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12 条记录 (耗时 0.028 秒)

    Method of manufacturing light emitting diode package
    1.
    发明申请
    Method of manufacturing light emitting diode package 有权
    制造发光二极管封装的方法

    公开(公告)号：US20090286337A1

    公开(公告)日：2009-11-19

    申请号：US12007417

    申请日：2008-01-10

    申请人： Young Il Lee ,  Jae Woo Joung ,  Joon Rak Choi

    发明人： Young Il Lee ,  Jae Woo Joung ,  Joon Rak Choi

    IPC分类号： H01L33/00

    CPC分类号： H01L33/508 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： There is provided a method of manufacturing a light emitting diode chip, the method including: providing a light emitting diode chip; forming a phosphor layer on a top of the light emitting diode chip; and forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder. There is also provided A method of manufacturing a light emitting diode package, the method including: forming a phosphor layer with a predetermined thickness; forming phosphors of a lattice structure on the phosphor layer by an ink jet process using an ink containing phosphor powder; and disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the light emitting diode chip.

    摘要翻译： 提供一种制造发光二极管芯片的方法，该方法包括：提供发光二极管芯片; 在所述发光二极管芯片的顶部上形成荧光体层; 并通过使用含有荧光体粉末的油墨的喷墨方法在荧光体层上形成晶格结构的荧光体。 还提供了一种制造发光二极管封装的方法，该方法包括：形成具有预定厚度的荧光体层; 通过使用含有荧光粉的油墨的喷墨法在荧光体层上形成晶格结构的荧光体; 并将其上形成有晶格结构的磷光体的荧光体层设置在发光二极管芯片的顶部。

    Method of manufacturing light emitting diode package
    2.
    发明授权
    Method of manufacturing light emitting diode package 有权
    制造发光二极管封装的方法

    公开(公告)号：US07795055B2

    公开(公告)日：2010-09-14

    申请号：US12007417

    申请日：2008-01-10

    申请人： Young Il Lee ,  Jae Woo Joung ,  Joon Rak Choi

    发明人： Young Il Lee ,  Jae Woo Joung ,  Joon Rak Choi

    IPC分类号： H01L21/00

    CPC分类号： H01L33/508 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： There is provided a method of manufacturing a light emitting diode chip, the method including: providing a light emitting diode chip; forming a phosphor layer on a top of the light emitting diode chip; and forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder. There is also provided A method of manufacturing a light emitting diode package, the method including: forming a phosphor layer with a predetermined thickness; forming phosphors of a lattice structure on the phosphor layer by an ink jet process using an ink containing phosphor powder; and disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the light emitting diode chip.

    摘要翻译： 提供一种制造发光二极管芯片的方法，该方法包括：提供发光二极管芯片; 在所述发光二极管芯片的顶部上形成荧光体层; 并通过使用含有荧光体粉末的油墨的喷墨方法在荧光体层上形成晶格结构的荧光体。 还提供了一种制造发光二极管封装的方法，该方法包括：形成具有预定厚度的荧光体层; 通过使用含有荧光粉的油墨的喷墨法在荧光体层上形成晶格结构的荧光体; 并将其上形成有晶格结构的磷光体的荧光体层设置在发光二极管芯片的顶部。

    APPARATUS AND METHOD FOR PROVIDING OBSTACLE INFORMATION IN AUTONOMOUS MOBILE VEHICLE
    3.
    发明申请
    APPARATUS AND METHOD FOR PROVIDING OBSTACLE INFORMATION IN AUTONOMOUS MOBILE VEHICLE 有权
    自动移动车辆提供障碍物信息的装置和方法

    公开(公告)号：US20130222174A1

    公开(公告)日：2013-08-29

    申请号：US13878681

    申请日：2011-09-14

    申请人： Tok Son Choe ,  Yoon Woon Park ,  Young Il Lee

    发明人： Tok Son Choe ,  Yoon Woon Park ,  Young Il Lee

    IPC分类号： G01S13/86

    CPC分类号： G01S13/865 ,  B60W30/16 ,  G05D1/0248 ,  G05D11/006

    摘要： An apparatus for providing obstacle information in an autonomous mobile vehicle and a method thereof, in which a target object is determined to be what obstacle by combining pieces of information received from a laser distance sensor and radars, thereby enabling the autonomous driving of a vehicle. The apparatus and method for providing obstacle information in an autonomous mobile vehicle, which is capable of providing robust obstacle information not only in environments normal times, but also dust environments by combining a laser distance sensor and radar data radars. A problem that an obstacle through which a mobile unit can pass, such as dust, is mistaken for an obstacle through which the mobile unit cannot pass can be solved.

    摘要翻译： 一种用于在自主移动车辆中提供障碍物信息的装置及其方法，其中通过组合从激光距离传感器接收的信息和雷达来确定目标对象是什么障碍，从而使得能够自动驾驶车辆。 在自主移动车辆中提供障碍物信息的装置和方法，其能够不仅在正常时间环境下提供鲁棒的障碍物信息，而且通过组合激光距离传感器和雷达数据雷达来提供灰尘环境。 可以解决移动单元能够通过的障碍物（例如灰尘）的问题，可以解决移动单元不能通过的障碍物。

    CONDUCTIVE PASTE COMPOSITION FOR LOW TEMPERATURE FIRING
    4.
    发明申请
    CONDUCTIVE PASTE COMPOSITION FOR LOW TEMPERATURE FIRING 审中-公开
    低温燃烧用导电胶组合物

    公开(公告)号：US20130069014A1

    公开(公告)日：2013-03-21

    申请号：US13333801

    申请日：2011-12-21

    申请人： Young Il Lee ,  Dong Hoon Kim ,  Jun Young Kim ,  Ji Han Kwon ,  Sung Eun Kim

    发明人： Young Il Lee ,  Dong Hoon Kim ,  Jun Young Kim ,  Ji Han Kwon ,  Sung Eun Kim

    IPC分类号： H01B1/22 ,  B82Y99/00

    CPC分类号： H01B1/22 ,  B82Y30/00

    摘要： Disclosed is a conductive paste composition for low temperature firing, including conductive copper powder composed of flake powder, spherical powder and nano powder, a melamine-based binder, and an organic solvent, thus enabling the formation of a conductive wire having a high aspect ratio with high printability, and inexpensive formation of a metal wire, and exhibiting superior electrical properties and adhesive force even when conducting low temperature firing at 200° C. or less, so that the conductive paste composition can be usefully applied as a conductive material for forming electrodes of a variety of products such as solar cells, touch panels, printed circuit boards (PCBs), radio-frequency identification (RFID), plasma display panels (PDPs) and so on.

    摘要翻译： 公开了一种用于低温烧制的导电糊组合物，包括由片状粉末，球形粉末和纳米粉末组成的导电铜粉末，三聚氰胺基粘合剂和有机溶剂，从而能够形成具有高纵横比的导线 具有高可印刷性，并且廉价地形成金属线，并且即使在200℃或更低温度下进行低温烧制，也表现出优异的电性能和粘合力，使得导电糊组合物可有效地用作形成用导电材料 各种产品的电极，如太阳能电池，触摸屏，印刷电路板（PCB），射频识别（RFID），等离子体显示面板（PDP）等。

    Method of preparing composite nickel particles
    5.
    发明授权
    Method of preparing composite nickel particles 失效
    复合镍颗粒的制备方法

    公开(公告)号：US08343254B2

    公开(公告)日：2013-01-01

    申请号：US12603080

    申请日：2009-10-21

    申请人： Young Il Lee ,  Jae Woo Jung ,  In Keun Shim

    发明人： Young Il Lee ,  Jae Woo Jung ,  In Keun Shim

    IPC分类号： B22F9/24 ,  B82Y40/00

    CPC分类号： B22F1/02 ,  B22F9/20 ,  B22F2998/00 ,  B22F2998/10 ,  Y10T428/2993 ,  B22F1/0018 ,  B22F9/24 ,  B22F1/0085

    摘要： Composite Ni particles each having a silica coat is improved in oxidation resistance and heat shrink characteristics. A method of preparing composite Ni particles by using an organic Ni composite includes steps of: stirring and heating a nickel salt solution and a raw material of silica coat at a temperature ranging 25° C. to 80° C. for 0.5 hours to 2 hours; filtering, cleaning and drying a resultant product into an organic nickel composite; and thermally treating the organic nickel composite at a temperature ranging from 200° C. to 500° C. for 0.5 hours to 4 hours. The resultant composite Ni particles have excellent oxidation resistance and heat shrink characteristics.

    摘要翻译： 各自具有二氧化硅涂层的复合Ni颗粒的耐氧化性和热收缩特性得到改善。 通过使用有机Ni复合材料制备复合Ni颗粒的方法包括以下步骤：在25℃至80℃的温度范围内搅拌并加热镍盐溶液和二氧化硅原料涂层0.5小时至2小时 ; 将所得产物过滤，清洗和干燥成有机镍复合物; 并在200℃至500℃的温度下热处理有机镍复合物0.5小时至4小时。 所得复合Ni颗粒具有优异的抗氧化性和热收缩特性。

    Copper nanoparticle dispersion
    6.
    发明授权
    Copper nanoparticle dispersion 有权
    铜纳米颗粒分散体

    公开(公告)号：US08187504B2

    公开(公告)日：2012-05-29

    申请号：US12405789

    申请日：2009-03-17

    申请人： Young Il Lee ,  Dong Hoon Kim ,  Kwi Jong Lee

    发明人： Young Il Lee ,  Dong Hoon Kim ,  Kwi Jong Lee

    IPC分类号： H01B1/22

    CPC分类号： H01B1/22 ,  H05K1/097 ,  Y10T428/2991 ,  Y10T428/2998

    摘要： Provided is a metal nanoparticle dispersion capable of suppressing spreadability at a room temperature and drying phenomenon at heating temperature. The metal nanoparticle dispersion includes metal particles; and an organic solvent having a viscosity of 10 mPa·s or more at a room temperature and a flash point of 100° C. or above.

    摘要翻译： 提供能够抑制室温下的铺展性和加热温度下的干燥现象的金属纳米粒子分散体。 金属纳米颗粒分散体包括金属颗粒; 和在室温和闪点为100℃以上的粘度为10mPa·s以上的有机溶剂。