurality of packages (40) is electrically connected to an electric part (22) provided in the housing (3) via flexible printed circuits (271a, 271b).

    摘要翻译： 光学模块具有用于减小施加到包装上的应力的结构。 光学模块被构造成使得平面光波电路（30）的波导（37）的端面与存储有光学元件的多个封装（40）接合，使得波导光耦合到光学元件。 光学模块包括容纳有平面光波电路的壳体（3）和形成在底部的突起（270）的上表面固定在平面光波回路（30）上的多个封装体。 所述多个封装体（40）中的每一个通过柔性印刷电路（271a，271b）电连接到设置在所述壳体（3）中的电气部件（22）。

    Optical module
    4.
    发明授权
    Optical module 有权
    光模块

    公开(公告)号：US08545111B2

    公开(公告)日：2013-10-01

    申请号：US12666583

    申请日：2008-06-30

    申请人： Takaharu Ohyama ,  Yoshiyuki Doi ,  Ikuo Ogawa ,  Akimasa Kaneko ,  Yasuaki Tamura ,  Yuichi Suzuki

    发明人： Takaharu Ohyama ,  Yoshiyuki Doi ,  Ikuo Ogawa ,  Akimasa Kaneko ,  Yasuaki Tamura ,  Yuichi Suzuki

    IPC分类号： G02B6/36

    CPC分类号： G02B6/42 ,  G02B6/12019 ,  G02B6/30 ,  G02B6/4201 ,  G02B6/4267 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  H01L2224/48091 ,  H01S5/02208 ,  H01S5/02248 ,  H01S5/02284 ,  H01L2924/00014

    摘要： An optical module has a structure for reducing the stress applied to a package. The optical module is structured so that an end face of a waveguide (37) of a planar lightwave circuit (30) is joined to a plurality of packages (40) storing therein optical elements so that the waveguide is optically coupled to the optical elements. The optical module includes a housing (3) storing therein a planar lightwave circuit and a plurality of packages in which an upper face of a protrusion (270) formed in the bottom section is fixed to the planar lightwave circuit (30). Each of the plurality of packages (40) is electrically connected to an electric part (22) provided in the housing (3) via flexible printed circuits (271a, 271b).

    摘要翻译： 光学模块具有用于减小施加到包装上的应力的结构。 光学模块被构造成使得平面光波电路（30）的波导（37）的端面与存储有光学元件的多个封装（40）接合，使得波导光耦合到光学元件。 光学模块包括容纳有平面光波电路的壳体（3）和形成在底部的突起（270）的上表面固定在平面光波回路（30）上的多个封装体。 所述多个封装体（40）中的每一个通过柔性印刷电路（271a，271b）电连接到设置在所述壳体（3）中的电气部件（22）。

    OPTICAL SIGNAL MONITORING APPARATUS, OPTICAL SYSTEM AND OPTICAL SIGNAL MONITORING METHOD
    5.
    发明申请
    OPTICAL SIGNAL MONITORING APPARATUS, OPTICAL SYSTEM AND OPTICAL SIGNAL MONITORING METHOD 审中-公开
    光信号监测装置，光系统和光信号监测方法

    公开(公告)号：US20080226290A1

    公开(公告)日：2008-09-18

    申请号：US12042767

    申请日：2008-03-05

    申请人： Takaharu Ohyama ,  Takashi Goh ,  Shin Kamei ,  Shunichi Sohma ,  Mikitaka Itoh ,  Ikuo Ogawa ,  Akimasa Kaneko ,  Tomoyuki Yamada ,  Mitsuru Nagano ,  Yoshiyuki Doi ,  Takashi Saida

    发明人： Takaharu Ohyama ,  Takashi Goh ,  Shin Kamei ,  Shunichi Sohma ,  Mikitaka Itoh ,  Ikuo Ogawa ,  Akimasa Kaneko ,  Tomoyuki Yamada ,  Mitsuru Nagano ,  Yoshiyuki Doi ,  Takashi Saida

    IPC分类号： H04B10/08

    CPC分类号： H04B10/07955

    摘要： By reducing the number of PD arrays, and by simplifying the configuration of an optical power monitor in a WDM system, a miniaturized, cost reduced optical signal monitoring apparatus, optical system or optical signal monitoring method is provided. An optical power monitor 1 has an optical switch 30 having four input ports 31, a DMUX 2 having 48 output ports, and six CSP type PD array modules 50 each including an 8-channel PD array. The output port 32 of the optical switch 30 having four switchable input ports 31 is optically connected to the input port 21 of the AWG 20. The 48 output ports 22 of the AWG 20 are each optically connected to photosensitive surfaces 53 of the individual PDs included in the CSP type PD array modules 50. The CSP type PD array modules 50 are mounted on the end face of the AWG 20.

    摘要翻译： 通过减少PD阵列的数量，并且通过简化WDM系统中的光功率监视器的配置，提供了一种小型化，成本降低的光信号监视装置，光学系统或光信号监视方法。 光功率监视器1具有具有四个输入端口31的光开关30，具有48个输出端口的DMUX 2和每个包括8通道PD阵列的六个CSP型PD阵列模块50。 具有四个可切换输入端口31的光开关30的输出端口32光学连接到AWG 20的输入端口21。 AWG 20的48个输出端口22每个光学连接到包括在CSP型PD阵列模块50中的各个PD的感光表面53。 CSP型PD阵列模块50安装在AWG 20的端面上。