摘要:
A light guide 11 of a rectangular cross-section has side faces 11a, 11b including short sides in the longitudinal direction of which one side face 11a is provided with a light-scattering pattern 20, formed by screen-printing in white paint, for scattering the light incident to the light guide 11. The other side face 11b facing the side face 11a is exposed from a casing 12 to serve as a light-emitting surface. In the present embodiment, it is possible to secure a sufficient amount of light because the whole area of the side face is used as the light-emitting surface. The remaining side faces 11c, 11d of the light guide 11 are side faces including the long sides. Since the side faces 11c, 11d easily produce a surface sink during molding, neither the light-scattering pattern 20 nor the light-emitting surface is provided thereon.
摘要:
A light guide 11 of a rectangular cross-section has side faces 11a, 11b including short sides in the longitudinal direction of which one side face 11a is provided with a light-scattering pattern 20, formed by screen-printing in white paint, for scattering the light incident to the light guide 11. The other side face 11b facing the side face 11a is exposed from a casing 12 to serve as a light-emitting surface. In the present embodiment, it is possible to secure a sufficient amount of light because the whole area of the side face is used as the light-emitting surface. The remaining side faces 11c, 11d of the light guide 11 are side faces including the long sides. Since the side faces 11c, 11d easily produce a surface sink during molding, neither the light-scattering pattern 20 nor the light-emitting surface is provided thereon.
摘要:
A line-illuminating device 10, 20 having a light guide 11, 21 of which the cross-sectional shape is rectangular and its one corner is chamfered to form an emission plane 11a, 21a is provided, in which the light guide 11, 21 is housed in a light guide casing 12, 22, wherein the chamfer dimension of the emission plane 11a, 21a is more than 40% of a height dimension of the light guide 11, 21. By enlarging the chamfer dimension and broadening the width of the emission plane 11a, 21a, the directional characteristics of the emitted light is expanded. In this manner, it is possible to reduce the extent of decrease in the quantity of illuminating light on a document surface when the document surface is elevated.
摘要:
A light-emitting unit 20 has a light-emitting unit board 21 made of resin provided with a lead frame 22. The light-emitting unit board 21 is also provided with an open window 21a for mounting a light-emitting device. The lead frame 22 comprises a lead terminal section 22a, an inner lead section 22c, and a light-emitting device mounting and connecting section 22b which is exposed within the open window 21a. The light-emitting devices 23a, 23b, and 23c are bonded with the light-emitting device mounting and connecting section 22b, and electrodes of the light-emitting devices and the lead frame are connected by a metal wire 24, wherein the open window 21a is sealed by transparent resin. The lead frame 22 is made of iron-containing copper to improve heat radiation performance of the light-emitting unit board. By increasing maximum current to be supplied to the light-emitting diodes, it is possible to increase illumination brightness and to attain speedup of image reading.
摘要:
A light-emitting unit 20 has a light-emitting unit board 21 made of resin provided with a lead frame 22. The light-emitting unit board 21 is also provided with an open window 21a for mounting a light-emitting device. The lead frame 22 comprises a lead terminal section 22a, an inner lead section 22c, and a light-emitting device mounting and connecting section 22b which is exposed within the open window 21a. The light-emitting devices 23a, 23b, and 23c are bonded with the light-emitting device mounting and connecting section 22b, and electrodes of the light-emitting devices and the lead frame are connected by a metal wire 24, wherein the open window 21a is sealed by transparent resin. The lead frame 22 is made of iron-containing copper to improve heat radiation performance of the light-emitting unit board. By increasing maximum current to be supplied to the light-emitting diodes, it is possible to increase illumination brightness and to attain speedup of image reading.
摘要:
To provide a rod-like light guide and a line lighting device including the rod-like light guide, both of which are easy to include in an image reading device, a contact-type image sensor and an image reading device. For instance, a protruding portion having a flat or curved surface is formed by grinding an end face of a rod-like light guide in a longitudinal direction while leaving at least 80% of the surface area of the end face, and a reflective surface is formed by bonding a heat transfer film to the protruding portion. Thus, even if a portion of the protrusion portion melts when performing thermal processing on the heat transfer film, the portion will not jut out beyond a cross-sectional area of the rod-like light guide, and the rod-like light guide can be easily contained in a case.
摘要:
An illumination device includes a casing, a bar-shaped light guide housed in the casing to expose a light-emitting surface thereof, a light-emitting unit secured to an end section of the casing, wherein light from the light-emitting unit is introduced within the light guide through an end face thereof and then totally reflected within the light guide to be emitted through the light-emitting surface, a shielding section which covers an end section of the light guide at the end section of the casing close to the light-emitting unit and is provided on the light-emitting surface side of the light guide, a notch is formed at an end of the light guide on the light-emitting surface side close to the light-emitting unit, and light from the light-emitting unit is reflected on a rear surface of the shielding section through a gap between the notch and the light-emitting unit to be introduced into the light guide.
摘要:
A light emitting unit comprises a light emitting element, a light emitting element substrate for mounting the light emitting element, and a light emitting element substrate frame member provided with a window for exposing the light emitting element, wherein the inside of the window is sealed with a first resin and a second resin, the ratio of the second resin relative to the first resin becomes smaller toward the outside of the window from the inside thereof. The first resin is a transparent resin, and the second resin is a colored resin with a high color value or a resin including a light reflective material and/or a light scattering material. Since a sectional border line between the first resin and the second resin is a curved line, the light reflected from the bottom section of the window among the light emitted from the light emitting element can also be efficiently emitted to the outside.
摘要:
An image sensor and a manufacturing method thereof are provided, so that the warp or the distortion is not caused even if there is the thermal expansion difference or the thermal contraction difference in the longitudinal direction between the linear illuminating device and the frame. The image sensor comprises a linear illuminating device for illuminating an original; a light-receiving element array for receiving reflected light from the original; a lens array for focusing the original on the light-receiving element array; a frame for containing the linear illuminating device, the lens array, and the light-receiving element array; and a resilient retaining portion for pressing the linear illuminating device, which is mounted in the frame, into the frame.
摘要:
A light emitting unit comprises a light emitting element, a light emitting element substrate for mounting the light emitting element, a light emitting element substrate frame member provided with a window for exposing the light emitting element, and an electrode for supplying electricity to the light emitting element, wherein the light emitting element substrate is a metal and the light emitting element is mounted directly on the light emitting element substrate. The light emitting unit is also characterized in that the light emitting element substrate is a metal, a metal oxide film is provided on the light emitting element substrate, and the light emitting element is mounted on the electrode formed on the metal oxide film.