摘要:
Provided is a method of manufacturing surface acoustic wave (SAW) devices having a first conductive pattern and a second conductive pattern of different thicknesses on one piezoelectric substrate. Combination of a plurality of steps of forming metal films and etching steps allows accurate production of SAW devices having a plurality of electrodes of different thicknesses on one piezoelectric substrate.
摘要:
In a surface acoustic wave device, a common portion and a strip portion of a reflector electrode are partially cut off to increase a space between the electrodes. The increase of the space between the electrodes reduces the influence of the amount of charges and the influence of an unbalance between the amounts of charges in etching of a metallic film, thereby preventing the electrodes from having a curved shape in section. Consequently, the surface acoustic wave device has a reduced propagation loss.
摘要:
A SAW element of the present invention includes a plurality of inter-digital transducer (IDT) electrodes on a piezoelectric substrate, grating reflector electrodes disposed on the sides of the IDT electrodes, and a plurality of pad electrodes led from the IDT electrodes and the grating reflector electrodes. A plurality of the pad electrodes includes isolated pad electrodes not directly opposed to the outer periphery of the SAW element, and adjacent pad electrodes directly opposed to the outer periphery thereof A connecting electrode between the isolated pad electrode and the adjacent pad electrode is removed by etching at least before dicing in order to prevent discharge from occurring due to pyroelectricity, and to prevent the electrodes from being damaged.
摘要:
A surface acoustic wave device includes a piezoelectric substrate and an electrode provided on the substrate. The electrode includes a first metal layer provided on the piezoelectric substrate and having a trapezoid shape in the cross section and a second metal layer provided over the piezoelectric substrate at the same position as the first metal layer over the piezoelectric substrate. By controlling the shape of side surfaces of the electrode, the surface acoustic wave device hardly vary in a propagation frequency.
摘要:
A SAW element of the present invention includes a plurality of inter-digital transducer (IDT) electrodes on a piezoelectric substrate, grating reflector electrodes disposed on the sides of the IDT electrodes, and a plurality of pad electrodes led from the IDT electrodes and the grating reflector electrodes. A plurality of the pad electrodes includes isolated pad electrodes not directly opposed to the outer periphery of the SAW element, and adjacent pad electrodes directly opposed to the outer periphery thereof A connecting electrode between the isolated pad electrode and the adjacent pad electrode is removed by etching at least before dicing in order to prevent discharge from occurring due to pyroelectricity, and to prevent the electrodes from being damaged.
摘要:
An elastic wave device includes a piezoelectric substrate, an IDT electrode disposed on the piezoelectric substrate, a wiring electrode disposed on the piezoelectric substrate and connected to the IDT electrode, a first insulator disposed on the piezoelectric substrate to seal the IDT electrode and the wiring electrode, a resin layer provided on the first insulator, an inductor electrode disposed on the resin layer, a second insulator disposed on the resin layer to cover the inductor electrode, a terminal electrode disposed on the second insulator, and a connecting electrode passing through the first insulator, the second insulator, and the resin layer to electrically connect the wiring electrode, the terminal electrode, and the inductor electrode. The first insulator includes a resin and filler dispersed in the resin. A density of filler in the resin layer is smaller than an average density of the filler in the first insulator. This elastic wave device has excellent characteristics of the inductor while reducing variations of the characteristics.
摘要:
In an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities.
摘要:
As the electrode material of a surface acoustic wave device, a laminated body laminating a second metal layer 5 on a first metal layer 4 is stacked up in two or more stages, and the first metal layer 4 is a metal of which coefficient of diffusion to Al is smaller than the coefficient of self diffusion of Al, and the second metal layer 5 is composed of an Al alloy of three elements or more containing at least one or more metals which forms solid solution with Al at ordinary temperature, and at least one or more metals forming segregation at the grain boundary of Al or an intermetallic compound with Al at ordinary temperature, and therefore the surface acoustic wave device excellent in electric power tolerance, compatible with the conventional pattern forming technology, stable thermally, and capable of preventing increase of insertion loss can be obtained.
摘要:
An elastic wave device includes a piezoelectric substrate, an IDT electrode disposed on the piezoelectric substrate, a wiring electrode disposed on the piezoelectric substrate and connected to the IDT electrode, a first insulator disposed on the piezoelectric substrate to seal the IDT electrode and the wiring electrode, a resin layer provided on the first insulator, an inductor electrode disposed on the resin layer, a second insulator disposed on the resin layer to cover the inductor electrode, a terminal electrode disposed on the second insulator, and a connecting electrode passing through the first insulator, the second insulator, and the resin layer to electrically connect the wiring electrode, the terminal electrode, and the inductor electrode. The first insulator includes a resin and filler dispersed in the resin. A density of filler in the resin layer is smaller than an average density of the filler in the first insulator. This elastic wave device has excellent characteristics of the inductor while reducing variations of the characteristics.
摘要:
An acoustic wave device includes a piezoelectric substrate, a first wiring disposed on an upper surface of the piezoelectric substrate, an organic insulator covering at least a portion of the first wiring, a second wiring disposed on a first portion of the upper surface of the organic insulator, and an inorganic insulator covering at least a second portion of an upper surface of the organic insulator. The second portion of the upper surface of the organic insulator faces an oscillation space across the inorganic insulator. The acoustic wave device has preferable high-frequency characteristics and high long-term reliability.