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21 条记录 (耗时 0.025 秒)

    Method of measuring dielectric constant of PCB for RIMM
    1.
    发明授权
    Method of measuring dielectric constant of PCB for RIMM 失效
    测量RIMM PCB的介电常数的方法

    公开(公告)号：US06882161B2

    公开(公告)日：2005-04-19

    申请号：US10447348

    申请日：2003-05-28

    申请人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Dek-Gin Yang ,  Young-Sang Cho ,  Dong-Hwan Lee

    发明人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Dek-Gin Yang ,  Young-Sang Cho ,  Dong-Hwan Lee

    IPC分类号： G01R31/12 ,  G01R27/06 ,  G01R31/08 ,  G01R31/11 ,  G01R37/02

    CPC分类号： G01R27/06

    摘要： Disclosed herein is a method of measuring a dielectric constant of a Printed Circuit Board (PCB) for a Rambus Inline Memory Module (RIMM), which includes the steps of measuring a length of a Rambus product of a PCB, applying an input waveform to the Rambus product at a certain probing position and obtaining a cross point of rising times of the input waveform and an output waveform generated by reflection of the input waveform, obtaining time corresponding to the cross point, and calculating a dielectric constant by substituting the measured length of the Rambus product and the obtained time for corresponding variables of a dielectric constant calculating equation.

    摘要翻译： 本文公开了一种测量Rambus在线存储器模块（RIMM）的印刷电路板（PCB）的介电常数的方法，其包括以下步骤：测量PCB的Rambus积的长度，将输入波形应用于 Rambus产品在一定的探测位置，并获得输入波形的上升时间的交叉点和通过输入波形的反射产生的输出波形，获得与交叉点相对应的时间，并且通过将测量的长度 Rambus乘积和相应变量的获得时间的介电常数计算方程。

    Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board
    2.
    发明授权
    Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board 失效
    多层印刷电路板和多层印刷电路板层之间耦合光信号的方法

    公开(公告)号：US06839476B2

    公开(公告)日：2005-01-04

    申请号：US10417357

    申请日：2003-04-16

    申请人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Dek-Gin Yang ,  Young-Sang Cho ,  Kyu-Hyok Yim

    发明人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Dek-Gin Yang ,  Young-Sang Cho ,  Kyu-Hyok Yim

    IPC分类号： G02B6/42 ,  G02B6/43 ,  G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/122 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652

    摘要： Disclosed herein is an optical signal coupling block, and a multi-layer printed circuit board and the method for coupling optical signals between layers of a multi-layer printed circuit board (PCB) using optical signal coupling blocks. The optical signals between the layers are coupled through the steps of forming a plurality of optical via holes in the multi-layer PCB to which optical waveguides for transmitting optical signals are attached; inserting the optical signal coupling blocks into the plural optical via holes such that the optical signal coupling blocks are connected to the optical waveguides to transmit the optical signals; forming at least one connection part to couple optical signals between the optical waveguides and the optical signal coupling blocks; and interconnecting the optical waveguides and the optical signal coupling blocks by aligning positions of the optical waveguides and the optical signal coupling blocks.

    摘要翻译： 本文公开了一种光信号耦合块和多层印刷电路板以及使用光信号耦合块在多层印刷电路板（PCB）的层之间耦合光信号的方法。 层之间的光信号通过在多层PCB中形成多个光通孔的步骤耦合，多层PCB中连接有用于传输光信号的光波导; 将光信号耦合块插入到多个光通孔中，使得光信号耦合块连接到光波导以传输光信号; 形成至少一个连接部分以在所述光波导和所述光信号耦合块之间耦合光信号; 以及通过对准光波导和光信号耦合块的位置来互连光波导和光信号耦合块。

    Optical printed circuit board for long-distance signal transmission
    3.
    发明授权
    Optical printed circuit board for long-distance signal transmission 失效
    光电印刷电路板用于长距离信号传输

    公开(公告)号：US07197202B2

    公开(公告)日：2007-03-27

    申请号：US10610818

    申请日：2003-07-02

    申请人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    发明人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    IPC分类号： G02B6/12

    CPC分类号： G02B6/43 ,  H05K1/0274

    摘要： Disclosed is an optical printed circuit board (PCB) for long-distance signal transmission, which is combined with fiber blocks and pipe blocks embedded in opto-via holes to form a multi-layered optical PCB, and transmits an optical signal using a fiber ribbon when an optical signal transmission distance between layers constituting the multi-layered optical PCB is longer than a length of an optical waveguide element used in conjunction with a silicon substrate. The optical PCB comprises a base substrate including an insulating material, a copper foil, and an opto-via hole, and an optical signal transmission member attached to the base substrate to horizontally transmit an optical signal. An optical signal connection member is horizontally connected to the optical signal transmission member to transmit the optical signal across a desired distance. Therefore, an optical PCB of the present invention is advantageous in that an optical waveguide, a pipe block, and a fiber block are horizontally and optionally arranged and attached to each other, thereby transmitting an optical signal across a longer distance than a length of a silicone substrate.

    摘要翻译： 公开了一种用于长距离信号传输的光学印刷电路板（PCB），其与嵌入光通孔中的光纤块和管块组合以形成多层光学PCB，并且使用光纤带传输光信号 当构成多层光学PCB的层之间的光信号传输距离长于与硅衬底结合使用的光波导元件的长度时。 该光学PCB包括一个包括一个绝缘材料，一个铜箔和一个光通孔的基底基板，以及一个光信号传输部件，安装在基板上以水平传输一个光信号。 光信号连接构件水平地连接到光信号传输构件，以在期望的距离上传输光信号。 因此，本发明的光学PCB的优点在于，光波导，管道块和光纤块水平地并且可选地布置和附接到彼此，从而将光信号跨过比 硅胶基材。

    Multi-layer PCB and method for coupling block type multichannel optical signals
    4.
    发明授权
    Multi-layer PCB and method for coupling block type multichannel optical signals 失效
    多层PCB和耦合块式多通道光信号的方法

    公开(公告)号：US06978058B2

    公开(公告)日：2005-12-20

    申请号：US10414921

    申请日：2003-04-16

    申请人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Dek-Gin Yang ,  Young-Sang Cho ,  Kyu-Hyok Yim

    发明人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Dek-Gin Yang ,  Young-Sang Cho ,  Kyu-Hyok Yim

    IPC分类号： H05K3/46 ,  G02B6/36 ,  G02B6/43 ,  G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/3652 ,  G02B6/3676 ,  G02B6/3688 ,  G02B6/3692

    摘要： The present invention discloses a multi-layer Printed Circuit Board (PCB) and method for coupling block type multichannel optical signals, the method including the steps of i) forming one or more first optical via holes to allow one or more first optical signal coupling blocks to be inserted therein, ii) aligning a first optical waveguide and the first optical signal coupling blocks so that the first optical waveguide is interconnected to the first optical signal coupling blocks via an optical signal, iii) attaching a first fixing guide to a base board to fasten the first optical signal coupling blocks, iv) removing the first fixing guide and forming one or more second optical via holes to allow one or more second optical signal coupling blocks to be inserted therein, and v) repeatedly performing steps i) to iv) as many times as a number of layers of the multi-layer PCB.

    摘要翻译： 本发明公开了一种用于耦合块型多通道光信号的多层印刷电路板（PCB）和方法，该方法包括以下步骤：i）形成一个或多个第一光通孔，以允许一个或多个第一光信号耦合块 插入其中，ii）对准第一光波导和第一光信号耦合块，使得第一光波导经由光信号互连到第一光信号耦合块，iii）将第一固定引导件附接到基板 固定第一光信号耦合块，iv）去除第一固定引导件并形成一个或多个第二光通孔，以允许一个或多个第二光信号耦合块插入其中，以及v）重复执行步骤i）至iv ）多层多层PCB的层数。

    Method of fabricating multi-layered printed circuit board for optical waveguides
    5.
    发明授权
    Method of fabricating multi-layered printed circuit board for optical waveguides 有权
    制造光波导多层印刷电路板的方法

    公开(公告)号：US07046870B2

    公开(公告)日：2006-05-16

    申请号：US10610820

    申请日：2003-07-02

    申请人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    发明人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    IPC分类号： G02B6/12 ,  G02B6/13

    CPC分类号： G02B6/43 ,  G02B6/3608 ,  G02B6/4201 ,  G02B6/4214 ,  G02B6/428 ,  H05K1/0274 ,  H05K3/4611 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T156/1064

    摘要： Disclosed is a method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method comprises pre-routing a portion of an adhesive meeting the optical waveguide to remove said portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad.

    摘要翻译： 公开了一种制造多层PCB的方法，其中将光波导部件插入到PCB中，使得预浸胶粘合剂不阻挡光波导的光信号入口。 该方法包括预先路由满足光波导的粘合剂部分以去除所述部分，处理粘合剂防止漏水层，以防止粘合剂阻挡光波导的光信号入口，布置光波导，粘合剂 和覆铜层压板上的粘合剂防止层，并将光波导，预浸料和粘合剂防止层彼此组合成单一结构。 粘合防止层选自预浸料，单面覆铜层压板，热固化树脂，散热器和未包覆层。

    Method of fabricating multi-layered printed circuit board for optical waveguides
    6.
    发明申请
    Method of fabricating multi-layered printed circuit board for optical waveguides 失效
    制造光波导多层印刷电路板的方法

    公开(公告)号：US20060182385A1

    公开(公告)日：2006-08-17

    申请号：US11401915

    申请日：2006-04-12

    申请人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    发明人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    IPC分类号： G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/3608 ,  G02B6/4201 ,  G02B6/4214 ,  G02B6/428 ,  H05K1/0274 ,  H05K3/4611 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T156/1064

    摘要： Disclosed is a method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method comprises pre-routing a portion of an adhesive meeting the optical waveguide to remove said portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad. Therefore, the method is advantageous in that the prepreg and the adhesive weeping prevention layer are pre-routed to prevent epoxy resin from blocking the optical signal entrance of the optical waveguide, thereby facilitating precise interfacing of optical signals.

    摘要翻译： 公开了一种制造多层PCB的方法，其中将光波导部件插入到PCB中，使得预浸胶粘合剂不阻挡光波导的光信号入口。 该方法包括预先路由满足光波导的粘合剂部分以去除所述部分，处理粘合剂防止漏水层，以防止粘合剂阻挡光波导的光信号入口，布置光波导，粘合剂 和覆铜层压板上的粘合剂防止层，并将光波导，预浸料和粘合剂防止层彼此组合成单一结构。 粘合防止层选自预浸料，单面覆铜层压板，热固化树脂，散热器和未包覆层。 因此，该方法的优点在于预浸布和粘合剂防止漏水层被预先布线以防止环氧树脂阻挡光波导的光信号入口，从而有助于光信号的精确接口。

    Printed circuit board with opto-via holes and process of forming the opto-via holes
    9.
    发明授权
    Printed circuit board with opto-via holes and process of forming the opto-via holes 失效
    具有光通孔的印刷电路板和形成光通孔的工艺

    公开(公告)号：US06996305B2

    公开(公告)日：2006-02-07

    申请号：US10625550

    申请日：2003-07-24

    申请人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    发明人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    IPC分类号： G02B6/26 ,  G02B6/42 ,  G02B6/12

    CPC分类号： G02B6/43 ,  H05K1/0274 ,  H05K3/429 ,  H05K3/4623

    摘要： Disclosed is a printed circuit board with opto-via holes for transmitting an optical signal to an optical waveguide in the PCB, and a process of forming the opto-via holes. The process comprises forming a plurality of via holes on a plurality of copper clad laminates using a drill, plating an inner wall of each via hole, exposing and etching the plated portions of an upper and lower side of each copper clad laminate to form a circuit pattern on the upper and lower side of the copper clad laminate, layering the patterned copper clad laminates on each other using an insulating resin adhesive, and removing the insulating resin adhesive in the predetermined via holes to form opto-via holes. Therefore, the process is advantageous in that the optical signal is stably transmitted to the optical waveguide in the PCB without damage to the optical waveguide directly exposed to an external environment, and the optical waveguide suitable to physical properties of the material constituting the PCB is easily inserted between the inner layer and the outer layer.

    摘要翻译： 公开了一种具有用于将光信号传输到PCB中的光波导的光通孔的印刷电路板以及形成光通孔的工艺。 该方法包括使用钻头在多个覆铜层压板上形成多个通孔，电镀每个通孔的内壁，暴露和蚀刻每个覆铜层压板的上侧和下侧的电镀部分，以形成电路 在覆铜层压板的上下侧形成图案，使用绝缘树脂粘合剂将图案化的铜包覆层压体层叠，并且除去预定通孔中的绝缘树脂粘合剂以形成光通孔。 因此，该方法的优点在于，光信号稳定地传输到PCB中的光波导而不损害直接暴露于外部环境的光波导，并且适合于构成PCB的材料的物理性质的光波导容易 插入在内层和外层之间。