公开(公告)号：US20110267814A1

公开(公告)日：2011-11-03

申请号：US13099972

申请日：2011-05-03

申请人： Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Yong-jin Lee

发明人： Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Yong-jin Lee

IPC分类号： F21V11/00

CPC分类号： F21V23/06 ,  F21K9/275 ,  F21V29/507 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.

摘要翻译： 一种照明装置，包括：光源单元，包括至少一个光源模块，所述至少一个光源模块包括多个发光器件芯片和引导框架，所述引线框架安装有所述发光器件芯片，并且连接所安装的发光器件芯片; 扩散盖，其具有容纳光源模块的内部空间和从光源模块发射的光; 以及与扩散罩相邻形成的安装部，以安装光源模块。

公开(公告)号：US20110260646A1

公开(公告)日：2011-10-27

申请号：US13092468

申请日：2011-04-22

申请人： Kyung-mi MOON ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Young-jin Lee

发明人： Kyung-mi MOON ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Young-jin Lee

IPC分类号： H05B37/02 ,  F21L4/02 ,  H01L33/08

CPC分类号： H01L25/075 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

摘要： Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.

摘要翻译： 用于发光器件封装的引线框架，发光器件封装以及采用发光器件封装的照明设备。 所述引线框架包括多个安装部分，所述多个安装部分安装有多个发光器件芯片; 用于电路连接多个发光器件芯片的多个连接部分; 从所述多个连接部分延伸的端子部分。 发光器件封装通过将多个发光器件芯片直接安装在引线框架上并将安装的发光器件芯片封装在引线框架上而形成。 引线框架包括用于电路连接多个发光器件芯片的多个连接部分和其一部分电路暴露的端子部分。

公开(公告)号：US08638037B2

公开(公告)日：2014-01-28

申请号：US13092468

申请日：2011-04-22

申请人： Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Young-jin Lee

发明人： Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Young-jin Lee

IPC分类号： H05B37/00 ,  H05B39/00 ,  H05B41/00

CPC分类号： H01L25/075 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

摘要： Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.

摘要翻译： 用于发光器件封装的引线框架，发光器件封装以及采用发光器件封装的照明设备。 所述引线框架包括多个安装部分，所述多个安装部分安装有多个发光器件芯片; 用于电路连接多个发光器件芯片的多个连接部分; 从所述多个连接部分延伸的端子部分。 发光器件封装通过将多个发光器件芯片直接安装在引线框架上并将安装的发光器件芯片封装在引线框架上而形成。 引线框架包括用于电路连接多个发光器件芯片的多个连接部分和其一部分电路暴露的端子部分。

公开(公告)号：US08807786B2

公开(公告)日：2014-08-19

申请号：US13099972

申请日：2011-05-03

申请人： Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Young-jin Lee

发明人： Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Young-jin Lee

IPC分类号： F21S4/00 ,  F21K99/00 ,  F21V29/00 ,  F21V23/06

摘要： An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.

公开(公告)号：US08455889B2

公开(公告)日：2013-06-04

申请号：US13102586

申请日：2011-05-06

申请人： Young-jin Lee ,  Jeong-wook Lee ,  Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi

发明人： Young-jin Lee ,  Jeong-wook Lee ,  Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi

IPC分类号： H01L29/18

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.

摘要翻译： 一种用于芯片封装的引线框架，芯片封装，封装模块和包括芯片封装模块的照明装置。 芯片封装包括第一耦合部分和第二耦合部分，该第一耦合部分和第二耦合部分在引线框架的边缘处彼此耦合，用于在其上安装芯片，因此封装模块通过将第一耦合部分和第二耦合部分 对彼此。

公开(公告)号：US08840265B2

公开(公告)日：2014-09-23

申请号：US13099972

申请日：2011-05-03

申请人： Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Young-jin Lee

发明人： Kyung-mi Moon ,  Young-hee Song ,  Ill-heung Choi ,  Jeong-wook Lee ,  Young-jin Lee

IPC分类号： F21S4/00 ,  F21K99/00 ,  F21V29/00 ,  F21V23/06

CPC分类号： F21V23/06 ,  F21K9/275 ,  F21V29/507 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.

摘要翻译： 一种照明装置，包括：光源单元，包括至少一个光源模块，所述至少一个光源模块包括多个发光器件芯片和引导框架，所述引线框架安装有所述发光器件芯片，并且连接所安装的发光器件芯片; 扩散盖，其具有容纳光源模块的内部空间和从光源模块发射的光; 以及与扩散罩相邻形成的安装部，以安装光源模块。

公开(公告)号：US20110272716A1

公开(公告)日：2011-11-10

申请号：US13102586

申请日：2011-05-06

申请人： Young-jin LEE ,  Jeong-wook Lee ,  Kyung-mi Moon ,  Young-hee Song ,  III-heung Choi

发明人： Young-jin LEE ,  Jeong-wook Lee ,  Kyung-mi Moon ,  Young-hee Song ,  III-heung Choi

IPC分类号： H01L33/62 ,  H01L23/495

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.

摘要翻译： 一种用于芯片封装的引线框架，芯片封装，封装模块和包括芯片封装模块的照明装置。 芯片封装包括第一耦合部分和第二耦合部分，该第一耦合部分和第二耦合部分在引线框架的边缘处彼此耦合，用于在其上安装芯片，因此封装模块通过将第一耦合部分和第二耦合部分 对彼此。

公开(公告)号：US20120181555A1

公开(公告)日：2012-07-19

申请号：US13344255

申请日：2012-01-05

申请人： Cheol-jun Yoo ,  Young-hee Song ,  Seong-deok Hwang ,  Sang-hyun Lee

发明人： Cheol-jun Yoo ,  Young-hee Song ,  Seong-deok Hwang ,  Sang-hyun Lee

IPC分类号： H01L33/62 ,  H01L33/52 ,  H01L33/44

CPC分类号： H01L33/486 ,  H01L24/73 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.

摘要翻译： 可以使用后成型制造并具有改善的散热性能和光学质量的发光器件封装以及制造发光器件封装的方法。 发光器件封装包括：散热垫; 形成在所述散热垫上的发光装置; 一对引线框架，设置成在发光装置和散热垫的两侧彼此间隔开; 围绕所述发光装置的除了所述发光装置的发射表面的侧面的成型构件; 以及用于将引线框架电连接到发光器件的接合线。

公开(公告)号：US08987022B2

公开(公告)日：2015-03-24

申请号：US13344255

申请日：2012-01-05

申请人： Cheol-jun Yoo ,  Young-hee Song ,  Seong-deok Hwang ,  Sang-hyun Lee

发明人： Cheol-jun Yoo ,  Young-hee Song ,  Seong-deok Hwang ,  Sang-hyun Lee

IPC分类号： H01L21/00 ,  H01L33/48 ,  H01L33/64 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L24/73 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.

摘要翻译： 可以使用后成型制造并具有改善的散热性能和光学质量的发光器件封装以及制造发光器件封装的方法。 发光器件封装包括：散热垫; 形成在所述散热垫上的发光装置; 一对引线框架，设置成在发光装置和散热垫的两侧彼此间隔开; 围绕所述发光装置的除了所述发光装置的发射表面的侧面的成型构件; 以及用于将引线框架电连接到发光器件的接合线。

公开(公告)号：US08860069B2

公开(公告)日：2014-10-14

申请号：US13365882

申请日：2012-02-03

申请人： Cheol-jun Yoo ,  Young-hee Song

发明人： Cheol-jun Yoo ,  Young-hee Song

IPC分类号： H01L33/00 ,  H01L33/48 ,  H01L33/60

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2933/005 ,  H01L2924/00014

摘要： A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame.

摘要翻译： 一种发光器件封装。 发光器件封装包括引线框架，该引线框架包括多个单独的引线; 模制构件，其固定所述多个引线并且包括暴露所述引线框架的开口部; 以及发光器件芯片，其安装在所述引线框架中的所述开口部分中并且通过所述发光器件芯片的上表面部分发射光，其中所述模制构件的高度低于所述发光器件芯片的高度， 相对于引线框架的发光器件芯片。