摘要:
A projection display apparatus includes an image forming section that forms an image based on image information received from an external device, and a projection lens that projects the image formed by the image forming section. The projection display apparatus includes a substrate, a plurality of light emitting elements, a first driver and a second driver. The light emitting elements are two-dimensionally arranged on the substrate. The light emitting elements include rows of light emitting elements and columns of light emitting elements such that the rows are substantially perpendicular to the columns. The first driver element selectively drives the rows. The second driver element selectively drives the columns. The plurality of light emitting elements include three groups of light emitting elements aligned either in the rows or in the columns, each group emitting light of a different wavelength from the remaining groups.
摘要:
A projection display apparatus includes an image forming section that forms an image based on image information received from an external device, and a projection lens that projects the image formed by the image forming section. The projection display apparatus includes a substrate, a plurality of light emitting elements, a first driver and a second driver. The light emitting elements are two-dimensionally arranged on the substrate. The light emitting elements include rows of light emitting elements and columns of light emitting elements such that the rows are substantially perpendicular to the columns. The first driver element selectively drives the rows. The second driver element selectively drives the columns. The plurality of light emitting elements include three groups of light emitting elements aligned either in the rows or in the columns, each group emitting light of a different wavelength from the remaining groups.
摘要:
A light-emitting-diode array is formed on a substrate having an upper layer of a semiconducting material and a lower layer of an insulating or semi-insulating material. The upper layer is divided into blocks by isolation channels that cut completely through the upper layer. The light-emitting diodes, which are formed by selective diffusion of an impurity into the upper layer, are arranged in a single row, with at least two light-emitting diodes in each block of the upper layer. Each block has a block electrode that drives the light-emitting diodes in the block. The row of light-emitting diodes is paralleled by a number of shared lines which cross the isolation channels. Each shared line is coupled to a plurality of light-emitting diodes in different blocks.
摘要:
A light-emitting diode includes a first semiconductor epitaxial layer of a first conduction type, a second semiconductor epitaxial layer of the first conduction type laminated upon the first semiconductor epitaxial layer and having an energy band gap greater than that of the first semiconductor epitaxial layer, and an area of impurities formed within the first semiconductor epitaxial layer and the second semiconductor epitaxial layer by doping impurity of a second conduction type from the side of the second semiconductor epitaxial layer. A front of the diode is located within the first semiconductor epitaxial layer.
摘要:
A light-emitting-diode array is formed on a substrate having an upper layer of a semiconducting material and a lower layer of an insulating or semi-insulating material. The upper layer is divided into blocks by isolation channels that cut completely through the upper layer. The light-emitting diodes, which are formed by selective diffusion of an impurity into the upper layer, are arranged in a single row, with at least two light-emitting diodes in each block of the upper layer. Each block has a block electrode that drives the light-emitting diodes in the block. The row of light-emitting diodes is paralleled by a number of shared lines which cross the isolation channels. Each shared line is coupled to a plurality of light-emitting diodes in different blocks.
摘要:
A high-density semiconductor device and semiconductor device array exhibiting high light emission efficiency which can be mass-produced at low cost with high yield is provided. An LED array comprises a structure wherein an n-type GaAs buffer layer 102 is formed on an n-type GaAs substrate 101, on which are then stacked an n-type AlzGa1−zAs layer 103, an n-type AlyGa1−yAs layer 104, a semi-insulating AlxGa1−xAs layer 105, and a semi-insulating GaAs layer 106. The energy band gaps of the AlzGa1−zAs layer 103 and AlxGa1−xAs layer 105 are at least larger than the energy band gap of the AlyGa1−yAs layer 104. A pn junction is formed by selective diffusion, having a diffusion front in the semiconductor layer having the smaller energy band gap sandwiched between the semiconductor layers having the larger energy band gaps. The outermost layer forming ohmic contact is made a p-type GaAs region formed by zinc diffusion in a semi-insulating GaAs layer.
摘要翻译:提供了一种可以以低成本,高产率批量生产的高发光效率的高密度半导体器件和半导体器件阵列。 LED阵列包括其中n型GaAs缓冲层102形成在n型GaAs衬底101上的结构,然后将n型GaAs缓冲层102层叠在n型AlzGa1-zAs层103,n型AllyGa1-yAs层104 ,半绝缘Al x Ga 1-x As层105和半绝缘GaAs层106.AlzGa1-zAs层103和AlxGa1-xAs层105的能带隙至少大于Al y Ga 1-x As层105的能带隙。 通过选择性扩散形成pn结,在半导体层中具有在具有较大能带间隙的半导体层之间具有较小能带隙的扩散前沿。 形成欧姆接触的最外层是在半绝缘GaAs层中通过锌扩散形成的p型GaAs区。
摘要:
A light-sensing/emitting diode array chip has impurity diffusion regions with a depth of at least 0.5 .mu.m but not more than 2 .mu.m in a semiconductor substrate. Each impurity diffusion region is preferably divided into a first region, used for emitting or sensing light, and a wider second region, used for electrode contact. The second regions are located on alternate sides of the array line, permitting a small array pitch to be combined with a large contact area. In a wafer process for fabrication of the chips, a diffusion mask has both windows defining the impurity diffusion regions, and dicing line marks. The dicing line marks are narrowed where they pass adjacent to the windows at the ends of the chip. In the electrode fabrication step, a photomask with an enlarged pattern is used, to allow for misalignment with the diffusion mask.
摘要:
A compound semiconductor layer of a first conductivity type is formed on a substrate, and a diffusion region of a second conductivity type is formed on the compound semiconductor layer. The light-emitting diode has a high emitted light power, using a large-diameter wafer.
摘要:
An LED array is fabricated by forming an insulating film on a semiconductor substrate of a first conductive type, forming a plurality of windows in the insulating film, and diffusing an impurity of a second conductive type through these windows to create a plurality of diffusion regions. In addition, an anti-reflection coating consisting of one or more transparent dielectric thin films is formed on the diffusion regions where they are exposed in the windows. The thickness of the anti-reflection coating, or of its constituent thin films, is optimized for maximum transmission of light.
摘要:
In one aspect of the invention, a light-emitting semiconductor device has a light-emitting layer with a certain bandgap energy, an upper cladding layer with a higher bandgap energy, a first diffusion area extending into the light-emitting layer, a second diffusion area extending only into the upper cladding layer, and an electrode making contact with the second diffusion area, without covering any part of the first diffusion area. The second diffusion area conducts current to the first diffusion area, where light is emitted from a pn junction in the light-emitting layer. In another aspect of the invention, a semiconductor contact layer is provided to assure ohmic contact with the electrode, and the semiconductor contact layer is removed from the light-emitting area, avoiding absorption of light.