Surface acoustic wave filter
    1.
    发明授权
    Surface acoustic wave filter 有权
    表面声波滤波器

    公开(公告)号:US06310422B1

    公开(公告)日:2001-10-30

    申请号:US09423772

    申请日:2000-02-28

    IPC分类号: H03H925

    摘要: The present invention relates to a surface acoustic wave filter used in frequency filter of portable telephone and other mobile communication device, and is intended to realize a surface acoustic wave filter capable of obtaining a stable filter characteristic even in the event of input of a large signal. The invention includes resonators (5) to (8) formed on a piezoelectric substrate (3), through-holes (12) provided near the resonators (5) to (8), and a conductive material (13) filling up the through-holes (12), in which the through-holes (12) filled up with the conductive material (13) are electrically grounded. In this constitution, by the through-holes (12) provided near the resonators (5) to (8) and filled up with the conductive material (13), the heat generated in the resonators (5) to (8) when a large signal is applied to the input terminal (1) can be released, so that a stable filter characteristic may be maintained if a large signal is applied.

    摘要翻译: 本发明涉及一种用于便携式电话和其他移动通信装置的频率滤波器中的表面声波滤波器,旨在实现即使在输入大信号的情况下也能够获得稳定的滤波特性的表面声波滤波器 。 本发明包括形成在压电基板(3)上的谐振器(5)至(8),设置在谐振器(5)至(8)附近的通孔(12)和填充通孔的导电材料(13) 其中填充有导电材料(13)的通孔(12)被电接地的孔(12)。 在这种结构中,通过设置在谐振器(5)至(8)附近并填充有导电材料(13)的通孔(12),当大的谐振器(5)至(8)中产生的热量 施加到输入端子(1)的信号可以被释放,使得如果施加大信号,则可以保持稳定的滤波器特性。

    Surface acoustic wave device and production method thereof and mobile communication equipment using it
    2.
    发明授权
    Surface acoustic wave device and production method thereof and mobile communication equipment using it 有权
    声表面波装置及其制作方法及其使用的移动通信设备

    公开(公告)号:US06297580B1

    公开(公告)日:2001-10-02

    申请号:US09446247

    申请日:2000-03-28

    IPC分类号: H01L4104

    摘要: As the electrode material of a surface acoustic wave device, a laminated body laminating a second metal layer 5 on a first metal layer 4 is stacked up in two or more stages, and the first metal layer 4 is a metal of which coefficient of diffusion to Al is smaller than the coefficient of self diffusion of Al, and the second metal layer 5 is composed of an Al alloy of three elements or more containing at least one or more metals which forms solid solution with Al at ordinary temperature, and at least one or more metals forming segregation at the grain boundary of Al or an intermetallic compound with Al at ordinary temperature, and therefore the surface acoustic wave device excellent in electric power tolerance, compatible with the conventional pattern forming technology, stable thermally, and capable of preventing increase of insertion loss can be obtained.

    摘要翻译: 作为表面声波装置的电极材料,在第一金属层4上层叠第二金属层5的层叠体以两级以上的层叠形成,第一金属层4为扩散系数为 Al小于Al的自扩散系数,第二金属层5由含有至少一种以上在常温下与Al形成固溶体的金属的三种以上的Al合金构成,至少一种 或更多的金属在常温下在Al的晶界处形成偏析或与Al的金属间化合物,因此具有优异的电力公差的表面声波装置,与常规图案形成技术相容,热稳定并且能够防止增加 的插入损失。

    Electronic component package
    3.
    发明授权
    Electronic component package 有权
    电子元件包装

    公开(公告)号:US07652214B2

    公开(公告)日:2010-01-26

    申请号:US11575809

    申请日:2006-10-30

    IPC分类号: H01L23/48

    摘要: In an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities.

    摘要翻译: 在其中通过设置在安装基板上的外部电极安装在安装基板上的电子部件被模制树脂覆盖的电子部件封装中,电子部件具有覆盖部件基板的下表面上的元件的部件盖, 并且形成空腔,并且具有比模制树脂低的弹性模量的保护构件设置在不包括与组件盖的下表面中的外部电极接合的部分并且与空腔相对的部分中。

    Surface acoustic wave device and method for manufacturing the same
    4.
    发明授权
    Surface acoustic wave device and method for manufacturing the same 有权
    表面声波装置及其制造方法

    公开(公告)号:US07982364B2

    公开(公告)日:2011-07-19

    申请号:US11887589

    申请日:2006-03-30

    IPC分类号: H03H9/125

    CPC分类号: H03H9/1092 Y10T29/42

    摘要: A surface acoustic wave device includes a piezoelectric substrate and a lid spaced apart from each other oppositely by a specific interval. A comb electrode and a pad electrode are provided to the piezoelectric substrate on a main surface on the lid side, and an external terminal is provided to the lid on a surface on the opposite side to the piezoelectric substrate. Further, the surface acoustic wave device includes a connection electrode that electrically connects the pad electrode and the external terminal, and an insulator interposed between at least one of the main surface of the piezoelectric substrate and the pad electrode and the lid.

    摘要翻译: 表面声波装置包括压电基板和彼此相对间隔一定间隔的盖。 在盖侧的主表面上的压电基板上设置梳状电极和焊盘电极,在与压电基板相反的一侧的表面上设置有外部端子。 此外,表面声波装置包括:电连接焊盘电极和外部端子的连接电极和插入在压电基板的主表面和焊盘电极和盖中的至少一个之间的绝缘体。

    ELECTRONIC COMPONENT PACKAGE
    5.
    发明申请
    ELECTRONIC COMPONENT PACKAGE 有权
    电子元件包装

    公开(公告)号:US20090194325A1

    公开(公告)日:2009-08-06

    申请号:US11575809

    申请日:2006-10-30

    IPC分类号: H01L23/28

    摘要: The strength of an electronic component package against an external pressure is improved. According to the invention, in order to realize this, in an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities.

    摘要翻译: 电子元件封装相对于外部压力的强度提高。 根据本发明,为了实现这一点,在其中通过设置在安装基板上的外部电极安装在安装基板上的电子部件被模制树脂覆盖的电子部件封装中,电子部件具有覆盖 放置在部件基板的下表面上并且形成空腔的元件和弹性模量低于模制树脂的保护构件设置在不包括与部件的下表面中的外部电极接合的部分的部分中 盖,并且与腔相对。

    Surface Acoustic Wave Device and Method for Manufacturing the Same
    6.
    发明申请
    Surface Acoustic Wave Device and Method for Manufacturing the Same 有权
    表面声波装置及其制造方法

    公开(公告)号:US20090051245A1

    公开(公告)日:2009-02-26

    申请号:US11887589

    申请日:2006-03-30

    IPC分类号: H01L41/053 H01L41/22

    CPC分类号: H03H9/1092 Y10T29/42

    摘要: A surface acoustic wave device includes a piezoelectric substrate and a lid spaced apart from each other oppositely by a specific interval. A comb electrode and a pad electrode are provided to the piezoelectric substrate on a main surface on the lid side, and an external terminal is provided to the lid on a surface on the opposite side to the piezoelectric substrate. Further, the surface acoustic wave device includes a connection electrode that electrically connects the pad electrode and the external terminal, and an insulator interposed between at least one of the main surface of the piezoelectric substrate and the pad electrode and the lid.

    摘要翻译: 表面声波装置包括压电基板和彼此相对间隔一定间隔的盖。 在盖侧的主表面上的压电基板上设置梳状电极和焊盘电极,在与压电基板相反的一侧的表面上设置有外部端子。 此外,表面声波装置包括:电连接焊盘电极和外部端子的连接电极和插入在压电基板的主表面和焊盘电极和盖中的至少一个之间的绝缘体。

    ELASTIC WAVE DEVICE
    9.
    发明申请
    ELASTIC WAVE DEVICE 有权
    弹性波装置

    公开(公告)号:US20120280768A1

    公开(公告)日:2012-11-08

    申请号:US13521239

    申请日:2011-12-14

    IPC分类号: H03H9/25

    摘要: An elastic wave device includes a piezoelectric substrate, an IDT electrode disposed on the piezoelectric substrate, a wiring electrode disposed on the piezoelectric substrate and connected to the IDT electrode, a first insulator disposed on the piezoelectric substrate to seal the IDT electrode and the wiring electrode, a resin layer provided on the first insulator, an inductor electrode disposed on the resin layer, a second insulator disposed on the resin layer to cover the inductor electrode, a terminal electrode disposed on the second insulator, and a connecting electrode passing through the first insulator, the second insulator, and the resin layer to electrically connect the wiring electrode, the terminal electrode, and the inductor electrode. The first insulator includes a resin and filler dispersed in the resin. A density of filler in the resin layer is smaller than an average density of the filler in the first insulator. This elastic wave device has excellent characteristics of the inductor while reducing variations of the characteristics.

    摘要翻译: 弹性波装置包括压电基片,设置在压电基片上的IDT电极,布置在压电基片上并与IDT电极连接的布线电极,设置在压电基片上以密封IDT电极和布线电极的第一绝缘体 设置在第一绝缘体上的树脂层,设置在树脂层上的电感器电极,设置在树脂层上以覆盖电感器电极的第二绝缘体,设置在第二绝缘体上的端子电极和穿过第一绝缘体的连接电极 绝缘体,第二绝缘体和树脂层,以电连接布线电极,端子电极和电感器电极。 第一绝缘体包括分散在树脂中的树脂和填料。 树脂层中填料的密度小于第一绝缘体中填料的平均密度。 该弹性波器件具有优异的电感特性,同时降低了特性的变化。