公开(公告)号：US11330726B2

公开(公告)日：2022-05-10

申请号：US16935461

申请日：2020-07-22

Applicant: Yujun Chiu ,  Lavender Cheng

Inventor： Yujun Chiu ,  Lavender Cheng

IPC: H05K7/02 ,  H05K7/04 ,  H05K5/02 ,  H05K5/00

Abstract: An electronic device is provided. The electronic device includes: a panel, a first cushioning component, and a second cushioning component. The panel includes a bottom surface, a first corner and a second corner, and the bottom surface connects between the first corner and the second corner. The first cushioning component supports the first corner of the panel. The second cushioning component supports the second corner of the panel. The Young's modulus of the first cushioning component and the Young's modulus of the second cushioning component are ranged from 500 MPa to 1500 MPa.

公开(公告)号：US11561434B1

公开(公告)日：2023-01-24

申请号：US17517400

申请日：2021-11-02

Applicant: Yujun Chiu ,  Lavender Cheng ,  Maggy Hsu

Inventor： Yujun Chiu ,  Lavender Cheng ,  Maggy Hsu

IPC: G02F1/13357 ,  H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/60

Abstract: A light-emitting module is provided. The light-emitting module includes a circuit substrate and a first light-emitting element disposed on the circuit substrate. The light-emitting module also includes an optical pattern disposed on the circuit substrate and adjacent to the first light-emitting element. The light-emitting module further includes a lens covering the first light-emitting element and the optical pattern.

公开(公告)号：US11848333B2

公开(公告)日：2023-12-19

申请号：US17409960

申请日：2021-08-24

Applicant: Tony Li ,  Lavender Cheng ,  Joe Liu

Inventor： Tony Li ,  Lavender Cheng ,  Joe Liu

IPC: H01L27/12

CPC classification number: H01L27/124

Abstract: An electronic device includes a substrate, a first signal line, a second signal line, and a third signal line. The first signal line, the second signal line, and the third signal line are disposed in a peripheral region of the substrate, arranged along a first direction, and extending along a second direction. The second signal line has a line portion and an end portion. The end portion has a first end point adjacent to the first signal line and a second end point adjacent to the third signal line. In the first direction, the first distance between the first signal line and the line portion is greater than the second distance between the line portion and the third signal line, and the third distance between the first end point and the line portion is greater than the fourth distance between the second end point and the line portion.

公开(公告)号：US11784182B2

公开(公告)日：2023-10-10

申请号：US17155247

申请日：2021-01-22

Applicant: Dong-Lin Li ,  May Pan ,  Lavender Cheng

Inventor： Dong-Lin Li ,  May Pan ,  Lavender Cheng

IPC: H01L27/02 ,  H01L29/786 ,  H01L27/12

CPC classification number: H01L27/0296 ,  H01L27/124 ,  H01L27/1222 ,  H01L29/78672

Abstract: An electronic device is provided. The electronic device includes a substrate, a first wire, a first semiconductor element and a second semiconductor element. The substrate has a display region and a peripheral region adjacent to the display region. The first wire is disposed in the display region and the peripheral region. The first semiconductor element is disposed in the display region. The second semiconductor element is disposed in the peripheral region and adjacent to the first semiconductor element. The first semiconductor element and the second semiconductor element cross the first wire in two parts respectively and the two parts of the second semiconductor element is less than the two parts of the first semiconductor element in distance.

公开(公告)号：US11448812B1

公开(公告)日：2022-09-20

申请号：US17466072

申请日：2021-09-03

Applicant: Fu Kuo ,  May Pan ,  Maggy Hsu ,  Lavender Cheng

Inventor： Fu Kuo ,  May Pan ,  Maggy Hsu ,  Lavender Cheng

IPC: F21V8/00 ,  G02F1/1333 ,  G02F1/1335

Abstract: A backlight module is provided. The backlight module includes a circuit board and a plurality of light-emitting elements arranged on the circuit board along a first direction. The backlight module includes an adhesive structure disposed on the circuit board. The adhesive structure has a plurality of segmented elements separated from each other. One of the segmented elements has a first part and a second part. The second part is connected with the first part. The first part is disposed between adjacent light-emitting elements. The backlight module further includes a light guide plate disposed on the circuit board and attached to the second part. A first width is a maximum width of the first part in the first direction, a second width is a maximum width of the second part in the first direction. The second width is greater than the first width.

公开(公告)号：US11678435B2

公开(公告)日：2023-06-13

申请号：US17455653

申请日：2021-11-18

Applicant: Roger Huang ,  Joe Huang ,  Lavender Cheng ,  Sean Chang

Inventor： Roger Huang ,  Joe Huang ,  Lavender Cheng ,  Sean Chang

IPC: H05K1/02 ,  H05K1/11 ,  H01L51/00 ,  H01L23/498 ,  H05K1/18 ,  H05K1/03

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L51/0097 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/18 ,  H05K2201/0373

Abstract: An electronic device is provided and includes a wiring structure including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side and two side walls opposite to each other. The insulating layer wraps around the conductive wiring at least through the top side and two side walls, wherein there is a gap between the insulating layer and at least one of the two side walls. The conductive wiring includes a first layer, a second layer and a third layer, the second layer is disposed between the first layer and the third layer, and the first layer is disposed between the second layer and the substrate. A thickness of the second layer is greater than a thickness of the first layer, and the thickness of the second layer is greater than a thickness of the third layer.

公开(公告)号：US11500248B2

公开(公告)日：2022-11-15

申请号：US16944149

申请日：2020-07-31

Applicant: Fiona Jhan ,  Lavender Cheng

Inventor： Fiona Jhan ,  Lavender Cheng

IPC: H05K1/14 ,  G02F1/1339 ,  G02F1/1343 ,  H05K1/02

Abstract: A sealing structure is provided. The sealing structure includes two substrates opposite each other, each of which has a sealing region on its periphery. The sealing structure further includes a recess structure having at least one recess in the sealing region of at least one of the two substrates. The sealing structure further includes a sealing material with filler particles, which is disposed along the sealing regions to seal the two substrates, wherein a portion of the filler particles are accommodated in the at least one recess.

公开(公告)号：US11715742B2

公开(公告)日：2023-08-01

申请号：US17095588

申请日：2020-11-11

Applicant: Luca Hung ,  Lavender Cheng

Inventor： Luca Hung ,  Lavender Cheng

IPC: G02F1/1362 ,  H01L27/12 ,  G02F1/1339 ,  H01Q1/38 ,  G02F1/1368 ,  H10K59/131

CPC classification number: H01L27/124 ,  G02F1/1339 ,  G02F1/1368 ,  G02F1/136286 ,  H01Q1/38 ,  G02F2202/28 ,  H10K59/1315

Abstract: A wiring structure and an electronic device including the wiring structure are provided. The wiring structure includes a plurality of wires, and each of the wires has a first portion and a second portion. The first portion and the second portion respectively have a first width W1 and a second width W2. The second width W2 is different from the first width W1. In addition, at least one of the wires satisfies an equation as follows:





0
≦


❘
"\[LeftBracketingBar]"



AR
⁢
2

-

AR
⁢
1



❘
"\[RightBracketingBar]"

公开(公告)号：US11206734B1

公开(公告)日：2021-12-21

申请号：US16896100

申请日：2020-06-08

Applicant: Roger Huang ,  Joe Huang ,  Lavender Cheng ,  Sean Chang

Inventor： Roger Huang ,  Joe Huang ,  Lavender Cheng ,  Sean Chang

IPC: H05K1/02 ,  H05K1/11 ,  H01L51/00 ,  H01L23/498 ,  H05K1/18

Abstract: A wiring structure is provided, including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side, a bottom side and two side walls opposite to each other. The insulating layer which wraps around the conductive wiring at least through the top side and two side walls, wherein there is a gap between the insulating layer and at least one of the two side walls.