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    Interposer and probe card having the same
    4.
    发明申请
    Interposer and probe card having the same 有权
    内插器和探针卡具有相同的功能

    公开(公告)号：US20090102500A1

    公开(公告)日：2009-04-23

    申请号：US12285962

    申请日：2008-10-17

    申请人： Young-Soo An ,  Sang-Hoon Lee ,  Se-Jang Oh

    发明人： Young-Soo An ,  Sang-Hoon Lee ,  Se-Jang Oh

    IPC分类号： G01R31/26 ,  H01R12/00

    CPC分类号： G01R31/2889 ,  H01R12/714

    摘要： An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.

    摘要翻译： 插入器可以包括第一基极，第一基极中的至少一个第一信号线和第一基极中的至少一个第一接地线，其中接地线包围至少一个第一信号线。 所述至少一个第一信号线和所述至少一个第一接地线可以通过所述第一基座的上表面暴露。 所述至少一个第一信号线可以被配置为进行穿过所述第一基座的测试电流。 插入器还可以包括位于第一基座下方的第二基座，并且可以包括在第一基座和第二基座之间的印刷电路板。 探针卡可以包括具有至少一个接触针的多层衬底，具有至少一个同轴信号电缆的同轴板以及多层衬底和同轴板之间的上述插入器。

    Interposer and probe card having the same
    5.
    发明授权
    Interposer and probe card having the same 有权
    内插器和探针卡具有相同的功能

    公开(公告)号：US07884628B2

    公开(公告)日：2011-02-08

    申请号：US12285962

    申请日：2008-10-17

    申请人： Young-Soo An ,  Sang-Hoon Lee ,  Se-Jang Oh

    发明人： Young-Soo An ,  Sang-Hoon Lee ,  Se-Jang Oh

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2889 ,  H01R12/714

    摘要： An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.

    摘要翻译： 插入器可以包括第一基极，第一基极中的至少一个第一信号线和第一基极中的至少一个第一接地线，其中接地线包围至少一个第一信号线。 所述至少一个第一信号线和所述至少一个第一接地线可以通过所述第一基座的上表面暴露。 所述至少一个第一信号线可以被配置为进行穿过所述第一基座的测试电流。 插入器还可以包括位于第一基座下方的第二基座，并且可以包括在第一基座和第二基座之间的印刷电路板。 探针卡可以包括具有至少一个接触针的多层衬底，具有至少一个同轴信号电缆的同轴板以及多层衬底和同轴板之间的上述插入器。

    Wireless interface probe card for high speed one-shot wafer test and semiconductor testing apparatus having the same
    6.
    发明授权
    Wireless interface probe card for high speed one-shot wafer test and semiconductor testing apparatus having the same 有权
    无线接口探针卡，用于高速单片晶圆测试和半导体测试装置

    公开(公告)号：US07880490B2

    公开(公告)日：2011-02-01

    申请号：US12200716

    申请日：2008-08-28

    申请人： Sang-Hoon Lee ,  Kwang-Yong Lee ,  Se-Jang Oh ,  Young-Soo An

    发明人： Sang-Hoon Lee ,  Kwang-Yong Lee ,  Se-Jang Oh ,  Young-Soo An

    IPC分类号： G01R31/28

    CPC分类号： G01R31/2889 ,  G01R31/3025

    摘要： A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.

    摘要翻译： 无线接口探针卡包括基板部件和传输部件。 基板构件具有以恒定间距排列的多个探针端子。 探针端子可以直接接触布置在晶片上的多个半导体芯片中的每一个上以恒定间距布置的多个焊盘，以对布置在晶片上的半导体芯片进行测试。 传输构件布置在基板构件上，无线地接收测试信号，并通过探针端子将接收到的测试信号提供给晶片的焊盘，并且通过以下方式无线地和外部地传输从晶片的焊盘提供的电特性信号 探头端子。

    Electrical test system including coaxial cables
    7.
    发明授权
    Electrical test system including coaxial cables 有权
    电测试系统包括同轴电缆

    公开(公告)号：US07538566B2

    公开(公告)日：2009-05-26

    申请号：US11926172

    申请日：2007-10-29

    申请人： Young-Soo An ,  Se-Jang Oh ,  Jung-Hyun Nam

    发明人： Young-Soo An ,  Se-Jang Oh ,  Jung-Hyun Nam

    IPC分类号： G01R31/02 ,  G01R31/28

    CPC分类号： G01R31/2889

    摘要： An electrical test system includes a test head, a performance board, a probe card and coaxial cables. The performance board includes a first side and an opposite second side, where the first side of the performance board is electrically connected to the test head and the second side of the performance board includes first coaxial cable connection portions. The probe card includes a first side and an opposite second side, where the first side of the probe card includes second coaxial cable connection portions and the second side includes a wafer test probes. The coaxial cables respectively electrically connect the first coaxial cable connection portions of the performance board to the second coaxial cable connection portions of the probe card.

    摘要翻译： 电气测试系统包括测试头，演奏板，探针卡和同轴电缆。 所述性能板包括第一侧和相对的第二侧，其中所述性能板的第一侧电连接到所述测试头，并且所述性能板的第二侧包括第一同轴电缆连接部分。 探针卡包括第一侧和相对的第二侧，其中探针卡的第一侧包括第二同轴电缆连接部分，并且第二侧包括晶片测试探针。 同轴电缆分别将性能板的第一同轴电缆连接部分电连接到探针卡的第二同轴电缆连接部分。

    Semiconductor memory device
    9.
    发明授权
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号：US08130577B2

    公开(公告)日：2012-03-06

    申请号：US12590417

    申请日：2009-11-06

    申请人： Jong-Hak Won ,  Young-Soo An ,  Jung-Hyeon Kim

    发明人： Jong-Hak Won ,  Young-Soo An ,  Jung-Hyeon Kim

    IPC分类号： G11C8/00

    CPC分类号： G11C7/08 ,  G11C5/025 ,  G11C7/1012 ,  G11C7/12 ,  G11C2207/002

    摘要： A semiconductor memory device includes a sub memory cell array region having memory cells each connected between word lines extending in a first direction and bit lines extending in a second direction that is orthogonal to the first direction of extension of the word lines and a sub word line driver region disposed at a side of the sub memory cell array region in the first direction and including sub word line drivers that activate the word lines. A sensing region is disposed at a side of the sub memory cell array region in the second direction and including an equalizer that precharges the bit line in response to a signal transferred through a drive signal line and at least one first control signal driver that activates an inverted control signal line in response to a signal transferred through a control signal line. A conjunction region disposed at an intersection between the sub word line driver region and the sensing region, in which the inverted control signal line is connected to the drive signal line.

    摘要翻译： 半导体存储器件包括具有存储单元的子存储单元阵列区域，每个存储单元分别连接在沿第一方向延伸的字线和沿着与字线的第一延伸方向正交的第二方向延伸的位线和一个子字线 驱动器区域，设置在副存储单元阵列区域的第一方向的一侧，并且包括激活字线的子字线驱动器。 感测区域设置在副存储单元阵列区域的第二方向的一侧，并且包括响应于通过驱动信号线传送的信号而对位线进行预充电的均衡器，以及至少一个第一控制信号驱动器，其激活 响应于通过控制信号线传送的信号的反相控制信号线。 配置在副字线驱动器区域和感测区域之间的交叉点处的连接区域，其中反相控制信号线连接到驱动信号线。

    Probe card for test of semiconductor chips and method for test of semiconductor chips using the same
    10.
    发明申请
    Probe card for test of semiconductor chips and method for test of semiconductor chips using the same 审中-公开
    用于半导体芯片测试的探针卡和使用其的半导体芯片的测试方法

    公开(公告)号：US20080164898A1

    公开(公告)日：2008-07-10

    申请号：US12005888

    申请日：2007-12-28

    申请人： Sung-Hoon Bae ,  Jung-Hyeon Kim ,  Young-Soo An ,  Ho-Jeong Choi ,  Myoung-Sub Kim

    发明人： Sung-Hoon Bae ,  Jung-Hyeon Kim ,  Young-Soo An ,  Ho-Jeong Choi ,  Myoung-Sub Kim

    IPC分类号： G01R31/02

    CPC分类号： G01R1/07385 ,  G01R1/07342

    摘要： There are provided a probe card for test of semiconductor chips and a method for testing semiconductor chips using the probe card. In implementing the probe card for electrically testing semiconductor chips, the probe blocks corresponding to multiple selected ones of the semiconductor chips on the wafer can be selected so that the selected semiconductor chips are EDS tested in a one-step process. As the selected semiconductor chips are EDS tested in a one-step process, equipment efficiency is improved, and statistical objectivity of data indicating characteristics of the wafer can be achieved.

    摘要翻译： 提供了用于半导体芯片测试的探针卡和使用探针卡测试半导体芯片的方法。 在实现用于电测试半导体芯片的探针卡时，可以选择对应于晶片上的多个选定的半导体芯片的探针块，使得所选择的半导体芯片在一步法中进行EDS测试。 由于所选择的半导体芯片在一步法中进行了EDS测试，所以提高了设备​​效率，并且可以实现表示晶片特性的数据的统计客观性。