摘要:
The present invention relates to a surface acoustic wave filter used in frequency filter of portable telephone and other mobile communication device, and is intended to realize a surface acoustic wave filter capable of obtaining a stable filter characteristic even in the event of input of a large signal. The invention includes resonators (5) to (8) formed on a piezoelectric substrate (3), through-holes (12) provided near the resonators (5) to (8), and a conductive material (13) filling up the through-holes (12), in which the through-holes (12) filled up with the conductive material (13) are electrically grounded. In this constitution, by the through-holes (12) provided near the resonators (5) to (8) and filled up with the conductive material (13), the heat generated in the resonators (5) to (8) when a large signal is applied to the input terminal (1) can be released, so that a stable filter characteristic may be maintained if a large signal is applied.
摘要:
As the electrode material of a surface acoustic wave device, a laminated body laminating a second metal layer 5 on a first metal layer 4 is stacked up in two or more stages, and the first metal layer 4 is a metal of which coefficient of diffusion to Al is smaller than the coefficient of self diffusion of Al, and the second metal layer 5 is composed of an Al alloy of three elements or more containing at least one or more metals which forms solid solution with Al at ordinary temperature, and at least one or more metals forming segregation at the grain boundary of Al or an intermetallic compound with Al at ordinary temperature, and therefore the surface acoustic wave device excellent in electric power tolerance, compatible with the conventional pattern forming technology, stable thermally, and capable of preventing increase of insertion loss can be obtained.
摘要:
In an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities.
摘要:
A surface acoustic wave device includes a piezoelectric substrate and a lid spaced apart from each other oppositely by a specific interval. A comb electrode and a pad electrode are provided to the piezoelectric substrate on a main surface on the lid side, and an external terminal is provided to the lid on a surface on the opposite side to the piezoelectric substrate. Further, the surface acoustic wave device includes a connection electrode that electrically connects the pad electrode and the external terminal, and an insulator interposed between at least one of the main surface of the piezoelectric substrate and the pad electrode and the lid.
摘要:
The strength of an electronic component package against an external pressure is improved. According to the invention, in order to realize this, in an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities.
摘要:
A surface acoustic wave device includes a piezoelectric substrate and a lid spaced apart from each other oppositely by a specific interval. A comb electrode and a pad electrode are provided to the piezoelectric substrate on a main surface on the lid side, and an external terminal is provided to the lid on a surface on the opposite side to the piezoelectric substrate. Further, the surface acoustic wave device includes a connection electrode that electrically connects the pad electrode and the external terminal, and an insulator interposed between at least one of the main surface of the piezoelectric substrate and the pad electrode and the lid.
摘要:
An actuator includes a base, an arm having an elastic property and supported by the base, electrostatic-driving electrodes provided on the base and the arm, respectively, and a piezoelectric-driving layer. The piezoelectric-driving layer includes a first electrode layer on the arm, a piezoelectric layer on the first electrode layer, and a second electrode layer on the piezoelectric layer. This actuator can be driven quickly with a low voltage.
摘要:
An actuator includes a base, an arm having an elastic property and supported by the base, electrostatic-driving electrodes provided on the base and the arm, respectively, and a piezoelectric-driving layer. The piezoelectric-driving layer includes a first electrode layer on the arm, a piezoelectric layer on the first electrode layer, and a second electrode layer on the piezoelectric layer. This actuator can be driven quickly with a low voltage.
摘要:
An elastic wave device includes a piezoelectric substrate, an IDT electrode disposed on the piezoelectric substrate, a wiring electrode disposed on the piezoelectric substrate and connected to the IDT electrode, a first insulator disposed on the piezoelectric substrate to seal the IDT electrode and the wiring electrode, a resin layer provided on the first insulator, an inductor electrode disposed on the resin layer, a second insulator disposed on the resin layer to cover the inductor electrode, a terminal electrode disposed on the second insulator, and a connecting electrode passing through the first insulator, the second insulator, and the resin layer to electrically connect the wiring electrode, the terminal electrode, and the inductor electrode. The first insulator includes a resin and filler dispersed in the resin. A density of filler in the resin layer is smaller than an average density of the filler in the first insulator. This elastic wave device has excellent characteristics of the inductor while reducing variations of the characteristics.
摘要:
Provided is a method of manufacturing surface acoustic wave (SAW) devices having a first conductive pattern and a second conductive pattern of different thicknesses on one piezoelectric substrate. Combination of a plurality of steps of forming metal films and etching steps allows accurate production of SAW devices having a plurality of electrodes of different thicknesses on one piezoelectric substrate.